Patents by Inventor David T. Emerson

David T. Emerson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190342992
    Abstract: An LED array and driver design minimizes space requirements and simplifies assembly, while reducing costs. A printed circuit board with LED driver electronics has a central opening through which the LED array is mounted. In one form the LED array is a chip on board (COB) array, the array being circular and fitting closely within the central opening of the PCB. Four integral leaf springs are formed into the flat PCB, in position to push the LED array down when the PCB and LED array are attached against the heat sink. Two of the springs have electrical contacts that make contact with those of the LED array. With the LED array and driver circuit on the face of a light assembly, the space rear of the driver circuit is free to be open to air flow for cooling.
    Type: Application
    Filed: May 7, 2018
    Publication date: November 7, 2019
    Inventors: Daniel T. Emerson, Brooks Patrick Lame, David William Tolan, Jarod Armer
  • Patent number: 10448503
    Abstract: An LED array and driver design minimizes space requirements and simplifies assembly, while reducing costs. A printed circuit board with LED driver electronics has a central opening through which the LED array is mounted. In one form the LED array is a chip on board (COB) array, the array being circular and fitting closely within the central opening of the PCB. Four integral leaf springs are formed into the flat PCB, in position to push the LED array down when the PCB and LED array are attached against the heat sink. Two of the springs have electrical contacts that make contact with those of the LED array. With the LED array and driver circuit on the face of a light assembly, the space rear of the driver circuit is free to be open to air flow for cooling.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: October 15, 2019
    Assignee: Light & Motion Industries
    Inventors: Daniel T. Emerson, Brooks Patrick Lame, David William Tolan, Jarod Armer
  • Patent number: 10439112
    Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A light emitter chip can be disposed over the submount such that the light emitter chip is mounted over at least a portion of the cathode and wirebonded to at least a portion of the anode.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: October 8, 2019
    Assignee: Cree, Inc.
    Inventors: Joseph G. Clark, Jeffrey Carl Britt, Amber C. Abare, Raymond Rosado, Harsh Sundani, David T. Emerson, Jeremy Scott Nevins
  • Patent number: 10372400
    Abstract: An apparatus includes a plurality of compute nodes and a baseboard management controller that is shared by the plurality of compute nodes to manage video for the compute nodes. The baseboard management controller includes video controllers that are associated with the plurality of compute nodes and at least one resource that is shared by the video controllers.
    Type: Grant
    Filed: May 21, 2015
    Date of Patent: August 6, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Theodore F. Emerson, David F. Heinrich, Kenneth T. Chin
  • Publication number: 20190203117
    Abstract: A method is disclosed for forming a blended phosphor composition. The method includes the steps of firing precursor compositions that include europium and nitrides of at least calcium, strontium and aluminum, in a refractory metal crucible and in the presence of a gas that precludes the formation of nitride compositions between the nitride starting materials and the refractory metal that forms the crucible. The resulting compositions can include phosphors that convert frequencies in the blue portion of the visible spectrum into frequencies in the red portion of the visible spectrum.
    Type: Application
    Filed: March 8, 2019
    Publication date: July 4, 2019
    Applicant: Cree, Inc.
    Inventors: Brian T. Collins, Christopher P. Hussell, David T. Emerson, Ronan P. Le Toquin
  • Patent number: 10266767
    Abstract: A method is disclosed for forming a blended phosphor composition. The method includes the steps of firing precursor compositions that include europium and nitrides of at least calcium, strontium and aluminum, in a refractory metal crucible and in the presence of a gas that precludes the formation of nitride compositions between the nitride starting materials and the refractory metal that forms the crucible. The resulting compositions can include phosphors that convert frequencies in the blue portion of the visible spectrum into frequencies in the red portion of the visible spectrum.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: April 23, 2019
    Assignee: Cree, Inc.
    Inventors: Brian T. Collins, Christopher P. Hussell, David T. Emerson, Ronan P. Le Toquin
  • Patent number: 10008637
    Abstract: Light emitter devices and methods with reduced dimensions and improved light output are provided. In one embodiment, a light emitter device includes a submount having an area of approximately 6 square millimeters (mm2) or less. The device can further include a light emitting chip on the submount and a lens disposed over the light emitting chip and positioned on the submount. The device can be operable for emitting light at approximately 100 lumens or higher.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: June 26, 2018
    Assignee: Cree, Inc.
    Inventors: Jeffrey C. Britt, David T. Emerson, Raymond Rosado, Justin Lydon
  • Patent number: 9905731
    Abstract: A light emitting diode is disclosed that includes a silicon carbide substrate and a light emitting structure formed from the Group III nitride material system on the substrate. The diode has an area greater than 100,000 square microns and has a radiant flux at 20 milliamps current of at least 29 milliwatts at its dominant wavelength between 390 and 540 nanometers.
    Type: Grant
    Filed: June 8, 2010
    Date of Patent: February 27, 2018
    Assignee: Cree, Inc.
    Inventors: John Adam Edmond, Michael J. Bergmann, David T. Emerson, Kevin Ward Haberern
  • Patent number: 9786811
    Abstract: The present disclosure is directed to LED components, and systems using such components, having a light emission profile that may be controlled independently of the lens shape by varying the position and/or orientation of LED chips with respect to one or both of an overlying lens and the surface of the component. For example, the optical centers of the LED emitting surface and the lens, which are normally aligned, may be offset from each other to generate a controlled and predictable emission profile. The LED chips may be positioned to provide a peak emission shifted from a perpendicular centerline of the lens base. The use of offset emitters allows for LED components with shifted or tilted emission patterns, without causing output at high angles of the components. This is beneficial as it allows a lighting system to have tilted emission from the LED component and primary optics.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: October 10, 2017
    Assignee: CREE, INC.
