Patents by Inventor David W. Helster
David W. Helster has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8382522Abstract: A substrate is disclosed that is configured to receive an electrical component. The substrate comprises a plurality of first vias and a plurality of second vias. The plurality of first vias is arranges in the substrate in a matrix of rows and columns and is configured to provide mounting of the electric component, each first via associated with one of its closest neighbor first via to form a pair. The plurality of second vias is capable of being electrically commoned to one another and is positioned amongst the plurality of first vias such that there is at least one second via positioned directly between each first via and any of the closest non-pair first via neighbors.Type: GrantFiled: July 27, 2011Date of Patent: February 26, 2013Assignee: Tyco Electronics CorporationInventors: Douglas W. Glover, David W. Helster, Timothy R. Minnick, Chad W. Morgan, Evan C. Wickes
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Patent number: 8262412Abstract: An electrical connector includes a contact module that has a lead frame and a dielectric frame that encases the lead frame. The dielectric frame includes opposite sides and a mating edge and a mounting edge. The dielectric frame has voids that extend from the sides to expose the lead frame. The lead frame has a plurality of contacts that have transition portions that extend between mating portions that extend from the mating edge and mounting portions that extend from the mounting edge. The transition portions have compensation segments and intermediate segments between the compensation segments. The intermediate segments are encased in the dielectric frame. The compensation segments are exposed by the voids. The compensation segments have a geometry that differs from a geometry of the intermediate segments.Type: GrantFiled: May 10, 2011Date of Patent: September 11, 2012Assignee: Tyco Electronics CorporationInventors: Timothy R. Minnick, David W. Helster, Alex M. Sharf, Chad W. Morgan
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Patent number: 8221139Abstract: An electrical connector includes a housing having a front and a rear opposite the housing with a rear wall at the rear. The housing has a slot open through the front that receives a mating connector therein. The housing has contact openings through the rear wall and a ground clip channel in the rear wall open at the rear. Signal contacts are held in the housing and arranged in pairs. The signal contacts are received in corresponding contact openings and are arranged within the slot to mate with the mating connector. Ground contacts are held in the housing and are arranged between corresponding signal contacts. The ground contacts are received in corresponding contact openings and are arranged within the slot to mate with the mating connector. A ground clip is loaded into the ground clip channel. The ground clip engages the ground contacts to create a ground circuit between the ground contacts engaged by the ground clip.Type: GrantFiled: September 13, 2010Date of Patent: July 17, 2012Assignee: Tyco Electronics CorporationInventors: Jie Qin, Steven J. Millard, David W. Helster
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Patent number: 8167651Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: GrantFiled: May 29, 2009Date of Patent: May 1, 2012Assignee: Tyco Electronics CorporationInventors: Douglas W. Glover, David W. Helster, Timothy R. Minnick, Chad W. Morgan, Evan C. Wickes
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Patent number: 8142236Abstract: An electrical terminal of the type to be inserted into an aperture of an electrical panel member is provided. The electrical terminal may include a base, an insertion portion extending from the base to a first end, a slit formed through the insertion portion and defining a compliant portion having a first leg and a second leg. A segment of the first leg may be deformed in one direction, while a segment of the second leg may deformed in the opposite direction. Midpoints of each or both legs may be offset from the midpoint of the slit to achieve improved mechanical and electrical performance within a connector. Also provided is an electrical terminal having a tip that facilitates alignment with a panel member aperture and provides tactile feedback to a user, as well as an electrical terminal having a mounting end that is substantially smaller than its mating end, and connectors containing such terminals. Methods of routing electrical traces between adjacent electrical terminals are also provided.Type: GrantFiled: January 25, 2008Date of Patent: March 27, 2012Assignee: Tyco Electronics CorporationInventors: James L. Fedder, Douglas W. Glover, David W. Helster, Chad W. Morgan, Brent Rothermel, Alex M. Sharf, Attalee S. Taylor, David A. Trout
