Patents by Inventor David Gani
David Gani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190195685Abstract: One or more embodiments are directed to ambient light sensor packages, and methods of making ambient light sensor packages. One embodiment is directed to an ambient light sensor package that includes an ambient light sensor die having opposing first and second surfaces, a light sensor on the first surface of the ambient light sensor die, one or more conductive bumps on the second surface of the ambient light sensor die, and a light shielding layer on at least the first surface and the second surface of the ambient light sensor die. The light shielding layer defines an opening over the light sensor. The ambient light sensor package may further include a transparent cover between the first surface of the ambient light sensor die and the light shielding layer, and an adhesive that secures the transparent cover to the ambient light sensor die.Type: ApplicationFiled: December 7, 2018Publication date: June 27, 2019Inventors: Laurent HERARD, David GANI
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Publication number: 20190154801Abstract: A semiconductor package that is a proximity sensor includes a light transmitting die, a light receiving die, an ambient light sensor, a cap, and a substrate. The light receiving die and the light transmitting die are coupled to the substrate. The cap is coupled to the substrate forming a first chamber around the light transmitting die and a second chamber around the light receiving die. The cap further includes a recess with contact pads. The ambient light sensor is mounted within the recess of the cap and coupled to the contact pads. The cap includes electrical traces that are coupled to the contact pads within the recess coupling the ambient light sensor to the substrate. By utilizing a cap with a recess containing contact pads, a proximity sensor can be formed in a single semiconductor package all while maintaining a compact size and reducing the manufacturing costs of proximity sensors.Type: ApplicationFiled: November 20, 2017Publication date: May 23, 2019Inventor: David GANI
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Publication number: 20190096788Abstract: A semiconductor package includes a lead frame, a die, a discrete electrical component, and electrical connections. The lead frame includes leads and a die pad. Some of the leads include engraved regions that have recesses therein and the die pad may include an engraved region or multiple engraved regions. Each engraved region is formed to contain and confine a conductive adhesive from flowing over the edges of the engraved leads or the die pad. The boundary confines the conductive adhesive to the appropriate location on the engraved lead or the engraved die pad when being placed on the engraved regions. By utilizing a lead frame with engraved regions, the flow of the conductive adhesive or the wettability of the conductive adhesive can be contained and confined to the appropriate areas of the engraved lead or engraved die pad such that a conductive adhesive does not cause cross-talk between electrical components within a semiconductor package or short circuiting within a semiconductor package.Type: ApplicationFiled: September 22, 2017Publication date: March 28, 2019Inventors: Rennier Rodriguez, Bryan Christian Bacquian, Maiden Grace Maming, David Gani
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Patent number: 10147834Abstract: An electronic device includes a substrate, an optical sensor coupled to the substrate, and an optical emitter coupled to the substrate. A lens is aligned with the optical emitter and includes an upper surface and an encapsulation bleed stop groove around the upper surface. An encapsulation material is coupled to the substrate and includes first and second encapsulation openings therethrough aligned with the optical sensor and the lens, respectively.Type: GrantFiled: October 16, 2015Date of Patent: December 4, 2018Assignee: STMICROELECTRONICS PTE LTDInventors: Laurent Herard, David Gani
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Patent number: 9793427Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to an optical sensor that includes a substrate and a sensor die. A through-hole extends through the substrate, and a trench is formed in a first surface of the substrate and is in fluid communication with the through-hole. The sensor die is attached to the first surface of the substrate and covers the first through-hole and a first portion of the trench. A second portion of the trench is left uncovered by the sensor die.Type: GrantFiled: July 25, 2016Date of Patent: October 17, 2017Assignee: STMICROELECTRONICS PTE LTDInventor: David Gani
