Patents by Inventor David E. Slutz

David E. Slutz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4883500
    Abstract: The present invention provides saw blade segments comprising polycrystalline diamond cutting elements and single crystal diamond cutting elements dispersed in a bonding matrix. In a preferred embodiment abrasion resistant particles are included so as to cause non-uniform wearing of the cutting segments. In another aspect of the invention, cutting segments are provided which utilize surface set polycrystalline diamond cutting elements larger than mesh size 18.
    Type: Grant
    Filed: October 25, 1988
    Date of Patent: November 28, 1989
    Assignee: General Electric Company
    Inventors: Martin E. Deakins, David E. Slutz, Neil R. Johnson, Thomas J. Clark, Harold P. Bovenkerk
  • Patent number: 4850523
    Abstract: Disclosed is a method for bonding thermally-stable polycrystalline diamond or CBN compacts to carbide supports wherein the carbide support is placed in thermal contact with a heat sink and the thermally-stable compact is placed in thermal contact with a heat source during the brazing operation.
    Type: Grant
    Filed: February 22, 1988
    Date of Patent: July 25, 1989
    Assignee: General Electric Company
    Inventor: David E. Slutz
  • Patent number: 4738689
    Abstract: Disclosed is an improved polycrystalline compact of self-bonded diamond particles having a network of interconnected empty pores dispersed throughout. The improved porous polycrystalline diamond compact possesses enhanced oxidation resistance and comprises all of the exterior surfaces of the porous compact being enveloped with a continuous coating which is effective under metal bond fabrication conditions so that oxidation of the diamond in the compact does not exceed a threshold level whereat loss of diamond properties of the compact occurs. Metal bond fabrication conditions comprehend an atmosphere containing oxygen or water vapor. Metal coatings are preferred, especially in coating thicknesses in excess of about 8 microns, and applied by a chemical vapor deposition process.
    Type: Grant
    Filed: October 16, 1986
    Date of Patent: April 19, 1988
    Assignee: General Electric Company
    Inventors: Paul D. Gigl, Bonnie M. Hammersley, David E. Slutz