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Publication number: 20120064743Abstract: An electrical connector includes a housing having a front and a rear opposite the housing with a rear wall at the rear. The housing has a slot open through the front that receives a mating connector therein. The housing has contact openings through the rear wall and a ground clip channel in the rear wall open at the rear. Signal contacts are held in the housing and arranged in pairs. The signal contacts are received in corresponding contact openings and are arranged within the slot to mate with the mating connector. Ground contacts are held in the housing and are arranged between corresponding signal contacts. The ground contacts are received in corresponding contact openings and are arranged within the slot to mate with the mating connector. A ground clip is loaded into the ground clip channel. The ground clip engages the ground contacts to create a ground circuit between the ground contacts engaged by the ground clip.Type: ApplicationFiled: September 13, 2010Publication date: March 15, 2012Applicant: TYCO ELECTRONIC CORPORATIONInventors: Jie QIN, Steven J. MILLARD, David W. HELSTER
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Publication number: 20110278057Abstract: A substrate is disclosed that is configured to receive an electrical component. The substrate comprises a plurality of first vias and a plurality of second vias. The plurality of first vias is arranges in the substrate in a matrix of rows and columns and is configured to provide mounting of the electric component, each first via associated with one of its closest neighbor first via to form a pair. The plurality of second vias is capable of being electrically commoned to one another and is positioned amongst the plurality of first vias such that there is at least one second via positioned directly between each first via and any of the closest non-pair first via neighbors.Type: ApplicationFiled: July 27, 2011Publication date: November 17, 2011Inventors: Douglas W. Glover, David W. Helster, Timothy R. Minnick, Chad W. Morgan, Evan C. Wickes
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Patent number: 8016616Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: GrantFiled: May 29, 2009Date of Patent: September 13, 2011Assignee: Tyco Electronics CorporationInventors: Douglas W. Glover, David W. Helster, Timothy R. Minnick, Chad W. Morgan, Evan C. Wickes
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Patent number: 7976318Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: GrantFiled: May 29, 2009Date of Patent: July 12, 2011Assignee: Tyco Electronics CorporationInventors: James L. Fedder, Douglas W. Glover, David W. Helster, John E. Knaub, Timothy R. Minnick, Chad W. Morgan, Alex M. Sharf, Lynn R. Sipe, Evan Charles Wickes
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Patent number: 7927143Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: GrantFiled: May 29, 2009Date of Patent: April 19, 2011Assignee: Tyco Electronics CorporationInventors: David W. Helster, John E. Knaub, Peter C. O'Donnell, Timothy R. Minnick, Chad W. Morgan, Lynn R. Sipe
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Patent number: 7789716Abstract: An electrical terminal of the type to be inserted into an aperture of an electrical panel member is provided. The electrical terminal may include a base, an insertion portion extending from the base to a first end, a slit formed through the insertion portion and defining a compliant portion having a first leg and a second leg. A segment of the first leg may be deformed in one direction, while a segment of the second leg may deformed in the opposite direction. Midpoints of each or both legs may be offset from the midpoint of the slit to achieve improved mechanical and electrical performance within a connector. Also provided is an electrical terminal having a tip that facilitates alignment with a panel member aperture and provides tactile feedback to a user, as well as an electrical terminal having a mounting end that is substantially smaller than its mating end, and connectors containing such terminals. Methods of routing electrical traces between adjacent electrical terminals are also provided.Type: GrantFiled: May 8, 2009Date of Patent: September 7, 2010Assignee: Tyco Electronics CorporationInventors: James L. Fedder, Douglas W. Glover, David W. Helster, Chad W. Morgan, Brent Rothermel, Alex M. Sharf, Attalee S. Taylor, David A. Trout
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Patent number: 7775802Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: GrantFiled: May 29, 2009Date of Patent: August 17, 2010Assignee: Tyco Electronics CorporationInventors: George R. Defibaugh, James L. Fedder, Douglas W. Glover, David W. Helster, John E. Knaub, Timothy R. Minnick, Chad W. Morgan, Alex M. Sharf, Lynn R. Sipe, Evan C. Wickes
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Publication number: 20100144167Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: ApplicationFiled: May 29, 2009Publication date: June 10, 2010Inventors: James L. Fedder, Douglas W. Glover, David W. Helster, John E. Knaub, Timothy R. Minnick, Chad W. Morgan, Alex M. Sharf, Lynn R. Sipe, Evan Charles Wickes
