Patents by Inventor David L. Vos

David L. Vos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10548243
    Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: January 28, 2020
    Assignee: Lockheed Martin Corporation
    Inventors: Brian W. Kaplun, James S. Eiche, David L. Vos
  • Patent number: 10527362
    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: January 7, 2020
    Assignee: Lockheed Martin Corporation
    Inventors: David L. Vos, Ryan M. Alderfer, Matthew Daniel Miller
  • Patent number: 10461018
    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: October 29, 2019
    Assignee: Lockheed Martin Corporation
    Inventors: David L. Vos, Ryan M. Alderfer, Randall J. Stutzman
  • Patent number: 10371462
    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: August 6, 2019
    Assignee: Lockheed Martin Corporation
    Inventors: David L. Vos, Ryan M. Alderfer, Randall J. Stutzman
  • Patent number: 10362713
    Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: July 23, 2019
    Assignee: Lockheed Martin Corporation
    Inventors: Brian W. Kaplun, James S. Eiche, David L. Vos
  • Publication number: 20180043482
    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
    Type: Application
    Filed: October 3, 2017
    Publication date: February 15, 2018
    Applicant: Lockheed Martin Corporation
    Inventors: David L. Vos, Ryan M. Alderfer, Matthew Daniel Miller
  • Publication number: 20180043480
    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
    Type: Application
    Filed: October 3, 2017
    Publication date: February 15, 2018
    Applicant: Lockheed Martin Corporation
    Inventors: David L. Vos, Ryan M. Alderfer, Randall J. Stutzman
  • Publication number: 20180043481
    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
    Type: Application
    Filed: October 3, 2017
    Publication date: February 15, 2018
    Applicant: Lockheed Martin Corporation
    Inventors: David L. Vos, Ryan M. Alderfer, Randall J. Stutzman
  • Patent number: 9851161
    Abstract: Some embodiments relate to constructing a heat exchanger using nanoink as a thermal bond interface between portions of the heat exchanger. The heat exchanger may comprise fins and at least one base. A nanoink may be applied to at least a portion of the fins. The pieces of the heat exchanger may be sintered such that the nanoink melts and forms a bond between the pieces of the heat exchanger. Some embodiments include a second base. Some embodiments incorporate dissimilar materials within the heat exchanger construction.
    Type: Grant
    Filed: January 3, 2012
    Date of Patent: December 26, 2017
    Assignee: Lockheed Martin Corporation
    Inventors: David L. Vos, Stephen Schober
  • Patent number: 9673514
    Abstract: Some embodiments relate to a multiband antenna array formed on a flexible substrate. Low frequency antenna elements may be formed using nanoink. High frequency elements may be provided on a prefabricated antenna chip. The antenna array may be heated in a low temperature oven to sinter the nanoink into a solid antenna element. In some embodiments, an adhesive insulation layer may be provided which allows the antenna array to be attached to any surface. In other embodiments, the antenna array may be embedded in a composite material.
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: June 6, 2017
    Assignee: Lockheed Martin Corporation
    Inventors: David L. Vos, Carl Baldwin, David R. Darling, Brian W. Kaplun, David R. Dorough
  • Publication number: 20170082371
    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
    Type: Application
    Filed: September 21, 2015
    Publication date: March 23, 2017
    Applicant: Lockheed Martin Corporation
    Inventors: David L. Vos, Ryan M. Alderfer, Randall J. Stutzman
  • Publication number: 20170082372
    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
    Type: Application
    Filed: September 21, 2015
    Publication date: March 23, 2017
    Applicant: Lockheed Martin Corporation
    Inventors: David L. Vos, Ryan M. Alderfer, Matthew Daniel Miller
  • Patent number: 9510479
    Abstract: A self-contained fluid-cooled electro-optical plug in type module capable of being exchangeably mounted in an external chassis incorporates electronic or electro-optical devices mounted on one or more interposers which provide electrical power and electric and optical signal connections to the devices and are also provided with fluid conduits through which a cooling fluid is circulated in a closed-loop cooling path to a heat exchanger for transferring the heat generated in the devices to external heat disposal equipment in the mounting chassis.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: November 29, 2016
    Assignee: Lockheed Martin Corporation
    Inventor: David L. Vos
  • Publication number: 20160278241
    Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.
    Type: Application
    Filed: June 1, 2016
    Publication date: September 22, 2016
    Applicant: Lockheed Martin Corporation
    Inventors: Brian W. Kaplun, James S. Eiche, David L. Vos
  • Publication number: 20160278240
    Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.
    Type: Application
    Filed: June 1, 2016
    Publication date: September 22, 2016
    Applicant: Lockheed Martin Corporation
    Inventors: Brian W. Kaplun, James S. Eiche, David L. Vos
  • Patent number: 9426931
    Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: August 23, 2016
    Assignee: Lockheed Martin Corporation
    Inventors: Brian W. Kaplun, James S. Eiche, David L. Vos
  • Patent number: 9389103
    Abstract: A gigahertz sensor array packaging solution for harsh operating environments is disclosed. The sensor array packaging system includes a structural core body comprising sensor mounting features on a surface thereof and an alignment through hole extending from the surface to a backside thereof which incorporates finned features providing cooling and stiffness. The sensor array packaging system further includes one or more electro-optical components mounted to the backside of the structural core body. The sensor array packaging system further includes a wiring board comprising a plurality of sensor array elements contacting walls of the spiral ribbon configuration, each having a cable extending through the through hole to at least one of the one or more electro-optical components.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: July 12, 2016
    Assignee: LOCKHEED MARTIN CORPORATION
    Inventors: James E. Bishop, Allan Johnson, Brian Kaplun, Steven E. McElwain, Jr., David L. Vos
  • Publication number: 20160178410
    Abstract: A gigahertz sensor array packaging solution for harsh operating environments is disclosed. The sensor array packaging system includes a structural core body comprising sensor mounting features on a surface thereof and an alignment through hole extending from the surface to a backside thereof which incorporates finned features providing cooling and stiffness. The sensor array packaging system further includes one or more electro-optical components mounted to the backside of the structural core body. The sensor array packaging system further includes a wiring board comprising a plurality of sensor array elements contacting walls of the spiral ribbon configuration, each having a cable extending through the through hole to at least one of the one or more electro-optical components.
    Type: Application
    Filed: December 17, 2014
    Publication date: June 23, 2016
    Inventors: James E. BISHOP, Allan JOHNSON, Brian KAPLUN, Steven E. McELWAIN, JR., David L. VOS
  • Publication number: 20150303554
    Abstract: Some embodiments relate to a multiband antenna array formed on a flexible substrate. Low frequency antenna elements may be formed using nanoink. High frequency elements may be provided on a prefabricated antenna chip. The antenna array may be heated in a low temperature oven to sinter the nanoink into a solid antenna element. In some embodiments, an adhesive insulation layer may be provided which allows the antenna array to be attached to any surface. In other embodiments, the antenna array may be embedded in a composite material.
    Type: Application
    Filed: August 25, 2014
    Publication date: October 22, 2015
    Applicant: Lockheed Martin Corporation
    Inventors: DAVID L. VOS, Carl Baldwin, David R. Darling, Brian W. Kaplun, David R. Dorough
  • Publication number: 20150230365
    Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.
    Type: Application
    Filed: February 7, 2014
    Publication date: August 13, 2015
    Applicant: Lockheed Martin Corporation
    Inventors: Brian W. Kaplun, James S. Eiche, David L. Vos