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Publication number: 20170287886Abstract: Wafer level proximity sensors are formed by processing a silicon substrate wafer and a silicon cap wafer separately, bonding the cap wafer to the substrate wafer, forming an interconnect structure of through-silicon vias within the substrate, and singulating the bonded wafers to yield individually packaged sensors. The wafer level proximity sensor is smaller than a conventional proximity sensor and can be manufactured using a shorter fabrication process at a lower cost. The proximity sensors are coupled to external components by a signal path that includes the through-silicon vias and a ball grid array formed on a lower surface of the silicon substrate. The design of the wafer level proximity sensor passes more light from the light emitter and more light to the light sensor.Type: ApplicationFiled: March 31, 2016Publication date: October 5, 2017Inventor: David Gani
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Patent number: 9768216Abstract: An image sensor device may include an interconnect layer, an image sensor IC on the interconnect layer, and a barrel adjacent the interconnect layer and having first electrically conductive traces. The image sensor device may include a liquid crystal focus cell carried by the barrel and having cell layers, and second electrically conductive contacts. A pair of adjacent cell layers may have different widths. The image sensor device may include an electrically conductive adhesive body coupling at least one of the second electrically conductive contacts to a corresponding one of the first electrically conductive traces.Type: GrantFiled: November 7, 2014Date of Patent: September 19, 2017Assignee: STMICROELECTRONICS PTE LTDInventors: Dave Alexis Delacruz, David Gani
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Publication number: 20170186644Abstract: A method for making at least one integrated circuit (IC) package includes positioning an electrically conductive shield layer adjacent an interior of a mold, and coupling the mold onto a substrate carrying at least one IC thereon. A molding material is supplied into the interior of the mold to form an encapsulated body over the at least one IC and substrate with the electrically conductive shield layer at an outer surface of the encapsulated body.Type: ApplicationFiled: December 29, 2015Publication date: June 29, 2017Inventors: Laurent HERARD, David GANI
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Patent number: 9671671Abstract: An optical assembly may include a substrate, a housing carried by the substrate and having at least one adhesive-receiving recess in an upper surface thereof, and a lens carried by the housing. The optical assembly may also include a liquid crystal focus cell adjacent the lens and including cell layers and pairs of electrically conductive contacts associated therewith. The optical assembly may also include at least one electrically conductive member within the at least one adhesive-receiving recess and coupling together each pair of the electrically conductive contacts, and an adhesive body in the at least one adhesive-receiving recess covering the at least one electrically conductive member.Type: GrantFiled: October 10, 2013Date of Patent: June 6, 2017Assignee: STMICROELECTRONICS PTE LTDInventors: Wee Chin Judy Lim, David Gani, Hk Looi, Bs Aw, Cheng-hai Cheh
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Publication number: 20170110618Abstract: An electronic device includes a substrate, an optical sensor coupled to the substrate, and an optical emitter coupled to the substrate. A lens is aligned with the optical emitter and includes an upper surface and an encapsulation bleed stop groove around the upper surface. An encapsulation material is coupled to the substrate and includes first and second encapsulation openings therethrough aligned with the optical sensor and the lens, respectively.Type: ApplicationFiled: October 16, 2015Publication date: April 20, 2017Inventors: Laurent HERARD, David GANI
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Patent number: 9525094Abstract: A proximity sensor having a relatively small footprint includes a substrate, a semiconductor die, a light emitting device, and a cap. The light emitting device overlies the semiconductor die. The semiconductor die is secured to the substrate and includes a sensor area capable of detecting light from by the light emitting device. The cap also is secured to the substrate and includes a light barrier that prevents some of the light emitted by the light emitting device from reaching the sensor area. In one embodiment, the light emitting device and the semiconductor die are positioned on the same side of the substrate, wherein the light emitting device is positioned on the semiconductor die. In another embodiment, the light emitting device is positioned on one side of the substrate and the semiconductor die is positioned on an opposing side of the substrate.Type: GrantFiled: March 27, 2015Date of Patent: December 20, 2016Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics Pte LtdInventors: Eric Saugier, Wing Shenq Wong, David Gani
