Abstract: A gigahertz sensor array packaging solution for harsh operating environments is disclosed. The sensor array packaging system includes a structural core body comprising sensor mounting features on a surface thereof and an alignment through hole extending from the surface to a backside thereof which incorporates finned features providing cooling and stiffness. The sensor array packaging system further includes one or more electro-optical components mounted to the backside of the structural core body. The sensor array packaging system further includes a wiring board comprising a plurality of sensor array elements contacting walls of the spiral ribbon configuration, each having a cable extending through the through hole to at least one of the one or more electro-optical components.

Abstract: Some embodiments relate to a multiband antenna array formed on a flexible substrate. Low frequency antenna elements may be formed using nanoink. High frequency elements may be provided on a prefabricated antenna chip. The antenna array may be heated in a low temperature oven to sinter the nanoink into a solid antenna element. In some embodiments, an adhesive insulation layer may be provided which allows the antenna array to be attached to any surface. In other embodiments, the antenna array may be embedded in a composite material.

Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.

Abstract: A self-contained fluid-cooled electro-optical plug in type module capable of being exchangeably mounted in an external chassis incorporates electronic or electro-optical devices mounted on one or more interposers which provide electrical power and electric and optical signal connections to the devices and are also provided with fluid conduits through which a cooling fluid is circulated in a closed-loop cooling path to a heat exchanger for transferring the heat generated in the devices to external heat disposal equipment in the mounting chassis.

Abstract: Some embodiments relate to a multiband antenna array formed on a flexible substrate. Low frequency antenna elements may be formed using nanoink. High frequency elements may be provided on a prefabricated antenna chip. The antenna array may be heated in a low temperature oven to sinter the nanoink into a solid antenna element. In some embodiments, an adhesive insulation layer may be provided which allows the antenna array to be attached to any surface. In other embodiments, the antenna array may be embedded in a composite material.

Abstract: A self-contained fluid-cooled electro-optical plug in type module capable of being exchangeably mounted in an external chassis incorporates electronic or electro-optical devices mounted on one or more interposers which provide electrical power and electric and optical signal connections to the devices and are also provided with fluid conduits through which a cooling fluid is circulated in a closed-loop cooling path to a heat exchanger for transferring the heat generated in the devices to external heat disposal equipment in the mounting chassis.

Abstract: Some embodiments relate to a multiband antenna array formed on a flexible substrate. Low frequency antenna elements may be formed using nanoink. High frequency elements may be provided on a prefabricated antenna chip. The antenna array may be heated in a low temperature oven to sinter the nanoink into a solid antenna element. In some embodiments, an adhesive insulation layer may be provided which allows the antenna array to be attached to any surface. In other embodiments, the antenna array may be embedded in a composite material.

Abstract: Some embodiments relate to constructing a heat exchanger using nanoink as a thermal bond interface between portions of the heat exchanger. The heat exchanger may comprise fins and at least one base. A nanoink may be applied to at least a portion of the fins. The pieces of the heat exchanger may be sintered such that the nanoink melts and forms a bond between the pieces of the heat exchanger. Some embodiments include a second base. Some embodiments incorporate dissimilar materials within the heat exchanger construction.

Abstract: A self-contained fluid-cooled electro-optical plug in type module capable of being exchangeably mounted in an external chassis incorporates electronic or electro-optical devices mounted on one or more interposers which provide electrical power and electric and optical signal connections to the devices and are also provided with fluid conduits through which a cooling fluid is circulated in a closed-loop cooling path to a heat exchanger for transferring the heat generated in the devices to external heat disposal equipment in the mounting chassis.

Abstract: A heat sink apparatus for electronic components provides a heat sink and a deformable, convex foil construction affixed to the heat sink around a periphery of the foil construction and adapted to extend away from the heat sink to enable deformation of the convex foil construction as a result of contact with a top surface of an electronic component mounted opposite the foil construction.

Abstract: A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.

Abstract: A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.

