Abstract: Methods and systems for performing co-located measurements of semiconductor structures with two or more measurement subsystems are presented herein. To achieve a sufficiently small measurement box size, the metrology system monitors and corrects the alignment of the measurement spot of each metrology subsystem with a metrology target to achieve maximum co-location of the measurement spots of each metrology subsystem with the metrology target. In another aspect, measurements are performed simultaneously by two or more metrology subsystems at high throughput at the same wafer location. Furthermore, the metrology system effectively decouples simultaneously acquired measurement signals associated with each measurement subsystem. This maximizes signal information associated with simultaneous measurements of the same metrology by two or more metrology subsystems.

Abstract: Methods and systems for performing semiconductor measurements based on hyperspectral imaging are presented herein. A hyperspectral imaging system images a wafer over a large field of view with high pixel density over a broad range of wavelengths. Image signals collected from a measurement area are detected at a number of pixels. The detected image signals from each pixel are spectrally analyzed separately. In some embodiments, the illumination and collection optics of a hyperspectral imaging system include fiber optical elements to direct illumination light from the illumination source to the measurement area on the surface of the specimen under measurement and fiber optical elements to image the measurement area. In another aspect, a fiber optics collector includes an image pixel mapper that couples a two dimensional array of collection fiber optical elements into a one dimensional array of pixels at the spectrometer and the hyperspectral detector.

Abstract: Methods and systems for performing spectroscopic measurements of semiconductor structures including ultraviolet, visible, and infrared wavelengths greater than two micrometers are presented herein. A spectroscopic measurement system includes a combined illumination source including a first illumination source that generates ultraviolet, visible, and near infrared wavelengths (wavelengths less than two micrometers) and a second illumination source that generates mid infrared and long infrared wavelengths (wavelengths of two micrometers and greater). Furthermore, the spectroscopic measurement system includes one or more measurement channels spanning the range of illumination wavelengths employed to perform measurements of semiconductor structures. In some embodiments, the one or more measurement channels simultaneously measure the sample throughout the wavelength range. In some other embodiments, the one or more measurement channels sequentially measure the sample throughout the wavelength range.

Abstract: The system includes a modulatable illumination source configured to illuminate a surface of a sample disposed on a sample stage, a detector configured to detect illumination emanating from a surface of the sample, illumination optics configured to direct illumination from the modulatable illumination source to the surface of the sample, collection optics configured to direct illumination from the surface of the sample to the detector, and a modulation control system communicatively coupled to the modulatable illumination source, wherein the modulation control system is configured to modulate a drive current of the modulatable illumination source at a selected modulation frequency suitable for generating illumination having a selected coherence feature length. In addition, the present invention includes the time-sequential interleaving of outputs of multiple light sources to generate periodic pulse trains for use in multi-wavelength time-sequential optical metrology.

Abstract: An article is prepared with surface regions having different contact angles. A reactive silane material is attached to a surface having a reactive tail component that is contacted with a first corresponding reactant, followed by imagewise UV exposure to cause imagewise reaction of the reactive tail component and first corresponding reactant, forming reacted regions and latent reaction regions. After rinsing, a second corresponding reactant that is capable of reaction with the reactive moiety is applied. Uniform UV exposure leads to a second reaction product only in the latent reaction regions. After rinsing, first regions comprise exclusively the first reaction product and second regions comprising exclusively the second reaction product. These first and second regions have contact angles that differ by 10-110 degrees. A composition can be applied that is exclusively attracted to either the first regions or the second regions, but not to both the first and second regions.

Abstract: Methods and systems for performing spectroscopic reflectometry measurements of semiconductor structures at infrared wavelengths are presented herein. In some embodiments measurement wavelengths spanning a range from 750 nanometers to 2,600 nanometers, or greater, are employed. In one aspect, reflectometry measurements are performed at oblique angles to reduce the influence of backside reflections on measurement results. In another aspect, a broad range of infrared wavelengths are detected by a detector that includes multiple photosensitive areas having different sensitivity characteristics. Collected light is linearly dispersed across the surface of the detector according to wavelength. Each different photosensitive area is arranged on the detector to sense a different range of incident wavelengths. In this manner, a broad range of wavelengths are detected with high signal to noise ratio by a single detector.

Abstract: The system includes a modulatable illumination source configured to illuminate a surface of a sample disposed on a sample stage, a detector configured to detect illumination emanating from a surface of the sample, illumination optics configured to direct illumination from the modulatable illumination source to the surface of the sample, collection optics configured to direct illumination from the surface of the sample to the detector, and a modulation control system communicatively coupled to the modulatable illumination source, wherein the modulation control system is configured to modulate a drive current of the modulatable illumination source at a selected modulation frequency suitable for generating illumination having a selected coherence feature length. In addition, the present invention includes the time-sequential interleaving of outputs of multiple light sources to generate periodic pulse trains for use in multi-wavelength time-sequential optical metrology.