    Inventors: Fabian Rol, Eric Tarsa, Bernd Keller, Theodore D. Lowes, David T. Emerson
  • Patent number: 9627361
    Abstract: Multiple configuration light emitting diode (LED) devices and methods are disclosed wherein LEDs within the device can be selectively configured for use in higher voltage, or variable voltage, applications. Variable arrangements of LEDs can be configured. Arrangements can include one or more LEDs connected in series, parallel, and/or a combination thereof. A surface over which one or more LEDs may be mounted can comprise one or more electrically and/or thermally isolated portions.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: April 18, 2017
    Assignee: Cree, Inc.
    Inventors: Peter S. Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Jeffrey C. Britt
  • Publication number: 20160348000
    Abstract: A method is disclosed for forming a blended phosphor composition. The method includes the steps of firing precursor compositions that include europium and nitrides of at least calcium, strontium and aluminum, in a refractory metal crucible and in the presence of a gas that precludes the formation of nitride compositions between the nitride starting materials and the refractory metal that forms the crucible. The resulting compositions can include phosphors that convert frequencies in the blue portion of the visible spectrum into frequencies in the red portion of the visible spectrum.
    Type: Application
    Filed: August 11, 2016
    Publication date: December 1, 2016
    Applicant: Cree, Inc.
    Inventors: Brian T. Collins, Christopher P. Hussell, David T. Emerson, Ronan P. Le Toquin
  • Patent number: 9428688
    Abstract: A method is disclosed for forming a blended phosphor composition. The method includes the steps of firing precursor compositions that include europium and nitrides of at least calcium, strontium and aluminum, in a refractory metal crucible and in the presence of a gas that precludes the formation of nitride compositions between the nitride starting materials and the refractory metal that forms the crucible. The resulting compositions can include phosphors that convert frequencies in the blue portion of the visible spectrum into frequencies in the red portion of the visible spectrum.
    Type: Grant
    Filed: November 17, 2008
    Date of Patent: August 30, 2016
    Assignee: Cree, Inc.
    Inventors: Brian T. Collins, Christopher P. Hussell, David T. Emerson, Ronan P. Le Toquin
  • Patent number: 9349929
    Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: May 24, 2016
    Assignee: Cree, Inc.
    Inventors: Joseph G. Clark, Amber C. Abare, David T. Emerson, Jeremy S. Nevins, Raymond Rosado, Michael Bergmann
  • Patent number: 9209354
    Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed.
    Type: Grant
    Filed: January 6, 2014
    Date of Patent: December 8, 2015
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Peter Scott Andrews, Jesse Colin Reiherzer, David T. Emerson
  • Patent number: 9203004
    Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate, one or more LEDs disposed over the substrate, and the LEDs can include electrical connectors for connecting to an electrical element. A light emitting device can further include a retention material disposed over the substrate and the retention material can be disposed over at least a portion of the electrical connectors. The LEDs can be connected in a pattern that is non-linear.
    Type: Grant
    Filed: October 1, 2013
    Date of Patent: December 1, 2015
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Peter Scott Andrews, Jesse Colin Reiherzer, David T. Emerson
  • Patent number: 9159888
    Abstract: Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.
    Type: Grant
    Filed: September 7, 2007
    Date of Patent: October 13, 2015
    Assignee: Cree, Inc.
    Inventors: Ashay Chitnis, James Ibbetson, Bernd Keller, David T. Emerson, John Edmond, Michael J. Bergmann, Jasper S. Cabalu, Jeffrey C. Britt, Arpan Chakraborty, Eric Tarsa, Yankun Fu
  • Patent number: 9111778
    Abstract: Light emitting diode (LED) devices, systems, and methods are disclosed. In one aspect, an illumination panel can be configured to provide backlighting for a liquid crystal display (LCD) panel. The illumination panel can include one or more LEDs arranged in an array. The one or more LEDs can be attached using metal-to-metal die attach methods over an illumination panel, or attached within packages disposed over the illumination panel. In one aspect, the one or more LEDs can be attached using robust metal-to-metal die attach techniques and/or materials disclosed herein.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: August 18, 2015
    Assignee: Cree, Inc.
    Inventors: David T. Emerson, Michael J. Bergmann, Christopher P. Hussell
  • Patent number: 9041285
    Abstract: A method of manufacturing an LED lamp is disclosed. The method includes admixing an uncured curable liquid resin and a phosphor, dispensing the uncured admixture on an LED chip, centrifuging the chip and the admixture to disperse the phosphor particles in the uncured resin, and curing the resin while the phosphor particles remain distributed.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: May 26, 2015
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, David T. Emerson
  • Patent number: 9041042
    Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: May 26, 2015
    Assignee: Cree, Inc.
    Inventors: Peter Scott Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Amber C. Abare, Jeffrey C. Britt
  • Patent number: D749051
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: February 9, 2016
    Assignee: Cree, Inc.
    Inventors: Joseph G Clark, Amber C Abare, David T Emerson, Jeremy S Nevins, Raymond Rosado