Abstract: A cooling assembly is located in a chassis with a conduction-cooled circuit module and permits the conduction-cooled circuit module to be utilized in an air-flow-through or liquid-flow-through circuit module chassis assembly. The cooling assembly may be a removable cooling adapter or may be integral with the chassis. The cooling assembly includes a housing having a first end and a second end and defining one or more fluid passages. The housing further includes a thermal contact surface to contact the conduction-cooled circuit module. The cooling assembly may be configured for air-flow-through or liquid-flow-through cooling of the conduction-cooled circuit module.

Abstract: A method and apparatus for housing an electronic device are provided. The apparatus includes an environmentally sealed chamber to protect the electronic device from harsh environments. The environmental conditions of the chamber are controllable using environmental controls which are controlled by digital processor with a stored program coupled with sensors. The digital processor may also control the application of power from an external interface. The apparatus also includes a self-contained power source running from a primary fuel. A control system is provided for managing power production and energy storage to maintain continuity of environmental conditions.

Abstract: A method and apparatus for housing an electronic device are provided. The apparatus includes an environmentally sealed chamber to protect the electronic device from harsh environments. The environmental conditions of the chamber are controllable using environmental controls which are controlled by digital processor with a stored program coupled with sensors. The digital processor may also control the application of power from an external interface. The apparatus also includes a self-contained power source running from a primary fuel. A control system is provided for managing power production and energy storage to maintain continuity of environmental conditions.

Abstract: A method and apparatus for housing an electronic device are provided. The apparatus includes an environmentally sealed chamber to protect the electronic device from harsh environments. The environmental conditions of the chamber are controllable using environmental controls which are controlled by digital processor with a stored program coupled with sensors. The digital processor may also control the application of power from an external interface. The apparatus also includes a self-contained power source running from a primary fuel. A control system is provided for managing power production and energy storage to maintain continuity of environmental conditions.

Abstract: An apparatus is provided for permitting commercial-off-the-shelf (COTS) electronics to be utilized in harsh environments for which the COTS electronics are not designed, including environments having ambient temperature variations, ambient pressure variations, shock and vibration exposure, environmental contaminants and/or electromagnetic radiation which may be beyond the design specification of the COTS components. The device includes a sealed enclosure having racks or other suitable mounts for the COTS components and having an environmental controlled unit (ECU) which circulates a fluid such as air through the enclosure and through the mounts. The temperature in the enclosure is monitored and the ECU operated to heat or cool fluid passing therethrough to maintain temperature in the enclosure within the design limits of the COTS electronics. A flow channel for ambient fluid, which channel is sealed from the internally circulating fluid, may be provided for removing heat from a cooling unit of the ECU.

Abstract: A method and construction for providing thermal management and vibration isolation to a component that requires a controlled temperature during operation. The component (e.g., a hard disk drive) is mounted within an enclosure such that the component is substantially isolated from mechanical vibrations, and the isolation mechanism further provides a thermal path from the component to the enclosure. An elastomeric article which supports the component may be attached to the interior of the enclosure, the elastomeric article being loaded with thermally conductive fillers (fibers or non-directional particulates molded within the elastomer material). Alternatively, a wire rope which supports the component may be attached to the interior of the enclosure, the wire rope having at least one support strand and at least one heat transfer strand that has a higher thermal conductivity than the support strand.

Abstract: A method and construction for providing thermal management and vibration isolation to a component that requires a controlled temperature during operation. The component (e.g., a hard disk drive) is mounted within an enclosure such that the component is substantially isolated from mechanical vibrations, and the isolation mechanism further provides a thermal path from the component to the enclosure. An elastomeric article which supports the component may be attached to the interior of the enclosure, the elastomeric article being loaded with thermally conductive fillers (fibers or non-directional particulates molded within the elastomer material). Alternatively, a wire rope which supports the component may be attached to the interior of the enclosure, the wire rope having at least one support strand and at least one heat transfer strand that has a higher thermal conductivity than the support strand.