Abstract: An article is prepared with surface regions having different contact angles. A reactive silane material is attached to a surface having a reactive tail component that is contacted with a first corresponding reactant, followed by imagewise UV exposure to cause imagewise reaction of the reactive tail component and first corresponding reactant, forming reacted regions and latent reaction regions. After rinsing, a second corresponding reactant that is capable of reaction with the reactive moiety is applied. Uniform UV exposure leads to a second reaction product only in the latent reaction regions. After rinsing, first regions comprise exclusively the first reaction product and second regions comprising exclusively the second reaction product. These first and second regions have contact angles that differ by 10-110 degrees. A composition can be applied that is exclusively attracted to either the first regions or the second regions, but not to both the first and second regions.

Abstract: Methods and systems for performing spectroscopic measurements of semiconductor structures including ultraviolet, visible, and infrared wavelengths greater than two micrometers are presented herein. A spectroscopic measurement system includes a combined illumination source including a first illumination source that generates ultraviolet, visible, and near infrared wavelengths (wavelengths less than two micrometers) and a second illumination source that generates mid infrared and long infrared wavelengths (wavelengths of two micrometers and greater). Furthermore, the spectroscopic measurement system includes one or more measurement channels spanning the range of illumination wavelengths employed to perform measurements of semiconductor structures. In some embodiments, the one or more measurement channels simultaneously measure the sample throughout the wavelength range. In some other embodiments, the one or more measurement channels sequentially measure the sample throughout the wavelength range.

Abstract: Methods and systems for performing broadband spectroscopic metrology with reduced sensitivity to focus errors are presented herein. Significant reductions in sensitivity to focus position error are achieved by imaging the measurement spot onto the detector such that the direction aligned with the plane of incidence on the wafer surface is oriented perpendicular to the direction of wavelength dispersion on the detector surface. This reduction in focus error sensitivity enables reduced focus accuracy and repeatability requirements, faster focus times, and reduced sensitivity to wavelength errors without compromising measurement accuracy. In a further aspect, the dimension of illumination field projected on the wafer plane in the direction perpendicular to the plane of incidence is adjusted to optimize the resulting measurement accuracy and speed based on the nature of target under measurement.

Abstract: Methods and systems for performing spectroscopic reflectometry measurements of semiconductor structures at infrared wavelengths are presented herein. In some embodiments measurement wavelengths spanning a range from 750 nanometers to 2,600 nanometers, or greater, are employed. In one aspect, reflectometry measurements are performed at oblique angles to reduce the influence of backside reflections on measurement results. In another aspect, a broad range of infrared wavelengths are detected by a detector that includes multiple photosensitive areas having different sensitivity characteristics. Collected light is linearly dispersed across the surface of the detector according to wavelength. Each different photosensitive area is arranged on the detector to sense a different range of incident wavelengths. In this manner, a broad range of wavelengths are detected with high signal to noise ratio by a single detector.

Abstract: Methods and systems for performing simultaneous spectroscopic measurements of semiconductor structures over a broad range of angles of incidence (AOI), azimuth angles, or both, are presented herein. Spectra including two or more sub-ranges of angles of incidence, azimuth angles, or both, are simultaneously measured over different sensor areas at high throughput. Collected light is linearly dispersed across different photosensitive areas of one or more detectors according to wavelength for each subrange of AOIs, azimuth angles, or both. Each different photosensitive area is arranged on the one or more detectors to perform a separate spectroscopic measurement for each different range of AOIs, azimuth angles, or both. In this manner, a broad range of AOIs, azimuth angles, or both, are detected with high signal to noise ratio, simultaneously. This approach enables high throughput measurements of high aspect ratio structures with high throughput, precision, and accuracy.

Abstract: Methods and systems for performing simultaneous spectroscopic measurements of semiconductor structures at ultraviolet, visible, and infrared wavelengths are presented herein. In another aspect, wavelength errors are reduced by orienting the direction of wavelength dispersion on the detector surface perpendicular to the projection of the plane of incidence onto the detector surface. In another aspect, a broad range of infrared wavelengths are detected by a detector that includes multiple photosensitive areas having different sensitivity characteristics. Collected light is linearly dispersed across the surface of the detector according to wavelength. Each different photosensitive area is arranged on the detector to sense a different range of incident wavelengths. In this manner, a broad range of infrared wavelengths are detected with high signal to noise ratio by a single detector. These features enable high throughput measurements of high aspect ratio structures with high throughput, precision, and accuracy.

