Patents by Inventor David L. Vos
David L. Vos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10923876Abstract: A heat exchanger configured to cool an energy output device, and systems, devices, and methods thereof, can comprise a heat exchanger housing and an internal chamber defined in the housing that is configured to be filled with a phase-change material (PCM). The internal chamber can be provided at a first predetermined level inside the housing relative to the top surface of the housing and can extend under a first predetermined portion of the top surface of the housing. The internal chamber can include a plurality of PCM channels configured to be filled with the PCM and to accommodate phase changes of the PCM in multiple phase-change directions. Optionally, the plurality of PCM channels can be defined by a plurality of fins and/or the internal chamber can be accessible to outside the housing via at least one PCM interface configured to receive and pass therethrough the PCM.Type: GrantFiled: August 9, 2019Date of Patent: February 16, 2021Assignee: Lockheed Martin CorporationInventors: Aleksandra Shepsis, David L. Vos
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Patent number: 10914535Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.Type: GrantFiled: October 3, 2017Date of Patent: February 9, 2021Assignee: Lockheed Martin CorporationInventors: David L. Vos, Ryan M. Alderfer, Randall J. Stutzman
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Patent number: 10816280Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.Type: GrantFiled: October 3, 2017Date of Patent: October 27, 2020Assignee: Lockheed Martin CorporationInventors: David L. Vos, Ryan M. Alderfer, Matthew Daniel Miller
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Patent number: 10548243Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.Type: GrantFiled: June 1, 2016Date of Patent: January 28, 2020Assignee: Lockheed Martin CorporationInventors: Brian W. Kaplun, James S. Eiche, David L. Vos
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Patent number: 10527362Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.Type: GrantFiled: September 21, 2015Date of Patent: January 7, 2020Assignee: Lockheed Martin CorporationInventors: David L. Vos, Ryan M. Alderfer, Matthew Daniel Miller
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Patent number: 10461018Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.Type: GrantFiled: October 3, 2017Date of Patent: October 29, 2019Assignee: Lockheed Martin CorporationInventors: David L. Vos, Ryan M. Alderfer, Randall J. Stutzman
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Patent number: 10371462Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.Type: GrantFiled: September 21, 2015Date of Patent: August 6, 2019Assignee: Lockheed Martin CorporationInventors: David L. Vos, Ryan M. Alderfer, Randall J. Stutzman
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Patent number: 10362713Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.Type: GrantFiled: June 1, 2016Date of Patent: July 23, 2019Assignee: Lockheed Martin CorporationInventors: Brian W. Kaplun, James S. Eiche, David L. Vos
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Publication number: 20180043480Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.Type: ApplicationFiled: October 3, 2017Publication date: February 15, 2018Applicant: Lockheed Martin CorporationInventors: David L. Vos, Ryan M. Alderfer, Randall J. Stutzman
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Publication number: 20180043482Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.Type: ApplicationFiled: October 3, 2017Publication date: February 15, 2018Applicant: Lockheed Martin CorporationInventors: David L. Vos, Ryan M. Alderfer, Matthew Daniel Miller
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Publication number: 20180043481Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.Type: ApplicationFiled: October 3, 2017Publication date: February 15, 2018Applicant: Lockheed Martin CorporationInventors: David L. Vos, Ryan M. Alderfer, Randall J. Stutzman
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Patent number: 9851161Abstract: Some embodiments relate to constructing a heat exchanger using nanoink as a thermal bond interface between portions of the heat exchanger. The heat exchanger may comprise fins and at least one base. A nanoink may be applied to at least a portion of the fins. The pieces of the heat exchanger may be sintered such that the nanoink melts and forms a bond between the pieces of the heat exchanger. Some embodiments include a second base. Some embodiments incorporate dissimilar materials within the heat exchanger construction.Type: GrantFiled: January 3, 2012Date of Patent: December 26, 2017Assignee: Lockheed Martin CorporationInventors: David L. Vos, Stephen Schober
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Patent number: 9673514Abstract: Some embodiments relate to a multiband antenna array formed on a flexible substrate. Low frequency antenna elements may be formed using nanoink. High frequency elements may be provided on a prefabricated antenna chip. The antenna array may be heated in a low temperature oven to sinter the nanoink into a solid antenna element. In some embodiments, an adhesive insulation layer may be provided which allows the antenna array to be attached to any surface. In other embodiments, the antenna array may be embedded in a composite material.Type: GrantFiled: August 25, 2014Date of Patent: June 6, 2017Assignee: Lockheed Martin CorporationInventors: David L. Vos, Carl Baldwin, David R. Darling, Brian W. Kaplun, David R. Dorough
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Publication number: 20170082371Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.Type: ApplicationFiled: September 21, 2015Publication date: March 23, 2017Applicant: Lockheed Martin CorporationInventors: David L. Vos, Ryan M. Alderfer, Randall J. Stutzman
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Publication number: 20170082372Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.Type: ApplicationFiled: September 21, 2015Publication date: March 23, 2017Applicant: Lockheed Martin CorporationInventors: David L. Vos, Ryan M. Alderfer, Matthew Daniel Miller
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Patent number: 9510479Abstract: A self-contained fluid-cooled electro-optical plug in type module capable of being exchangeably mounted in an external chassis incorporates electronic or electro-optical devices mounted on one or more interposers which provide electrical power and electric and optical signal connections to the devices and are also provided with fluid conduits through which a cooling fluid is circulated in a closed-loop cooling path to a heat exchanger for transferring the heat generated in the devices to external heat disposal equipment in the mounting chassis.Type: GrantFiled: May 9, 2014Date of Patent: November 29, 2016Assignee: Lockheed Martin CorporationInventor: David L. Vos
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Publication number: 20160278241Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.Type: ApplicationFiled: June 1, 2016Publication date: September 22, 2016Applicant: Lockheed Martin CorporationInventors: Brian W. Kaplun, James S. Eiche, David L. Vos
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Publication number: 20160278240Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.Type: ApplicationFiled: June 1, 2016Publication date: September 22, 2016Applicant: Lockheed Martin CorporationInventors: Brian W. Kaplun, James S. Eiche, David L. Vos
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Patent number: 9426931Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.Type: GrantFiled: February 7, 2014Date of Patent: August 23, 2016Assignee: Lockheed Martin CorporationInventors: Brian W. Kaplun, James S. Eiche, David L. Vos
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Patent number: 9389103Abstract: A gigahertz sensor array packaging solution for harsh operating environments is disclosed. The sensor array packaging system includes a structural core body comprising sensor mounting features on a surface thereof and an alignment through hole extending from the surface to a backside thereof which incorporates finned features providing cooling and stiffness. The sensor array packaging system further includes one or more electro-optical components mounted to the backside of the structural core body. The sensor array packaging system further includes a wiring board comprising a plurality of sensor array elements contacting walls of the spiral ribbon configuration, each having a cable extending through the through hole to at least one of the one or more electro-optical components.Type: GrantFiled: December 17, 2014Date of Patent: July 12, 2016Assignee: LOCKHEED MARTIN CORPORATIONInventors: James E. Bishop, Allan Johnson, Brian Kaplun, Steven E. McElwain, Jr., David L. Vos