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Publication number: 20160284920Abstract: A proximity sensor having a relatively small footprint includes a substrate, a semiconductor die, a light emitting device, and a cap. The light emitting device overlies the semiconductor die. The semiconductor die is secured to the substrate and includes a sensor area capable of detecting light from by the light emitting device. The cap also is secured to the substrate and includes a light barrier that prevents some of the light emitted by the light emitting device from reaching the sensor area. In one embodiment, the light emitting device and the semiconductor die are positioned on the same side of the substrate, wherein the light emitting device is positioned on the semiconductor die. In another embodiment, the light emitting device is positioned on one side of the substrate and the semiconductor die is positioned on an opposing side of the substrate.Type: ApplicationFiled: March 27, 2015Publication date: September 29, 2016Inventors: Eric SAUGIER, Wing Shenq WONG, David GANI
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Publication number: 20160133662Abstract: An image sensor device may include an interconnect layer, an image sensor IC on the interconnect layer, and a barrel adjacent the interconnect layer and having first electrically conductive traces. The image sensor device may include a liquid crystal focus cell carried by the barrel and having cell layers, and second electrically conductive contacts. A pair of adjacent cell layers may have different widths. The image sensor device may include an electrically conductive adhesive body coupling at least one of the second electrically conductive contacts to a corresponding one of the first electrically conductive traces.Type: ApplicationFiled: November 7, 2014Publication date: May 12, 2016Inventors: Dave Alexis DELACRUZ, David GANI
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Patent number: 9244334Abstract: Described herein are various embodiments of contacts that include different portions angled with respect to one another and methods of manufacturing devices that include such contacts. In some embodiments, a module may include a first portion of a contact that is disposed within a housing and a second portion that is disposed outside of the housing, with the second portion angled with respect to the first portion. Manufacturing such devices may include depositing a conductive material to electrically connect the contact to a contact pad of a substrate. In some embodiments, a deposition process for depositing the conductive material may have a minimum dimension, which defines a minimum dimension of a conductive material once deposited. In some such embodiments, a distance between a terminal end of the contact pin and the contact pad may be greater than the minimum dimension of the deposition process.Type: GrantFiled: March 29, 2013Date of Patent: January 26, 2016Assignee: STMicroelectronics Pte LtdInventors: Hk Looi, Wee Chin Judy Lim, Cheng-Hai Cheh, Bs Aw, David Gani, Tin-Tun Maung, Choon Lee Lai
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Publication number: 20150138420Abstract: Electronics modules and methods of making electronics modules are provided. An electronics module includes a substrate having an electronic circuit mounted thereon, a lens mount affixed to the substrate, the lens mount having a lens assembly mounted therein, and a liquid crystal cell affixed to the lens mount over the lens assembly, the liquid crystal cell having electrical terminals, wherein the lens mount includes adhesive containment pockets that are filled with a conductive adhesive so as to contact the electrical terminals of the liquid crystal cell, wherein the adhesive containment pockets include contacts that are electrically connected to the substrate. In some embodiments, the electronics module is a camera module.Type: ApplicationFiled: November 21, 2013Publication date: May 21, 2015Applicant: STMicroelectronics Pte Ltd.Inventors: Hk Looi, David Gani, Wee Chin Judy Lim, Bs Aw, Cheng-Hai Cheh
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Publication number: 20150103297Abstract: An optical assembly may include a substrate, a housing carried by the substrate and having at least one adhesive-receiving recess in an upper surface thereof, and a lens carried by the housing. The optical assembly may also include a liquid crystal focus cell adjacent the lens and including cell layers and pairs of electrically conductive contacts associated therewith. The optical assembly may also include at least one electrically conductive member within the at least one adhesive-receiving recess and coupling together each pair of the electrically conductive contacts, and an adhesive body in the at least one adhesive-receiving recess covering the at least one electrically conductive member.Type: ApplicationFiled: October 10, 2013Publication date: April 16, 2015Applicant: STMICROELECTRONICS PTE. LTDInventors: WeeChinJudy LIM, David Gani, Hk Looi, Bs Aw, Cheng-hai Cheh
