Patents by Inventor Deepak Mahulikar

Deepak Mahulikar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5213638
    Abstract: There is provided a composite copper alloy having a copper alloy core and a modified surface layer containing a nitride or carbide film. Alternatively, the modified surface layer may contain a carbo-nitride film. The alloy is formed by reacting a copper alloy with nitrogen, carbon or a nitrogen/carbon mixture at elevated temperatures. The resultant surface layer improves the tribological and mechanical properties of the alloy while maintaining useful electrical conductivity.
    Type: Grant
    Filed: January 30, 1992
    Date of Patent: May 25, 1993
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Brian Mravic
  • Patent number: 5155299
    Abstract: The present invention relates to a packagae adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than cooper based packages and better thermal conductivity than plastic based packages.
    Type: Grant
    Filed: June 10, 1991
    Date of Patent: October 13, 1992
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, James M. Popplewell
  • Patent number: 5122858
    Abstract: A composite leadframe for electronic packages is provided. A polymer layer coats a portion of the leadframe. The polymer layer increases the adhesive bond between the leadframe and a molding resin. Water vapor does not accumulate under the leads and die attach paddle minimizing the popcorn effect.
    Type: Grant
    Filed: September 10, 1990
    Date of Patent: June 16, 1992
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Julius C. Fister, Gerald N. Violette
  • Patent number: 5103292
    Abstract: A metal pin grid array package and a process for the assembly of the package is provided. The package includes a metal or metal alloy base component having an ordered array of holes. Terminal pins are electrically interconnected to a desired circuit and extend through the ordered array of holes. A dielectric polymer sealant bonds a cover component to both the circuit and to the base component. During package assembly, the polymer sealant flows into the holes comprising the ordered array of holes electrically isolating the terminal pins from the base component.
    Type: Grant
    Filed: November 29, 1989
    Date of Patent: April 7, 1992
    Assignee: Olin Corporation
    Inventor: Deepak Mahulikar
  • Patent number: 5098864
    Abstract: A metal pin grid array package and a process for the assembly of the package is provided. The package includes a metal or metal alloy base component having an ordered array of holes. Terminal pins are electrically interconnected to a desired circuit and extend through the ordered array of holes. A dielectric polymer sealant bonds a cover component to both the circuit and to the base component. During package assembly, the polymer sealant flows into the holes comprising the ordered array of holes electrically isolating the terminal pins from the base component.
    Type: Grant
    Filed: January 14, 1991
    Date of Patent: March 24, 1992
    Assignee: Olin Corporation
    Inventor: Deepak Mahulikar
  • Patent number: 5096508
    Abstract: A composite copper alloy having a modified surface is provided. An element or combination of elements both soluble in copper and reactive with nitrogen are cast with copper or a copper alloy forming a solid state solution. The alloy is reacted with a nitride former to modify the surface. A continuous surface film is formed by heating in a nitrogen containing gas. A dispersion of nitride precipitate in a copper matrix is formed by implanting nitrogen ions.
    Type: Grant
    Filed: July 27, 1990
    Date of Patent: March 17, 1992
    Assignee: Olin Corporation
    Inventors: John F. Breedis, George J. Muench, Deepak Mahulikar
  • Patent number: 5066368
    Abstract: A process for producing electronic package components from an aluminum alloy is disclosed. The components have a black color through integral color anodization. The desired color, thickness and surface finish are achieved by regulation of amperage during anodization. The amperage is rapidly raised to in excess of 70 amps per square foot and then allowed to gradually decrease as a function of oxide growth while the voltage is maintained in excess of 70 volts.
    Type: Grant
    Filed: August 17, 1990
    Date of Patent: November 19, 1991
    Assignee: Olin Corporation
    Inventors: Anthony M. Pasqualoni, Deepak Mahulikar, Satish K. Jalota, Andrew J. Brock
  • Patent number: 5043534
    Abstract: A metal electronic package is provided having improved electromagnetic interference shielding. Metal base and cover components are electrically interconnected to remain at same voltage potential thereby reducing EMI induced mutual inductance. An electrically conductive conduit, such as a contact pin, provides interconnection. If the electronic device is mounted on a chip pad attach, the conductive conduit also connects to the support pads of the chip attach.
    Type: Grant
    Filed: July 2, 1990
    Date of Patent: August 27, 1991
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Jeffrey S. Braden, Stephen P. Noe
  • Patent number: 5024883
    Abstract: The present invention is directed to components and the process of forming the components for housing semiconductor devices. The components are formed of a unique ceramic-glass-metal composite material comprising ceramic particles, metallic particles and a glass matrix with said ceramic and metallic particles dispersed throughout. Metal elements can be embedded into the material to enable simplified fabrication of devices such as semiconductor packaging.
    Type: Grant
    Filed: September 14, 1989
    Date of Patent: June 18, 1991
    Assignee: Olin Corporation
    Inventors: Narendra N. SinghDeo, Deepak Mahulikar, Sheldon H. Butt
  • Patent number: 5023398
    Abstract: The present invention relates to a package adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than copper based packages and better thermal conductivity than plastic based packages.
    Type: Grant
    Filed: April 4, 1990
    Date of Patent: June 11, 1991
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, James M. Popplewell
  • Patent number: 5020439
    Abstract: A baseplug for a target-penetrating projectile containing an explosive in which the baseplug is fabricated in two components each preferably fabricated from a powdered pyrophoric material. The powdered pyrophoric material may be zirconium or titanium or alloys thereof which is charged with hydrogen which upon burning of the baseplug is released to increase the fine start capability of the projectile.