Abstract: A rotatable compensator configured to transmit non-collimated light over a broad range of wavelengths, including ultraviolet, with a high degree of retardation uniformity across the aperture is presented. In one embodiment, a rotatable compensator includes a stack of four individual plates in optical contact. The two thin plates in the middle of the stack are made from a birefringent material and are arranged to form a compound, zeroth order bi-plate. The remaining two plates are relatively thick and are made from an optically isotropic material. These plates are disposed on either end of the compound, zeroth order bi-plate. The low order plates minimize the sensitivity of retardation across the aperture to non-collimated light. Materials are selected to ensure transmission of ultraviolet light. The optically isotropic end plates minimize coherence effects induced at the optical interfaces of the thin plates.

Abstract: Methods and systems for performing simultaneous spectroscopic measurements of semiconductor structures over a broad range of angles of incidence (AOI), azimuth angles, or both, are presented herein. Spectra including two or more sub-ranges of angles of incidence, azimuth angles, or both, are simultaneously measured over different sensor areas at high throughput. Collected light is linearly dispersed across different photosensitive areas of one or more detectors according to wavelength for each subrange of AOIs, azimuth angles, or both. Each different photosensitive area is arranged on the one or more detectors to perform a separate spectroscopic measurement for each different range of AOIs, azimuth angles, or both. In this manner, a broad range of AOIs, azimuth angles, or both, are detected with high signal to noise ratio, simultaneously. This approach enables high throughput measurements of high aspect ratio structures with high throughput, precision, and accuracy.

Abstract: The present invention relates to a finger-driven computer mouse. The finger-driven computer mouse includes a mouse housing and finger retention device adjacent thereto. The user inserts his or her finger tips in the finger retention device and can position the mouse across a flat surface by actions of the fingers except the thumb which is used to operate mouse buttons arranged on a side surface. The finger-driven mouse allows the wrist and hand muscles to be in a relaxed, natural posture.

Abstract: Methods and systems for performing simultaneous spectroscopic measurements of semiconductor structures at ultraviolet, visible, and infrared wavelengths are presented herein. In another aspect, wavelength errors are reduced by orienting the direction of wavelength dispersion on the detector surface perpendicular to the projection of the plane of incidence onto the detector surface. In another aspect, a broad range of infrared wavelengths are detected by a detector that includes multiple photosensitive areas having different sensitivity characteristics. Collected light is linearly dispersed across the surface of the detector according to wavelength. Each different photosensitive area is arranged on the detector to sense a different range of incident wavelengths. In this manner, a broad range of infrared wavelengths are detected with high signal to noise ratio by a single detector. These features enable high throughput measurements of high aspect ratio structures with high throughput, precision, and accuracy.

Abstract: A rotatable compensator configured to transmit non-collimated light over a broad range of wavelengths, including ultraviolet, with a high degree of retardation uniformity across the aperture is presented. In one embodiment, a rotatable compensator includes a stack of four individual plates in optical contact. The two thin plates in the middle of the stack are made from a birefringent material and are arranged to form a compound, zeroth order bi-plate. The remaining two plates are relatively thick and are made from an optically isotropic material. These plates are disposed on either end of the compound, zeroth order bi-plate. The low order plates minimize the sensitivity of retardation across the aperture to non-collimated light. Materials are selected to ensure transmission of ultraviolet light. The optically isotropic end plates minimize coherence effects induced at the optical interfaces of the thin plates.

Abstract: The system includes a modulatable illumination source configured to illuminate a surface of a sample disposed on a sample stage, a detector configured to detect illumination emanating from a surface of the sample, illumination optics configured to direct illumination from the modulatable illumination source to the surface of the sample, collection optics configured to direct illumination from the surface of the sample to the detector, and a modulation control system communicatively coupled to the modulatable illumination source, wherein the modulation control system is configured to modulate a drive current of the modulatable illumination source at a selected modulation frequency suitable for generating illumination having a selected coherence feature length. In addition, the present invention includes the time-sequential interleaving of outputs of multiple light sources to generate periodic pulses trains for use in multi-wavelength time-sequential optical metrology.

Abstract: A rotatable compensator configured to transmit non-collimated light over a broad range of wavelengths, including ultraviolet, with a high degree of retardation uniformity across the aperture is presented. In one embodiment, a rotatable compensator includes a stack of four individual plates in optical contact. The two thin plates in the middle of the stack are made from a birefringent material and are arranged to form a compound, zeroth order bi-plate. The remaining two plates are relatively thick and are made from an optically isotropic material. These plates are disposed on either end of the compound, zeroth order bi-plate. The low order plates minimize the sensitivity of retardation across the aperture to non-collimated light. Materials are selected to ensure transmission of ultraviolet light. The optically isotropic end plates minimize coherence effects induced at the optical interfaces of the thin plates.