Patents by Inventor David J. Hemker
David J. Hemker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10794519Abstract: Methods and apparatuses for additively manufactured tubular passages, additively manufactured manifolds, and additively manufactured heaters are provided.Type: GrantFiled: January 7, 2019Date of Patent: October 6, 2020Assignee: Lam Research CorporationInventors: Christopher William Burkhart, Andrew C. Lee, David J. Hemker
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Publication number: 20190211955Abstract: Methods and apparatuses for additively manufactured tubular passages, additively manufactured manifolds, and additively manufactured heaters are provided.Type: ApplicationFiled: January 7, 2019Publication date: July 11, 2019Inventors: Christopher William Burkhart, Andrew C. Lee, David J. Hemker
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Patent number: 10215317Abstract: Methods and apparatuses for additively manufactured tubular passages, additively manufactured manifolds, and additively manufactured heaters are provided.Type: GrantFiled: March 31, 2016Date of Patent: February 26, 2019Assignee: Lam Research CorporationInventors: Christopher William Burkhart, Andrew C. Lee, David J. Hemker
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Patent number: 9871759Abstract: Methods and systems for sharing information related to operational metrics of a plurality of equipment used in manufacturing of semiconductor wafer includes interfacing a server with the equipment to allow the server to receive a plurality of parameters including operational metrics associated with operation of each of the plurality of equipment. The plurality of parameters are processed to identify event-related data, message-related data and to generate human-readable interpretation for the identified event-related data and the message related data. Users are identified for receiving the operational metrics of each of the plurality of equipment. The event-related data, message-related data and the corresponding human-readable interpretation for the operational metrics associated with each of the equipment are forwarded to a social network service for performing a posting operation to social data streams associated with the identified users.Type: GrantFiled: September 11, 2015Date of Patent: January 16, 2018Assignee: Lam Research CorporationInventors: Chung Ho Huang, Henry T. Chan, Chad R. Weetman, David J. Hemker
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Publication number: 20170203511Abstract: Methods and apparatuses for additively manufactured tubular passages, additively manufactured manifolds, and additively manufactured heaters are provided.Type: ApplicationFiled: March 31, 2016Publication date: July 20, 2017Inventors: Christopher William Burkhart, Andrew C. Lee, David J. Hemker
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Publication number: 20170078238Abstract: Methods and systems for sharing information related to operational metrics of a plurality of equipment used in manufacturing of semiconductor wafer includes interfacing a server with the equipment to allow the server to receive a plurality of parameters including operational metrics associated with operation of each of the plurality of equipment. The plurality of parameters are processed to identify event-related data, message-related data and to generate human-readable interpretation for the identified event-related data and the message related data. Users are identified for receiving the operational metrics of each of the plurality of equipment. The event-related data, message-related data and the corresponding human-readable interpretation for the operational metrics associated with each of the equipment are forwarded to a social network service for performing a posting operation to social data streams associated with the identified users.Type: ApplicationFiled: September 11, 2015Publication date: March 16, 2017Inventors: Chung Ho Huang, Henry T. Chan, Chad R. Weetman, David J. Hemker
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Patent number: 9431268Abstract: Methods for controlled isotropic etching of layers of silicon oxide and germanium oxide with atomic scale fidelity are provided. The methods make use of a reaction of anhydrous HF with an activated surface of an oxide, with an emphasis on removal of water generated in the reaction. In certain embodiments the oxide surface is first modified by adsorbing an OH-containing species (e.g., an alcohol) or by forming OH bonds using a hydrogen-containing plasma. The activated oxide is then etched by a separately introduced anhydrous HF, while the water generated in the reaction is removed from the surface of the substrate as the reaction proceeds, or at any time during or after the reaction. These methods may be used in interconnect pre-clean applications, gate dielectric processing, manufacturing of memory devices, or any other applications where accurate removal of one or multiple atomic layers of material is desired.Type: GrantFiled: January 5, 2015Date of Patent: August 30, 2016Assignee: Lam Research CorporationInventors: Thorsten Lill, Ivan L. Berry, III, Meihua Shen, Alan M. Schoepp, David J. Hemker
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Publication number: 20160196984Abstract: Methods for controlled isotropic etching of layers of silicon oxide and germanium oxide with atomic scale fidelity are provided. The methods make use of a reaction of anhydrous HF with an activated surface of an oxide, with an emphasis on removal of water generated in the reaction. In certain embodiments the oxide surface is first modified by adsorbing an OH-containing species (e.g., an alcohol) or by forming OH bonds using a hydrogen-containing plasma. The activated oxide is then etched by a separately introduced anhydrous HF, while the water generated in the reaction is removed from the surface of the substrate as the reaction proceeds, or at any time during or after the reaction. These methods may be used in interconnect pre-clean applications, gate dielectric processing, manufacturing of memory devices, or any other applications where accurate removal of one or multiple atomic layers of material is desired.Type: ApplicationFiled: January 5, 2015Publication date: July 7, 2016Inventors: Thorsten Lill, Ivan L. Berry, III, Meihua Shen, Alan M. Schoepp, David J. Hemker
