Patents by Inventor David LeVine
David LeVine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190296496Abstract: An electrical connector module with openings in an insulative support selectively positioned to limit dielectric loss in a signal. The connector may include a first and second conductor including first and second sides between first and second edges. An insulative support holds the first conductor adjacent the second conductor and may have at least five pedestal portions, wherein the first pedestal portion contacts the first side of the first conductor, the second pedestal portion contacts the second side of the first conductor, the third pedestal portion contacts the first side of the second conductor, the fourth pedestal portion contacts the second side of the second conductor, and at least a portion of the fifth pedestal portion is disposed between two edges of the first and second conductors. The pedestal portions may have widths less than the widths of the first and second sides of the first and second conductors.Type: ApplicationFiled: March 19, 2019Publication date: September 26, 2019Applicant: Amphenol CorporationInventors: Marc B. Cartier, JR., John Robert Dunham, Vysakh Sivarajan, Mark W. Gailus, David Levine, Michael Joseph Snyder
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Publication number: 20190260147Abstract: Embodiments related to electrical connectors including superelastic components are described. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. In some embodiments, a connector includes one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.Type: ApplicationFiled: May 2, 2019Publication date: August 22, 2019Applicant: Amphenol CorporationInventors: Tom Pitten, Mark W. Gailus, Marc B. Cartier, JR., David Levine, Donald A. Girard, JR.
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Patent number: 10367287Abstract: Embodiments related to electrical connectors including superelastic components are described. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. In some embodiments, a connector includes one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.Type: GrantFiled: May 21, 2018Date of Patent: July 30, 2019Assignee: Amphenol CorporationInventors: Tom Pitten, Mark W. Gailus, Marc B. Cartier, Jr., David Levine, Donald A. Girard, Jr.
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Publication number: 20180324941Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.Type: ApplicationFiled: July 11, 2018Publication date: November 8, 2018Applicant: Amphenol CorporationInventors: Mark W. Gailus, Marc B. Cartier, JR., Vysakh Sivarajan, David Levine
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Publication number: 20180269612Abstract: Embodiments related to electrical connectors including superelastic components are described. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. In some embodiments, a connector includes one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.Type: ApplicationFiled: May 21, 2018Publication date: September 20, 2018Applicant: Amphenol CorporationInventors: Tom Pitten, Mark W. Gailus, Marc B. Cartier, JR., David Levine, Donald A. Girard, JR.
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Publication number: 20180233858Abstract: A modular electrical connector with broad-side coupled signal conductors in a right angle intermediate portion and edge coupled end portions. Broadside coupling provides balanced pairs for very high frequency operation, while edge coupling provides a high density interconnection system at low cost. Each module has separately shielded signal conductor pairs. The shielding is shaped to avoid or suppress undesirable propagation modes within an enclosure formed by shielding per module. Lossy material is selectively placed within and outside the shielding per module to likewise avoid or suppress unwanted signal propagation.Type: ApplicationFiled: January 29, 2018Publication date: August 16, 2018Applicant: Amphenol CorporationInventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, Donald A. Girard, JR., Brian Kirk, David Levine, Vysakh Sivarajan
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Patent number: 10034366Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.Type: GrantFiled: October 25, 2017Date of Patent: July 24, 2018Assignee: Amphenol CorporationInventors: Mark W. Gailus, Marc B. Cartier, Jr., Vysakh Sivarajan, David Levine
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Patent number: 9991617Abstract: Embodiments related to electrical connectors including superelastic components are described. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. In some embodiments, a connector includes one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.Type: GrantFiled: April 14, 2016Date of Patent: June 5, 2018Assignee: Amphenol CorporationInventors: Tom Pitten, Mark W. Gailus, Marc B. Cartier, Jr., David Levine, Donald A. Girard, Jr.