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Publication number: 20140293120Abstract: Described herein are various embodiments of contacts that include different portions angled with respect to one another and methods of manufacturing devices that include such contacts. In some embodiments, a module may include a first portion of a contact that is disposed within a housing and a second portion that is disposed outside of the housing, with the second portion angled with respect to the first portion. Manufacturing such devices may include depositing a conductive material to electrically connect the contact to a contact pad of a substrate. In some embodiments, a deposition process for depositing the conductive material may have a minimum dimension, which defines a minimum dimension of a conductive material once deposited. In some such embodiments, a distance between a terminal end of the contact pin and the contact pad may be greater than the minimum dimension of the deposition process.Type: ApplicationFiled: March 29, 2013Publication date: October 2, 2014Applicant: STMicroelectronics Pte Ltd.Inventors: Hk Looi, Wee Chin Judy Lim, Cheng-Hai Cheh, Bs Aw, David Gani, Tin-Tun Maung, Choon Lee Lai
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Patent number: 8642119Abstract: The present disclosure is directed to a camera module that includes at least a semiconducting die, an image-sensing circuit, a lens, a lens aperture, and a coating that adheres to an exterior surface of the camera module. The coating is opaque to light and prevents light from accessing the camera other than through the lens aperture. The opaque coating is applied as a fluid and is cured. In one embodiment, a mask material is selectively applied to exterior surfaces of the semiconducting die, electrical interconnect layers, glass layers, the lens body, or the lens aperture. After applying the opaque coating, the selectively applied mask material is removed. Methods of selectively applying a mask material include applying a conformable and peelably releasable dope-like material, placing an array of joined, selectively shaped rigid masks over an array of assemblies, and applying a conformable mask material that is heat-expandable.Type: GrantFiled: September 22, 2010Date of Patent: February 4, 2014Assignee: STMicroelectronics PTE Ltd.Inventors: Wingshenq Wong, David Gani, Glenn De Los Reyes
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Patent number: 8576574Abstract: A conductive paint electromagnetic interference (EMI) shield for an electronic module or device. The conductive paint is composed of metal particles suspended in a fluidic carrier. In one embodiment, the conductive paint is sprayed onto exterior surfaces of an electronic module or device from a spray gun. The sprayed conductive paint is cured to remove the fluidic carrier, leaving a metal film coated to the outside of the module or device. In one embodiment used with electronic packages in array form, grooves are cut into an encapsulation material of a module so that the shield protection includes sidewalls of the package. In another embodiment used with camera modules, masking is used to selectively shield portions of the module. In a further embodiment, the shield is electrically connected to a ground conductor of a circuit of the electronic module.Type: GrantFiled: April 21, 2010Date of Patent: November 5, 2013Assignee: STMicroelectronics Pte Ltd.Inventors: Wingshenq Wong, David Gani, Glenn De Los Reyes
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Patent number: 8492181Abstract: A method of forming an embedded wafer level optical package includes attaching a sensor die, PCB bars and an LED on adhesive tape laminated on a carrier, attaching a dam between two light sensitive sensors of the sensor die, encapsulating the sensor die, the PCB bars, the LED, and the dam in an encapsulation layer, debonding the carrier, grinding a top surface of the encapsulation layer, forming vias through the encapsulation layer to the sensor die and the LED, filling the vias with conductive material, metalizing the top surface of the encapsulation layer, dielectric coating of the top surface of the encapsulation layer, dielectric coating of a bottom surface of the encapsulation layer, patterning the dielectric coating of the bottom surface of the encapsulation layer, and plating the patterned dielectric coating of the bottom surface of the encapsulation layer.Type: GrantFiled: December 22, 2011Date of Patent: July 23, 2013Assignee: STMicroelectronics Pte Ltd.Inventors: Anandan Ramasamy, KahWee Gan, Hk Looi, David Gani