Abstract: A method wherein a first workpiece (2, 40) is loaded to a spindle (30) of a workpiece processing machine with the first toothed workpiece having a predetermined design and being in a predetermined rotational load position. The first toothed workpiece is stock-divided and a machining position is determined based on the stock-dividing. The first toothed workpiece is rotationally adjusted to the machining position. The teeth (3, 42) of the first toothed workpiece are then machined and the first workpiece is removed from the spindle. A second toothed workpiece is loaded to the spindle of the workpiece processing machine. The second toothed workpiece has the same predetermined design and is in the same predetermined rotational load position as the first toothed workpiece. The second toothed workpiece is rotationally adjusted from the predetermined rotational load position to the machining position by the same adjustment amount as the first toothed workpiece.

Abstract: Spectrophotometer system configured to characterize and/or measure spectrally (wavelength)-dependent properties of material components (such as molecular, viral, and/or bacterial analytes) associated with or of an object prior to the time when optical fingerprints of such material components start to degrade, and associated methods. System can be enhanced by a capability of selecting specific wavelengths of operation for such system to optimize cost-efficiency of the system.

Abstract: Spectrophotometer system configured to characterize and/or measure spectrally (wavelength)-dependent properties of material components (such as molecular, viral, and/or bacterial analytes) associated with or of an object prior to the time when optical fingerprints of such material components start to degrade, and associated methods. System can be enhanced by a capability of selecting specific wavelengths of operation for such system to optimize cost-efficiency of the system.

Abstract: A method wherein a first workpiece (2, 40) is loaded to a spindle (30) of a workpiece processing machine with the first toothed workpiece having a predetermined design and being in a predetermined rotational load position. The first toothed workpiece is stock-divided and a machining position is determined based on the stock-dividing. The first toothed workpiece is rotationally adjusted to the machining position. The teeth (3, 42) of the first toothed workpiece are then machined and the first workpiece is removed from the spindle. A second toothed workpiece is loaded to the spindle of the workpiece processing machine. The second toothed workpiece has the same predetermined design and is in the same predetermined rotational load position as the first toothed workpiece. The second toothed workpiece is rotationally adjusted from the predetermined rotational load position to the machining position by the same adjustment amount as the first toothed workpiece.

Abstract: A fall detection system includes a plurality of sensors in which at least one of the sensors is coupled to or disposed near a floor. The fall detection system further includes a central monitoring system in signal communication with the plurality of sensors. The central monitoring system is configured to receive a response signal in response to an activation signal being transmitted from at least one of the plurality of sensors, and determine whether the response signal is indicative of a person being arranged in a prone position on the floor.

Abstract: In accordance with some embodiments of the disclosed subject matter, mechanisms (which can, for example, include systems, apparatuses, methods, and media) for determining three dimensional location of an object associated with a person at risk of falling down are provided.

Abstract: A fall detection system includes a plurality of sensors in which at least one of the sensors is coupled to or disposed near a floor. The fall detection system further includes a central monitoring system in signal communication with the plurality of sensors. The central monitoring system is configured to receive a response signal in response to an activation signal being transmitted from at least one of the plurality of sensors, and determine whether the response signal is indicative of a person being arranged in a prone position on the floor.

Abstract: An apparatus and method is provided for loading objects having a first degree of hardness onto a tray having a different degree of hardness where sliding contact between the objects and the tray would cause damage. The tray loading is accomplished by engaging and holding objects in a carrier. The carrier carries the objects to a position over the tray and lowers the objects onto the tray surface, avoiding abrasion between the objects and the tray. The carrier includes sensors for verifying the presence of the objects.

Abstract: A carrier apparatus (40) for mounting logic components on the surface of a circuit board (41). The carrier apparatus (40) includes a housing structure defining top and bottom surfaces and further defining a cavity (50) in the bottom surface for receipt of a logic component (51). A recessed cover portion (56) is attached to the housing so as to enclose the cavity (50) thereby effectively sealing the logic component (51) in the housing. The carrier apparatus (40) includes means for mounting the housing on a circuit board such that the cover (56) does not make contact with the surface of the circuit board (41). The housing further includes means for electrically interconnecting the logic component (51) to the circuit board (41).

Abstract: A carrier apparatus (40) for mounting logic components on the surface of a circuit board (41). The carrier apparatus (40) includes a housing structure defining top and bottom surfaces and further defining a cavity (50) in the bottom surface for receipt of a logic component (51). A recessed cover portion (56) is attached to the housing so as to enclose the cavity (50) thereby effectively sealing the logic component (51) in the housing. The carrier apparatus (40) includes means for mounting the housing on a circuit board such that the cover (56) does not make contact with the surface of the circuit board (41). The housing further includes means for electrically interconnecting the logic component (51) to the circuit board (41).