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Patent number: 9905975Abstract: A modular electrical connector with broad-side coupled signal conductors in a right angle intermediate portion and edge coupled end portions. Broadside coupling provides balanced pairs for very high frequency operation, while edge coupling provides a high density interconnection system at low cost. Each module has separately shielded signal conductor pairs. The shielding is shaped to avoid or suppress undesirable propagation modes within an enclosure formed by shielding per module. Lossy material is selectively placed within and outside the shielding per module to likewise avoid or suppress unwanted signal propagation.Type: GrantFiled: January 22, 2015Date of Patent: February 27, 2018Assignee: Amphenol CorporationInventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, Donald A. Girard, Jr., Brian Kirk, David Levine, Vysakh Sivarajan
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Publication number: 20180049312Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.Type: ApplicationFiled: October 25, 2017Publication date: February 15, 2018Applicant: Amphenol CorporationInventors: Mark W. Gailus, Marc B. Cartier, JR., Vysakh Sivarajan, David Levine
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Publication number: 20180013702Abstract: Various aspects relate to using structured messages within systems that implement instant messaging function in a distributed computing environment. In particular, structured information may be encoded and embedded in unstructured instant messages and communicated among one or more computer systems, networks, applications or other entities. In one aspect, instant messaging may be leveraged as middleware for application integration. Other aspects relate to using structured message information to perform functions in a distributed instant messaging system. For example, structured message information may be used to control the display of instant message information to a user, or may be used to control how the instant message information is distributed, processed, or otherwise handled by a receiving system, application or process. Other aspects relate to an interface for displaying information relating to a number of instant messaging conversations to a user.Type: ApplicationFiled: September 22, 2017Publication date: January 11, 2018Inventors: Daniel Bryan, Nikita Ivanov, Daniel Judson, Yu Sang Kwan, David Levine, Andrew Nanopoulos, Furqan Nazeeri, Brandon Schory, Nader Shwayhat
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Publication number: 20170359625Abstract: A method of managing bandwidth usage at a customer premises includes receiving a content stream at a set-top box device coupled to a display device. The method also includes receiving a power-off command for the display device. Furthermore, the method includes displaying a prompt on the display device, wherein the prompt comprises an instruction to confirm that the display device is active via a confirmation input. The method further includes directing, responsive to the determining that the confirmation input has not been received, a source device to cease sending the content stream to the set-top box.Type: ApplicationFiled: August 21, 2017Publication date: December 14, 2017Inventors: David A. Levine, Dale Malik
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Patent number: 9807039Abstract: Various aspects relate to using structured messages within one or more systems that implement instant messaging function in a distributed computing environment. In particular, structured information may be encoded and embedded in unstructured instant messages and communicated among one or more computer systems, networks, applications or other entities. In one aspect, instant messaging may be leveraged as middleware for application integration. Other aspects relate to using structured message information to perform functions in a distributed instant messaging system. For example, structured message information may be used to control the display of instant message information to a user, or may be used to control how the instant message information is distributed, processed, or otherwise handled by a receiving system, application or process. Other aspects relate to an interface for displaying information relating to a number of instant messaging conversations to a user.Type: GrantFiled: April 11, 2014Date of Patent: October 31, 2017Assignee: Chicago Mercantile Exchange Inc.Inventors: Daniel Bryan, Nikita Ivanov, Daniel Judson, Yu Sang Kwan, David Levine, Andrew Nanopoulos, Furqan Nazeeri, Brandon Schory, Nader Shwayhat
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Patent number: 9807869Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.Type: GrantFiled: November 20, 2015Date of Patent: October 31, 2017Assignee: Amphenol CorporationInventors: Mark W. Gailus, Marc B. Cartier, Jr., Vysakh Sivarajan, David Levine
