Patents by Inventor David Wen

David Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040012688
    Abstract: Large area cameras that sense light using charge coupled devices are provided. The large area cameras have a scintillator that senses short wavelength (e.g. x-rays) radiation and provides light at a longer wavelength. Optical fibers transmit the light to charge coupled devices arranged in an M×N array. Subsets of the image signals can be summed together to increase signal strength and frame rate. The image signals can be amplified and digitized to accomplish image reconstruction in near-real time for a plurality of CCDs. To accomplish image reconstruction in near-real time for a plurality of CCDs, the digitized signals for one image frame are stored in first memory circuits, while image signals from another frame are read out of second memory circuits. The image signal are written into and read out of the memory circuits in configurations that are independent of the orientation of the CCDs within the CCD array.
    Type: Application
    Filed: July 16, 2002
    Publication date: January 22, 2004
    Applicant: Fairchild Imaging
    Inventors: Natale F. Tinnerino, David Wen, Edward Leon Guerrero, Douglas Debs, Dan Laxson
  • Publication number: 20040014866
    Abstract: A two component, curable hot melt adhesive system includes a first hot melt adhesive formulation which has a softening temperature greater than room temperature and which includes a first component of a curable adhesive therein. The system includes a second hot melt adhesive formulation which has a softening temperature which is greater than room temperature and which includes a second component of a curable adhesive therein. The second component is reactive with the first component to provide a cured adhesive bond. In use, the two formulations are heated to a temperature above their softening temperature and are contacted so as to cause mixing. The mixture cools to provide a thermoplastic bond which subsequently cures to provide a permanent adhesive bond. While the first and the second component individually perform as hot melt adhesives, combining the first and the second gives enhanced adhesive performance in extended temperature ranges.
    Type: Application
    Filed: July 19, 2002
    Publication date: January 22, 2004
    Inventors: Rajan Eadara, Mooil Chung, David Wen-Lung Chang, Sunny K. George, Patrick A. Ohaka, Joribeth E. Joseff, Yushin Ahn
  • Patent number: 6210517
    Abstract: A radiation curable precursor coating composition for the preparation of a non-blocking, heat activatable adhesive includes a curable acrylic material, a curable elastomeric material, and a hydrocarbon tackifier material having a softening temperature ranging from approximately 50° C. to approximately 200° C., wherein when the acrylic material and the elastomeric material are cured, the coating composition is non-blocking at room temperature, but when the coating composition is heated to a temperature above both the softening temperature of the hydrocarbon tackifier and the Tg of the coating composition, the coating composition becomes adhesive.
    Type: Grant
    Filed: April 13, 1999
    Date of Patent: April 3, 2001
    Assignee: Diversified Chemical Technologies, Inc.
    Inventors: Rajan Eadara, Mooil Chung, David Wen-Lung Chang, Weichen Chi
  • Patent number: 5700587
    Abstract: The invention relates to the use of a resorcinol-glutaraldehyde reaction product as an accelerator for thermosetting phenolic resin and to a method of making the accelerator. Further, the invention relates to a resin blend comprising phenol-formaldehyde and the accelerator and a process for making cellulosic board, oriented strandboard and plywood wherein the binder for the cellulosic board, oriented strandboard and plywood in its uncured form comprises the resin blend of the invention. In another embodiment the accelerator for thermosetting resin comprises resorcinol and glutaraldehyde.
    Type: Grant
    Filed: April 13, 1995
    Date of Patent: December 23, 1997
    Assignee: Borden Chemical, Inc.
    Inventors: David Wen-I Shiau, William David Detlefsen, Earl Kay Phillips
  • Patent number: 5059488
    Abstract: This invention relates to ethyleneurea-glutaraldehyde resins, urea-ethyleneurea-glutaraldehyde resins, their synthesis, as well as their application as an adhesive for wood panel manufacture. Molar ratio of ethyleneurea to glutaraldehyde can range from 0.3 to 3.5. Urea incorporated into ethyleneurea-glutaraldehyde resin can be high as two times the moles of glutaraldehyde used in the formulation and can be introduced at any stage during the reaction course, simply post added, or any combination of the above.
    Type: Grant
    Filed: August 24, 1990
    Date of Patent: October 22, 1991
    Assignee: Borden, Inc.
    Inventors: William D. Detlefsen, David Wen-I-Shiau, Nicholas K. Daisy