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Publication number: 20100144169Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: ApplicationFiled: May 29, 2009Publication date: June 10, 2010Inventors: Douglas W. Glover, David W. Helster, Timothy R. Minnick, Chad W. Morgan, Evan C. Wickes
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Publication number: 20100144201Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: ApplicationFiled: May 29, 2009Publication date: June 10, 2010Inventors: George R. Defibaugh, James L. Fedder, Douglas W. Glover, David W. Helster, John E. Knaub, Timothy R. Minnick, Chad W. Morgan, Alex M. Sharf, Lynn R. Sipe, Evan C. Wickes
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Publication number: 20100144175Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: ApplicationFiled: May 29, 2009Publication date: June 10, 2010Inventors: David W. Helster, John E. Knaub, Peter C. O'Donnell, Timothy R. Minnick, Chad W. Morgan, Lynn R. Sipe
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Publication number: 20100144168Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: ApplicationFiled: May 29, 2009Publication date: June 10, 2010Inventors: Douglas W. Glover, David W. Helster, Timothy R. Minnick, Chad W. Morgan, Evan C. Wickes
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Patent number: 7651373Abstract: An electrical connector includes a housing defining a connector mating interface. The housing holds a plurality of contact modules that cooperate to define a connector mounting interface. Each contact module contains signal leads and ground leads arranged in an alternating pattern of individual ground leads and pairs of signal leads positioned side-by-side with respect to a thickness of the contact module. The signal and ground leads have respective mating contacts proximate the mating interface and respective mounting contacts proximate the mounting interface. The mating and mounting contacts within each contact module are arranged in one of first and second contact patterns different from the pattern of the signal and ground leads. The mating and mounting contacts in adjacent contact modules are arranged in respective different ones of the first and second contact patterns.Type: GrantFiled: March 26, 2008Date of Patent: January 26, 2010Assignee: Tyco Electronics CorporationInventors: John E. Knaub, Lynn Robert Sipe, David W. Helster, Timothy R. Minnick, Douglas W. Glover
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Publication number: 20090246980Abstract: An electrical connector includes a housing defining a connector mating interface. The housing holds a plurality of contact modules that cooperate to define a connector mounting interface. Each contact module contains signal leads and ground leads arranged in an alternating pattern of individual ground leads and pairs of signal leads positioned side-by-side with respect to a thickness of the contact module. The signal and ground leads have respective mating contacts proximate the mating interface and respective mounting contacts proximate the mounting interface. The mating and mounting contacts within each contact module are arranged in one of first and second contact patterns different from the pattern of the signal and ground leads. The mating and mounting contacts in adjacent contact modules are arranged in respective different ones of the first and second contact patterns.Type: ApplicationFiled: March 26, 2008Publication date: October 1, 2009Inventors: JOHN E. KNAUB, Lynn Robert Sipe, David W. Helster, Timothy R. Minnick, Douglas W. Glover
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Patent number: 7591655Abstract: An electrical terminal of the type to be inserted into an aperture of an electrical panel member is provided. The electrical terminal may include a base, an insertion portion extending from the base to a first end, a slit formed through the insertion portion and defining a compliant portion having a first leg and a second leg. A segment of the first leg may be deformed in one direction, while a segment of the second leg may deformed in the opposite direction. Midpoints of each or both legs may be offset from the midpoint of the slit to achieve improved mechanical and electrical performance within a connector. Also provided is an electrical terminal having a tip that facilitates alignment with a panel member aperture and provides tactile feedback to a user, as well as an electrical terminal having a mounting end that is substantially smaller than its mating end, and connectors containing such terminals. Methods of routing electrical traces between adjacent electrical terminals are also provided.Type: GrantFiled: January 25, 2008Date of Patent: September 22, 2009Assignee: Tyco Electronics CorporationInventors: James L. Fedder, Douglas W. Glover, David W. Helster, Chad W. Morgan, Brent Rothermel, Alex M. Sharf, Attalee S. Taylor, David A. Trout