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Patent number: 9769535Abstract: A method of managing bandwidth usage at a customer premises includes receiving a content stream at a set-top box device coupled to a display device. The method also includes receiving a power-off command for the display device. Furthermore, the method includes displaying a prompt on the display device, wherein the prompt comprises an instruction to confirm that the display device is active via a confirmation input. The method further includes directing, responsive to the determining that the confirmation input has not been received, a source device to cease sending the content stream to the set-top box.Type: GrantFiled: January 29, 2015Date of Patent: September 19, 2017Assignee: AT&T Intellectual Property I, L.P.Inventors: David A. Levine, Dale Malik
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Patent number: 9730313Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; first and second signal vias forming a differential signal pair, the first and second signal vias extending through the attachment layers and connecting to respective signal traces on a breakout layer of the routing layers; an antipad of a first type around and between the first and second signal vias in one or more of the attachment layers; and antipads of a second type around the first and second signal vias in at least one routing layer adjacent to the breakout layer.Type: GrantFiled: November 20, 2015Date of Patent: August 8, 2017Assignee: Amphenol CorporationInventors: Mark W. Gailus, Marc B. Cartier, Jr., Vysakh Sivarajan, David Levine
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Publication number: 20170064406Abstract: A method and system for remote control of multimedia content using a multimedia content distribution network (MCDN) is configured to establish a connection between a customer premises equipment (CPE) gateway and a local area network (LAN) device that is a personal user device. A user of the LAN device may be authenticated. Responsive to user input, the LAN device may send remote control messages corresponding to remote control functions for an MCDN terminal device. The CPE gateway may determine a network address for the MCDN terminal device, and forward the remote control messages to the addressed MCDN terminal device. The LAN device may so remotely control the addressed MCDN terminal device.Type: ApplicationFiled: November 14, 2016Publication date: March 2, 2017Applicant: AT&T Intellectual Property I, L.P.Inventors: James Carlton Bedingfield, SR., David A. Levine, John A. McClenny
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Publication number: 20160350778Abstract: Computer-implemented systems and methods are disclosed for facilitating generation of carbon credits to offset greenhouse gas emissions. In an embodiment, carbon emissions reduction targets for a defined time period are first received from a sponsor. A campaign is initiated for the sponsor that includes a sponsor promotion and targets selected properties and/or regions. One or more broad market simulations are then run on the targeted properties or regions to estimate an average solar energy production per property. The promotion is adjusted for each targeted property based on the property's estimated energy production compared to the average solar energy production across the targeted properties. Installation of solar energy systems on one or more of the targeted properties is then facilitated through the sponsor's campaign and promotion, and carbon credits may be provided to the sponsor that correspond to energy produced by the installed solar energy systems.Type: ApplicationFiled: May 27, 2016Publication date: December 1, 2016Inventors: David A. LEVINE, Richard B. Deal, Jeremy T. Dobrzanski, Mark C. Wirt
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Publication number: 20160344141Abstract: A modular electrical connector with broad-side coupled signal conductors in a right angle intermediate portion and edge coupled end portions. Broadside coupling provides balanced pairs for very high frequency operation, while edge coupling provides a high density interconnection system at low cost. Each module has separately shielded signal conductor pairs. The shielding is shaped to avoid or suppress undesirable propagation modes within an enclosure formed by shielding per module. Lossy material may be selectively placed within and outside the shielding per module to likewise avoid or suppress unwanted signal propagation.Type: ApplicationFiled: January 22, 2015Publication date: November 24, 2016Applicant: Amphenol CorporationInventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, Donald A. Girard, JR., Brian Kirk, David Levine, Vysakh Sivarajan
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Patent number: 9497516Abstract: A method and system for remote control of multimedia content using a multimedia content distribution network (MCDN) is configured to establish a connection between a customer premises equipment (CPE) gateway and a local area network (LAN) device that is a personal user device. A user of the LAN device may be authenticated. Responsive to user input, the LAN device may send remote control messages corresponding to remote control functions for an MCDN terminal device. The CPE gateway may determine a network address for the MCDN terminal device, and forward the remote control messages to the addressed MCDN terminal device. The LAN device may so remotely control the addressed MCDN terminal device.Type: GrantFiled: November 10, 2014Date of Patent: November 15, 2016Assignee: AT&T Intellectual Property I, L.P.Inventors: James Carlton Bedingfield, Sr., David A. Levine, John A. McClenny