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Publication number: 20150079795Abstract: A plurality of substrate processing devices are disposed in a separated manner within a shared ambient environment. A conveyance device is disposed within the shared ambient environment and is defined to move a substrate through and between each of the substrate processing devices in a continuous manner. Some substrate processing devices are defined to perform dry substrate processing operations in which an energized reactive environment is created in exposure to the substrate in an absence of liquid material. Some substrate processing devices are defined to perform wet substrate processing operations in which at least one material in a liquid state is applied to the substrate. In one embodiment, a complementary pair of dry and wet substrate processing devices are disposed in the shared ambient environment in a sequential manner relative to movement of the substrate by the conveyance device.Type: ApplicationFiled: November 19, 2014Publication date: March 19, 2015Inventors: David J. Hemker, Lubab L. Sheet, Jeffrey Marks
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Publication number: 20120088370Abstract: A plurality of substrate processing devices are disposed in a separated manner within a shared ambient environment. A conveyance device is disposed within the shared ambient environment and is defined to move a substrate through and between each of the substrate processing devices in a continuous manner. Some substrate processing devices are defined to perform dry substrate processing operations in which an energized reactive environment is created in exposure to the substrate in an absence of liquid material. Some substrate processing devices are defined to perform wet substrate processing operations in which at least one material in a liquid state is applied to the substrate. In one embodiment, a complementary pair of dry and wet substrate processing devices are disposed in the shared ambient environment in a sequential manner relative to movement of the substrate by the conveyance device.Type: ApplicationFiled: October 6, 2010Publication date: April 12, 2012Applicant: Lam Research CorporationInventors: David J. Hemker, Lubab L. Sheet, Jeffrey Marks
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Patent number: 7520284Abstract: A first proximity head is configured to define a meniscus of a photoresist developer solution on a substrate. The meniscus is to be defined between a bottom of the first proximity head and the substrate. A second proximity head is configured to define a rinsing meniscus on the substrate and remove the rinsing meniscus from the substrate. The second proximity head is positioned to follow the first proximity head relative to a traversal direction of the first and second proximity heads over the substrate. Exposure of the substrate to the meniscus of photoresist developer solution causes previously irradiated photoresist material on the substrate to be developed to render a patterned photoresist layer. The first and second proximity heads enable precise control of a residence time of the photoresist developer solution on the substrate during the development process.Type: GrantFiled: August 15, 2005Date of Patent: April 21, 2009Assignee: Lam Research CorporationInventors: John M. Boyd, Fritz C. Redeker, David J. Hemker
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Patent number: 7356580Abstract: A process chamber with a computer system that controls the process chamber is connected to one or more sensors, which are used to monitor the process in the process chamber. The sensors are connected to the computer system in a client/server relationship, in a way that allows the sensors to be hot swappable plug and play sensors. The computer system exchanges various messages with the sensors, synchronizes with the sensors, and integrates and utilizes data sent from the sensors.Type: GrantFiled: March 30, 2000Date of Patent: April 8, 2008Assignee: Lam Research CorporationInventors: Chung-Ho Huang, Andrew Lui, David J. Hemker
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Patent number: 7045019Abstract: An invention is disclosed for backside particle removal during a semiconductor manufacturing process. Cleaning sites are defined on the backside of a wafer. The cleaning sites are regions of the backside of the wafer that physically contact a chuck during a semiconductor fabrication process. Once the cleaning sites are defined, the backside of the wafer is cleaned, where the cleaning is primarily directed to the cleaning sites. Typically, the contact regions can correspond to pin positions of a chuck pin array, or wafer contact areas on a vacuum chuck. A laser or a megasonic wand can be used to provide the site-specific cleaning of the wafer backside.Type: GrantFiled: December 21, 2001Date of Patent: May 16, 2006Assignee: Lam Research CorporationInventors: David J. Hemker, John M. Boyd
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Patent number: 7029368Abstract: Apparatus controls the temperature of a wafer for chemical mechanical polishing operations. A wafer carrier wafer mounting surface positions a wafer adjacent to a thermal energy transfer unit for transferring energy relative to the wafer. A thermal energy detector oriented adjacent to the wafer mounting surface detects the temperature of the wafer. A controller is responsive to the detector for controlling the supply of thermal energy relative to the thermal energy transfer unit. Embodiments include defining separate areas of the wafer, providing separate sections of the thermal energy transfer unit for each separate area, and separately detecting the temperature of each separate area to separately control the supply of thermal energy relative to the thermal energy transfer unit associated with the separate area.Type: GrantFiled: November 25, 2003Date of Patent: April 18, 2006Assignee: Lam Research CorporationInventors: Nicolas Bright, David J. Hemker
