Patents by Inventor Darryl J. McKenney

Darryl J. McKenney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5362534
    Abstract: A printed circuit board and method of manufacture thereof is disclosed. The printed circuit board includes a first substrate provided from a conductive layer having disposed on a first surface thereof a cured adhesive layer. A semi-cured adhesive layer is then disposed over the cured adhesive layer and a second substrate is disposed against the semi-cured adhesive layer.
    Type: Grant
    Filed: August 23, 1993
    Date of Patent: November 8, 1994
    Assignee: Parlex Corporation
    Inventors: Darryl J. McKenney, Robert D. Cyr
  • Patent number: 5262594
    Abstract: A rigid-flex printed circuit board having a rigid section and a flexible section extending from the rigid section is disclosed. The rigid-flex printed circuit board is capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens by providing spacers and covers for protecting the flexible section from high temperatures. A process for assembling components and devices on the rigid-flex printed circuit board in a high volume production environment utilizing infrared reflow ovens is also disclosed.
    Type: Grant
    Filed: October 12, 1990
    Date of Patent: November 16, 1993
    Assignees: Compaq Computer Corporation, Teledyne Industries, Inc.
    Inventors: Eric R. Edwin, James J. Tumlinson, Jerome A. Wilson, Thad C. McMillan, Jr., Rollin G. Meyer, Darryl J. McKenney
  • Patent number: 5178318
    Abstract: A rigid-flex printed circuit board having a rigid section and a flexible section extending from the rigid section is disclosed. The rigid-flex printed circuit board is capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens by providing spacers and covers for protecting the flexible section from high temperatures. A process for assembling components and devices on the rigid-flex printed circuit board in a high volume production environment utilizing infrared reflow ovens is also disclosed.
    Type: Grant
    Filed: June 6, 1991
    Date of Patent: January 12, 1993
    Assignee: Compaq Computer Corp.
    Inventors: Eric R. Edwin, James J. Tumlinson, Jerome A. Wilson, Thad C. McMillan, Jr., Rollin G. Meyer, Darryl J. McKenney
  • Patent number: 5175047
    Abstract: In a process for manufacturing a rigid-flex printed circuit wherein a rigid insulating layer supports one portion of the printed circuit and a flexible insulator supports another portion thereof to furnish flexible leads for connection the printed circuit to an operative device, a first assembly is provided comprising a curable prepreg insulator layer having an opening for the flexible leads. A flexible sheet spans the opening, and the assembly is pressed with one surface in contact with a smooth hard surface while the other surface is supported by a flowable curable prepreg layer. The insulator and flowable layers are a release layer which prevents bonding between the prepreg layers throughout most of the areas while permitting bonding along the edges. The assembly is maintained under heat and pressure to partially cure both prepreg layers and bond the flexible sheet to the edges of the opening and bond the edges of the prepregs together to form a flat rigid sandwich.
    Type: Grant
    Filed: September 10, 1991
    Date of Patent: December 29, 1992
    Assignee: Teledyne Industries, Inc.
    Inventors: Darryl J. McKenney, Lee Millette, Herb Dixon, Roland Caron
  • Patent number: 5095628
    Abstract: In a process for manufacturing a rigid-flex printed circuit wherein a rigid insulating layer supports one portion of the printed circuit and a flexible insulator supports another portion thereof to furnish flexible leads for connection the printed circuit to an operative device, a first assembly is provided comprising a curable prepreg insulator layer having an opening for the flexible leads. A flexible sheet spans the opening, and the assembly is pressed with one surface in contact with a smooth hard surface while the other surface is supported by a flowable curable prepreg layer. The insulator and flowable layers are a release layer which prevents bonding between the prepreg layers throughout most of the areas while permitting bonding along the edges. The assembly is maintained under heat and pressure to partially cure both prepreg layers and bond the flexible sheet to the edges of the opening and bond the edges of the prepregs together to form a flat rigid sandwich.
    Type: Grant
    Filed: August 9, 1990
    Date of Patent: March 17, 1992
    Assignee: Teledyne Industries, Inc.
    Inventors: Darryl J. McKenney, Lee Millette, Herb Dixon, Roland Caron
  • Patent number: 4800461
    Abstract: Multilayer rigid flex printed circuits are fabricated by a novel process to provide structures having rigid sections incorporating insulator materials which, when subjected to elevated temperatures, do not expand sufficiently in the Z direction to cause difficulties, including delamination and cracking of plated through barrels. The flex section includes flexible insulator materials which extend to but not a substantial distance into the rigid section.
    Type: Grant
    Filed: November 2, 1987
    Date of Patent: January 24, 1989
    Assignee: Teledyne Industries, Inc.
    Inventors: Herbert S. Dixon, Jonathan W. Weller, Ivon Boyer, Darryl J. McKenney