    Type: Grant
    Filed: May 5, 1989
    Date of Patent: June 4, 1991
    Assignee: Olin Corporation
    Inventors: Joseph Winter, Deepak Mahulikar, Frank N. Mandigo
  • Patent number: 5015803
    Abstract: Composite materials for electronic packages are disclosed. The composite materials comprise a core layer and first and second cladding layers. The core and cladding layer compositions and thicknesses are selected to maximize thermal and electrical conductivity and to minimize the coefficient of thermal expansion of the composite. The composite material may be employed to fashion the package base, the leadframe, a heat spreader or combinations thereof. In one embodiment, a portion of the first cladding layer is removed so that an electronic device may be mounted directly to a high thermal conductivity core.
    Type: Grant
    Filed: May 31, 1989
    Date of Patent: May 14, 1991
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Jacob Crane, Abid A. Khan
  • Patent number: 5013871
    Abstract: A kit for the assembly of an adhesively sealed package designed to encase an electronic device is provided. The kit comprises a metallic base and cover components which are adapted to receive a polymeric adhesive. At least those portions of the base and cover component which will contact the polymeric adhesive are provided with a coating of a second metal or oxide. In one embodiment, first, second and third dry film adhesives are tacked to the base and cover components.
    Type: Grant
    Filed: January 8, 1990
    Date of Patent: May 7, 1991
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Jacob Crane, Jeffrey S. Braden
  • Patent number: 4978052
    Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component is disposed between the substrate and the semiconductor die to withstand stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed to the substrate with a layer of solder. The layer of solder is provided to dissipate stresses created by thermal cycling of the substrate and the die. The die is sealed to the buffer with a silver-glass adhesive.
    Type: Grant
    Filed: August 28, 1989
    Date of Patent: December 18, 1990
    Assignee: Olin Corporation
    Inventors: Julius C. Fister, Satyam C. Cherukuri, Deepak Mahulikar, Brian E. O'Donnelly
  • Patent number: 4961106
    Abstract: A package adapted to encase an electronic component is disclosed. The package comprises a metallic lid component disposed on a metallic base component to form an enclosure adapted to receive said electronic component. A metallic leadframe is disposed between the base and lid components and is glass or polymer sealed therebetween. The base component is split into first and second base layers which are bonded together at their interface with a layer of electrically insulating glass or polymer. In one embodiment, the first and second base layers are bonded only around the edges of their interface, with the internal cavity thereby formed filled with a fluid or powder to enhance heat transfer between the layers. A fluid or powder may also be placed in the electronic component enclosure for further enhancement of heat transfer from the electronic component.
    Type: Grant
    Filed: August 31, 1987
    Date of Patent: October 2, 1990
    Assignee: Olin Corporation
    Inventors: Sheldon H. Butt, Deepak Mahulikar
  • Patent number: 4939316
    Abstract: The present invention relates to a package adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum or an aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than copper based packages and better thermal conductivity than plastic based packages.
    Type: Grant
    Filed: October 5, 1988
    Date of Patent: July 3, 1990
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, James M. Popplewell
  • Patent number: 4929516
    Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component for dissipating thermal stresses is disposed between the substrate and the semiconductor die to dissipate stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed between the substrate and the die with a silver-tin sealing composition. A bonding material may be used alone to bond a die to a substrate and dissipate stresses from thermal cycling.
    Type: Grant
    Filed: February 10, 1986
    Date of Patent: May 29, 1990
    Assignee: Olin Corporation
    Inventors: Michael J. Pryor, Julius C. Fister, Narendra N. Singhdeo, Deepak Mahulikar, Satyam C. Cherukuri
  • Patent number: 4897508
    Abstract: A metal package for housing an electronic device wherein the electronic device is attached to a severable die attach pad. The die attach pad is bonded to the base of the package with a thermally conductive medium. The base is bonded to the die attach pad and to the leadframe at the same time to reduce the thermal degradation of the sealants. In other embodiments, apertures are provided in the base component to enhance cooling of the electronic device and in the cover component to vent reaction by-products.
    Type: Grant
    Filed: February 10, 1988
    Date of Patent: January 30, 1990
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Sheldon H. Butt, Jacob Crane, Anthony M. Pasqualoni, Edward F. Smith
  • Patent number: 4888449
    Abstract: A semiconductor package for an electrical component which has a metal or metal alloy leadframe with first and second surface, which leadframe is adapted to have an electrical component connected thereto. The leadframe is bonded by means of a polymer to a copper or copper alloy base member. The leadframe is also bonded by means of a polymer to a copper or copper alloy cap member. The cap and base members have coated to their inside surfaces a metal or metal alloy. The coating improves the polymer bond between the leadframe and the base and cap members. The surface area of the base member is increased to transfer more heat from the silicon chip in the semiconductor package and to reduce the thermal stresses between the silicon chip and the base member.
    Type: Grant
    Filed: January 4, 1988
    Date of Patent: December 19, 1989
    Assignee: Olin Corporation
    Inventors: Jacob Crane, Barry C. Johnson, Deepak Mahulikar, Sheldon H. Butt
  • Patent number: 4883778
    Abstract: The present invention is directed to an engineering ceramic product formed of a ceramic-glass-metal composite being strong, durable, formable into complex shapes and having good improved thermal conductivity.
    Type: Grant
    Filed: October 30, 1986
    Date of Patent: November 28, 1989
    Assignee: Olin Corporation
    Inventors: Narendra N. SinghDeo, Deepak Mahulikar, Sheldon H. Butt