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Patent number: 6984162Abstract: Apparatus controls the temperature of a wafer for chemical mechanical polishing operations. A wafer carrier wafer mounting surface positions a wafer adjacent to a thermal energy transfer unit for transferring energy relative to the wafer. A thermal energy detector oriented adjacent to the wafer mounting surface detects the temperature of the wafer. A controller is responsive to the detector for controlling the supply of thermal energy relative to the thermal energy transfer unit. Embodiments include defining separate areas of the wafer, providing separate sections of the thermal energy transfer unit for each separate area, and separately detecting the temperature of each separate area to separately control the supply of thermal energy relative to the thermal energy transfer unit associated with the separate area.Type: GrantFiled: November 25, 2003Date of Patent: January 10, 2006Assignee: Lam Research CorporationInventors: Nicolas Bright, David J. Hemker
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Patent number: 6937915Abstract: In chemical mechanical polishing apparatus, a wafer carrier plate is provided with a cavity for reception of a sensor positioned very close to a wafer to be polished. Energy resulting from contact between a polishing pad and an exposed surface of the wafer is transmitted only a very short distance to the sensor and is sensed by the sensor, providing data as to the nature of properties of the exposed surface of the wafer, and of transitions of those properties. Correlation methods provide graphs relating sensed energy to the surface properties, and to the transitions. The correlation graphs provide process status data for process control.Type: GrantFiled: March 28, 2002Date of Patent: August 30, 2005Assignee: Lam Research CorporationInventors: Rodney Kistler, David J. Hemker, Yehiel Gotkis, Aleksander Owczarz, Bruno Morel, Damon V. Williams
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Patent number: 6925348Abstract: In chemical mechanical polishing, a wafer carrier plate is provided with a cavity for reception of a sensor positioned very close to a wafer to be polished. Energy resulting from contact between a polishing pad and an exposed surface of the wafer is transmitted only a very short distance to the sensor and is sensed by the sensor, providing data as to the nature of properties of the exposed surface of the wafer, and of transitions of those properties. Correlation methods provide graphs relating sensed energy to the surface properties, and to the transitions. The correlation graphs provide process status data for process control.Type: GrantFiled: October 14, 2004Date of Patent: August 2, 2005Assignee: Lam Research CorporationInventors: Rodney Kistler, David J. Hemker, Yehiel Gotkis, Aleksander Owczarz, Bruno Morel, Damon V. Williams
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Publication number: 20040242124Abstract: Apparatus controls the temperature of a wafer for chemical mechanical polishing operations. A wafer carrier wafer mounting surface positions a wafer adjacent to a thermal energy transfer unit for transferring energy relative to the wafer. A thermal energy detector oriented adjacent to the wafer mounting surface detects the temperature of the wafer. A controller is responsive to the detector for controlling the supply of thermal energy relative to the thermal energy transfer unit. Embodiments include defining separate areas of the wafer, providing separate sections of the thermal energy transfer unit for each separate area, and separately detecting the temperature of each separate area to separately control the supply of thermal energy relative to the thermal energy transfer unit associated with the separate area.Type: ApplicationFiled: November 25, 2003Publication date: December 2, 2004Applicant: LAM Research CorporationInventors: Nicolas Bright, David J. Hemker
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Publication number: 20040108065Abstract: Apparatus controls the temperature of a wafer for chemical mechanical polishing operations. A wafer carrier wafer mounting surface positions a wafer adjacent to a thermal energy transfer unit for transferring energy relative to the wafer. A thermal energy detector oriented adjacent to the wafer mounting surface detects the temperature of the wafer. A controller is responsive to the detector for controlling the supply of thermal energy relative to the thermal energy transfer unit. Embodiments include defining separate areas of the wafer, providing separate sections of the thermal energy transfer unit for each separate area, and separately detecting the temperature of each separate area to separately control the supply of thermal energy relative to the thermal energy transfer unit associated with the separate area.Type: ApplicationFiled: November 25, 2003Publication date: June 10, 2004Applicant: LAM Research CorporationInventors: Nicolas Bright, David J. Hemker
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Patent number: 6736720Abstract: Apparatus and methods control the temperature of a wafer for chemical mechanical polishing operations. A wafer carrier has a wafer mounting surface for positioning the wafer adjacent to a thermal energy transfer unit for transferring energy relative to the wafer. A thermal energy detector is oriented adjacent to the wafer mounting surface for detecting the temperature of the wafer. A controller is responsive to the detector for controlling the supply of thermal energy relative to the thermal energy transfer unit. Embodiments include defining separate areas of the wafer, providing separate sections of the thermal energy transfer unit for each separate area, and separately detecting the temperature of each separate area to separately control the supply of thermal energy relative to the thermal energy transfer unit associated with the separate area.Type: GrantFiled: December 26, 2001Date of Patent: May 18, 2004Assignee: Lam Research CorporationInventors: Nicolas Bright, David J. Hemker