Patents by Inventor David Wen-Lung Chang

David Wen-Lung Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6861464
    Abstract: A two component, curable hot melt adhesive system includes a first hot melt adhesive formulation which has a softening temperature greater than room temperature and which includes a first component of a curable adhesive therein. The system includes a second hot melt adhesive formulation which has a softening temperature which is greater than room temperature and which includes a second component of a curable adhesive therein. The second component is reactive with the first component to provide a cured adhesive bond. In use, the two formulations are heated to a temperature above their softening temperature and are contacted so as to cause mixing. The mixture cools to provide a thermoplastic bond which subsequently cures to provide a permanent adhesive bond. While the first and the second component individually perform as hot melt adhesives, combining the first and the second gives enhanced adhesive performance in extended temperature ranges.
    Type: Grant
    Filed: July 19, 2002
    Date of Patent: March 1, 2005
    Assignee: Diversified Chemical Technologies, Inc.
    Inventors: Rajan Eadara, Mooil Chung, David Wen-Lung Chang, Sunny K. George, Patrick A. Ohaka, Joribeth E. Joseff, Yushin Ahn
  • Publication number: 20040014866
    Abstract: A two component, curable hot melt adhesive system includes a first hot melt adhesive formulation which has a softening temperature greater than room temperature and which includes a first component of a curable adhesive therein. The system includes a second hot melt adhesive formulation which has a softening temperature which is greater than room temperature and which includes a second component of a curable adhesive therein. The second component is reactive with the first component to provide a cured adhesive bond. In use, the two formulations are heated to a temperature above their softening temperature and are contacted so as to cause mixing. The mixture cools to provide a thermoplastic bond which subsequently cures to provide a permanent adhesive bond. While the first and the second component individually perform as hot melt adhesives, combining the first and the second gives enhanced adhesive performance in extended temperature ranges.
    Type: Application
    Filed: July 19, 2002
    Publication date: January 22, 2004
    Inventors: Rajan Eadara, Mooil Chung, David Wen-Lung Chang, Sunny K. George, Patrick A. Ohaka, Joribeth E. Joseff, Yushin Ahn
  • Patent number: 6210517
    Abstract: A radiation curable precursor coating composition for the preparation of a non-blocking, heat activatable adhesive includes a curable acrylic material, a curable elastomeric material, and a hydrocarbon tackifier material having a softening temperature ranging from approximately 50° C. to approximately 200° C., wherein when the acrylic material and the elastomeric material are cured, the coating composition is non-blocking at room temperature, but when the coating composition is heated to a temperature above both the softening temperature of the hydrocarbon tackifier and the Tg of the coating composition, the coating composition becomes adhesive.
    Type: Grant
    Filed: April 13, 1999
    Date of Patent: April 3, 2001
    Assignee: Diversified Chemical Technologies, Inc.
    Inventors: Rajan Eadara, Mooil Chung, David Wen-Lung Chang, Weichen Chi