Abstract: A compound of general formula I wherein A is selected from the group of an unbranched or branched alky group with 1 to 12 carbon atoms, an —R1—O—R2 group, an —R1—Si(R3R4R5) group, an —R1—O—Si(R3R4R5) group, a —C(O)—O—R9—Si(R3R4R5) group, a —CH(O—R6)(O—R7) group, an —R1—CH(O—R6)(O—R7) group, or an —R1—O—C(O)—O—R8 group; SG is a protective group; R1 is a divalent hydrocarbon residue with 1 to 12 carbon atoms; R2 is a monovalent hydrocarbon residue with 1 to 12 carbon atoms; R3, R4 and R5 each independently are a monovalent hydrocarbon residue with 1 to 12 carbon atoms; R6 and R7 each independently are a monovalent hydrocarbon residue with 1 to 12 carbon atoms; R8 is a monovalent hydrocarbon residue with 1 to 12 carbon atoms; and R9 is a divalent hydrocarbon residue with 1 to 12 carbon atoms.

Abstract: The present subject matter provides for albumin-binding prodrugs, maytansinoid-based compounds, and uses thereof.

Abstract: The present subject matter provides for albumin-binding prodrugs, maytansinoid-based compounds, and uses thereof.

Abstract: The present invention provides a compound having the structure of Formula (I) or a pharmaceutically acceptable salt, hydrate, solvate, or isomer thereof, for the controlled delivery and release of Agent.

Abstract: The present invention provides a compound having the structure of Formula (I) or a pharmaceutically acceptable salt, hydrate, solvate, or isomer thereof, for the controlled delivery and release of Agent.

Abstract: The present disclosure provides for albumin-binding prodrugs of auristatin E derivatives and uses thereof.

Abstract: The present disclosure provides albumin-binding radioactive metal complexes and uses thereof, including diagnosing and treating disease.

Abstract: The present disclosure provides for albumin-binding prodrugs of auristatin E derivatives and uses thereof.

Abstract: The present subject matter provides for albumin-binding prodrugs, maytansinoid-based compounds, and uses thereof.

Abstract: The present invention provides a compound having the structure of Formula (I) or a pharmaceutically acceptable salt, hydrate, solvate, or isomer thereof, for the controlled delivery and release of Agent.

Abstract: Some embodiments are directed to a vehicular energy management apparatus that includes a lower frame that defines a raised portion disposed longitudinally between a vehicular power source and fuel system components. The raised portion can include an inclined portion defining an acute angle relative to the longitudinal direction, and disposed to guide movement of the power source upwardly in a direction perpendicular to the longitudinal direction and away from the components of the fuel system upon movement of the power source in the longitudinal direction. A mount assembly that mounts the power source to the lower frame is configured to fail and thereby detach the power source from the lower frame upon application of a predetermined threshold impact energy being transmitted to the power source, thereby enabling the power source to move in the longitudinal direction and resulting in dissipation of at least a portion of the impact energy.

Abstract: A method of forming a thermoelectric device may include providing a substrate having a surface, and thermally coupling a thermoelectric p-n couple to a first portion of the surface of a substrate. Moreover, the thermoelectric p-n couple may include a p-type thermoelectric element and an n-type thermoelectric element. In addition, a thermally conductive field layer may be formed on a second portion of the surface of the substrate adjacent the first portion of the surface of the substrate. Related structures are also discussed.

Abstract: An electronic assembly may include a packaging substrate, an integrated circuit (IC) semiconductor chip, a plurality of metal interconnection structures, and a thermoelectric heat pump. The integrated circuit (IC) semiconductor chip may have an active side including input/output pads thereon and a back side opposite the active side, and the IC semiconductor chip may be arranged with the active side facing the first surface of the packaging substrate. The plurality of metal interconnection structures may be between the active side of the IC semiconductor chip and the first surface of the packaging substrate, and the plurality of metal interconnection structures may provide mechanical connection between the active side of the IC semiconductor chip and the first surface of the packaging substrate. The thermoelectric heat pump may be coupled to the packaging substrate with the thermoelectric heat pump being configured to actively pump heat between the IC semiconductor chip and the packaging substrate.

Abstract: A method of forming a thermoelectric device may include forming a pattern of conductive traces, and forming an electrically insulating matrix between the conductive traces of the pattern of conductive traces. In addition, a plurality of thermoelectric elements may be electrically and mechanically coupled to the pattern of conductive traces so that each conductive trace of the pattern of conductive traces has one of the plurality of thermoelectric elements thereon. In addition, the plurality of thermoelectric elements may be free of the electrically insulating matrix. Related methods and structures are also discussed.

Abstract: A method of forming a thermoelectric device may include forming a plurality of islands of thermoelectric material on a deposition substrate. The plurality of islands of thermoelectric material may be bonded to a header substrate so that the plurality of islands are between the deposition substrate and the header substrate. More particularly, the islands of thermoelectric material may be epitaxial islands of thermoelectric material having crystal structures aligned with a crystal structure of the deposition substrate. Related structures are also discussed.

Abstract: An electronic device may include a heat generating component and a surface adjacent the heat generating component. A temperature of the heat generating component may be greater than a temperature of the surface adjacent the heat generating component during operation of the electronic device. A thermoelectric heat pump between the surface and the heat generating component may be configured to pump heat from a cold side of the thermoelectric heat pump adjacent the surface toward the heat generating component. Related methods are also discussed.

Abstract: An electronic assembly may include a packaging substrate, an integrated circuit (IC) semiconductor chip, a plurality of metal interconnection structures, and a thermoelectric heat pump. The integrated circuit (IC) semiconductor chip may have an active side including input/output pads thereon and a back side opposite the active side, and the IC semiconductor chip may be arranged with the active side facing the first surface of the packaging substrate. The plurality of metal interconnection structures may be between the active side of the IC semiconductor chip and the first surface of the packaging substrate, and the plurality of metal interconnection structures may provide mechanical connection between the active side of the IC semiconductor chip and the first surface of the packaging substrate. The thermoelectric heat pump may be coupled to the packaging substrate with the thermoelectric heat pump being configured to actively pump heat between the IC semiconductor chip and the packaging substrate.

Abstract: A method of forming a thermoelectric device may include forming a plurality of islands of thermoelectric material on a deposition substrate. The plurality of islands of thermoelectric material may be bonded to a header substrate so that the plurality of islands are between the deposition substrate and the header substrate. More particularly, the islands of thermoelectric material may be epitaxial islands of thermoelectric material having crystal structures aligned with a crystal structure of the deposition substrate. Related structures are also discussed.

Abstract: Flexible seals for process control valves are disclosed. An example disclosed seal includes a seal for use with a butterfly valve. The example seal includes a substantially flexible ring-shaped carrier configured to be fixed within the butterfly valve and to surround a flow control aperture therein. Additionally, the seal includes a ring-shaped cartridge coupled to an inner diameter of the ring-shaped carrier. The cartridge includes a first portion and a second portion coupled to the first portion to define a circumferential opening to hold a seal ring.

Abstract: Flexible seals for process control valves are disclosed. An example disclosed seal includes a substantially flexible ring-shaped carrier configured to be fixed within the butterfly valve and to surround a flow control aperture therein. The seal also includes a substantially rigid seal ring that has an outer circumferential surface fixed to the substantially flexible carrier and an inner circumferential surface configured to sealingly engage a control member that operatively interacts with the flow control aperture.