Patents by Inventor David W. Deis

David W. Deis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200068757
    Abstract: An example robot end effector includes a memory module gripper that to selectively grip a memory module, and a CPU gripper that is to selectively grip a processor and/or a heatsink. The CPU gripper is attached to the memory module gripper such that they are movable relative to the one another between a first configuration and a second configuration.
    Type: Application
    Filed: August 23, 2018
    Publication date: February 27, 2020
    Inventors: Jonathon Hughes, David W. Deis
  • Patent number: 7806489
    Abstract: Latch systems for a drive cage assembly are disclosed. In an exemplary embodiment, the latch system may be operated by moving a hinge bracket in a first direction to slide at least one latch on the hinge bracket into an open position. Then receiving a peripheral device in the drive cage assembly in either a tower orientation or a rack orientation when the at least one latch is in the open position. Then moving the hinge bracket in a second direction to slide the at least one latch into a closed position and secure the peripheral device in the drive cage assembly.
    Type: Grant
    Filed: August 5, 2005
    Date of Patent: October 5, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David A. Selvidge, Erik R. Nielsen, David W. Deis
  • Patent number: 7755889
    Abstract: A central air manifold for an electronic module enclosure includes a front section and a rear section. The front section includes openings adapted to communicate with electronic modules and the rear section includes openings adapted to communicate with fans. The openings of the front section can be open when electronic modules are installed in the front section and the openings in the rear section can be open when operating fans are installed in the rear section.
    Type: Grant
    Filed: June 12, 2008
    Date of Patent: July 13, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wade D. Vinson, David W. Sherrod, David W. Deis, Steve Novack
  • Patent number: 7474229
    Abstract: A computer system comprising a computer chassis supporting at least one electronic component, the computer chassis having a volume and at least one interactive surface; an indicator panel supported by the computer chassis and coupled to the electronic component, the indicator panel having a display and an outer edge; wherein the indicator panel comprises a first position wherein the indicator panel is received within an aperture in the interactive surface, the indicator panel and the display are disposed within the chassis volume, and the outer edge is exposed and indicates a condition of the electronic component.
    Type: Grant
    Filed: September 13, 2006
    Date of Patent: January 6, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: John P Franz, Jim B Duke, David M Paquin, Kelly K Smith, Erik R Nielsen, David A Selvidge, David W. Deis, Jeoff M Krontz
  • Publication number: 20080316704
    Abstract: A central air manifold for an electronic module enclosure includes a front section and a rear section. The front section includes openings adapted to communicate with electronic modules and the rear section includes openings adapted to communicate with fans. The openings of the front section can be open when electronic modules are installed in the front section and the openings in the rear section can be open when operating fans are installed in the rear section.
    Type: Application
    Filed: June 12, 2008
    Publication date: December 25, 2008
    Inventors: WADE D. VINSON, David W. Sherrod, David W. Deis, Steve Novack
  • Publication number: 20080068199
    Abstract: A computer system comprising a computer chassis supporting at least one electronic component, the computer chassis having a volume and at least one interactive surface; an indicator panel supported by the computer chassis and coupled to the electronic component, the indicator panel having a display and an outer edge; wherein the indicator panel comprises a first position wherein the indicator panel is received within an aperture in the interactive surface, the indicator panel and the display are disposed within the chassis volume, and the outer edge is exposed and indicates a condition of the electronic component.
    Type: Application
    Filed: September 13, 2006
    Publication date: March 20, 2008
    Inventors: John P. Franz, Jim B. Duke, David M. Paquin, Kelly K. Smith, Erik R. Nielsen, David A. Selvidge, David W. Deis, Jeoff M. Krontz
  • Patent number: 6858792
    Abstract: Embodiments of the present invention overcome the deficiencies of the prior art by providing a tool-less, lever actuated, robust yet tolerant, high load delivery, low-profile component retention assembly for coupling components together. The assembly may include a plate and a lever coupled to the plate.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: February 22, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: John P. Franz, Wade D. Vinson, Joseph R. Allen, David W. Deis
  • Publication number: 20040118584
    Abstract: Embodiments of the present invention overcome the deficiencies of the prior art by providing a tool-less, lever actuated, robust yet tolerant, high load delivery, low-profile component retention assembly for coupling components together. The assembly may comprise a plate and a lever coupled to the plate.
    Type: Application
    Filed: December 19, 2002
    Publication date: June 24, 2004
    Inventors: John P. Franz, Wade D. Vinson, Joseph R. Allen, David W. Deis