Abstract: The invention is a semiconductor optical device and a method of manufacture. The device includes a first waveguide having an edge, and a second waveguide adjacent to at least a portion of the first waveguide including the edge so that light is coupled from the first to the second waveguide. The second waveguide has a modal index which is essentially constant at least at the edge of the first waveguide. The method includes forming at least the second waveguide by Selective Area Growth (SAG) using oxide pads of a particular geometry to achieve the essentially constant modal index. In one embodiment, the device is an expanded beam laser with an expander portion which is less than 300 microns.

Abstract: A system for flipping a semiconductor workpiece on its thin edge for microscope inspection of a workpiece facet is disclosed. The system has a holding device attached to a handling block. The holding device picks a workpiece by one of its thin edges. The edge of the workpiece may be attached to the holding device by vacuum. Then an operator rotates the handling block ninety degrees, which in turn rotates the holding device and workpiece ninety degrees. After rotation, one of the workpiece facets faces upward and perpendicular to the microscope for proper inspection of the facet.

Abstract: A cleaving apparatus, system and method which inhibit damage to cleave edges of laser bars are described. The cleaving apparatus includes a cleaving device having a first and a second slope meeting at a solitary cleave line. The slopes are angled to provide a solitary cleave point at the cleave line. Preferably, the first slope is between zero and four degrees and the second slope is about twenty degrees above a support structure upon which the cleaving device is mounted. A source of air may optionally provide air directed at the cleave line to assist in cleaving the laser bars.

Abstract: A system is provided for removing large semiconductor work pieces from an adhesive film. A pick and place apparatus is provided with a collet bar with elongated sides and opposed ends. A channel extends into a cavity on a lower surface of the collet bar. The channel receives a vacuum. The collet bar is angled from a longitudinal axis of the larger work piece to be removed. The work piece may be aligned with a cylindrical roller located under the adhesive film. The angle is chosen to extend the bar across a majority of the width of the work piece. By lowering the collet bar, a first end contacts the work piece, which may be tilted on the roller. Further lowering of the collet bar tilts the semiconductor work piece up into the same plane as the lower surface of the collet bar.

Abstract: A method for unblocking a vacuum collet channel clogged with solder includes moving a solder-clogged collet into contact with a preform of solder, and melting the solder clog and the preform into a single melted mass, cooling the melted mass to solidify it, and moving the collet away from the cooled mass, leaving the clog behind.

Abstract: A demounting apparatus is described which releases semiconductor work pieces from an adhesive support structure. The demounting apparatus includes a conduit with a pair of opposed openings. A support structure is placed over one of the openings with a work piece mounted on a lower surface thereof. A vacuum is exerted on the conduit through a constricted outlet, thereby creating a pressure differential. The lower pressure within the demounting apparatus causes the support structure to elastically deform, thereby reducing its adherence on the work piece. The work piece is dislodged from the support structure and caught by a cushion positioned in the other opening. The cushion is pushed inwardly by the pressure differential. Other structures for releasing the work piece are also disclosed.

Abstract: A device is provided for cleaving semiconductor products or the like. The device may be formed of an inlet for receiving pressurized gas, an adjustable slot for directing the gas toward the products, and a movable flow control member. According to one aspect of the invention, the flow control member is located within a housing that also defines the inlet and the adjustable slot. A cover may be located on the front of the housing. The cover may have a lower edge that forms one side of the slot. The other side of the slot may be formed by the movable flow control member. The cleave device may have an uncomplicated, compact construction. The cleave device may be operated with a flexible product handling system. That is, the brittle products may be handled within opposed flexible sheets. The sheets may be used to locate the products over a ledge (a cleaving position) where they are bent to cause cleaving along crystal planes initiated at scribe or score lines.

Abstract: A method for fabricating a Fabry-Perot laser having a cavity length and facet reflectivity product tuned to cause the laser to exhibit a relaxation oscillation frequency of at least 10 GHz, wherein the laser is capable of being modulated at 10 Gb/sec at drive currents between about 20 and 40 mA.

Abstract: An apparatus is provided for cleaving a laser bar into semiconductor chips. The apparatus includes a supporting structure on which a member slides. The apparatus also includes a pair of film layers. The laser bar is positioned between the film layers. A chamber is sealed to the top film layer. The chamber has an inlet through which gas is input. The movement of the member and the downward force caused by the buildup of gas pressure in the chamber induce cleaving of the laser bar at predetermined locations. The laser bar may have score marks at the predetermined locations to produce weak points. Pressure pulses may be coordinated with the movement of the member to break the laser bar at the desired locations.

Abstract: A method and apparatus are provided for freeing laser bars stuck in a facet coating fixture. A roller device is provided that rolls into a facet coating fixture channel and applies a downward force to a stuck laser bar. The roller device provides an uncomplicated and reliable system for handling the bars.

Abstract: A holding apparatus including a fixture is described. The fixture of the holding apparatus, which receives a semiconductor laser bar for optical coating, includes a base and a pair of walls. The walls and the base have inner surfaces, and the walls have a top surface upon which the laser bar rests. An extending portion of the semiconductor laser bar fits in a cavity formed by the base and the walls. The facet edges of the laser bar do not extend horizontally beyond the walls of the fixture. A coating apparatus applies a coating to the facet edges of the laser bar without contacting any coating material on the extending portion.

Abstract: A coating fixture adapted to extricate a jammed connector web is described. The coating fixture includes a pair of vertical supports. Each support has a first portion spaced apart from a second portion. Springs are placed between the first and second portions to allow movement of the first portions relative to the second portions. The second portions may be anchored to prevent their movement.

Abstract: A method for testing semiconductor laser devices is described. The method includes testing a monolithically integrated semiconductor laser device via electrical contact testing and/or far field testing. These tests will provide the total performance of the entire device. Further, the method includes accurate cleaving off of a portion of the laser device and re-testing to determine the relative performance of the remainder of the device. Through comparison of the test and re-test results, it is possible to reduce the design cycle for monolithically integrated semiconductor laser devices by detecting design flaws and imperfections or by ascertaining a more advantageous design.

Abstract: A scribing machine adapter plate is configured to receive and couple a hoop assembly to a chuck on a scribing machine. The adapter plate includes an upper surface and an inner annular vacuum groove and an outer annular vacuum groove formed in the upper surface. A third vacuum groove extends radially between, and communicates with, the inner and outer grooves. The outer vacuum groove includes a vacuum inlet hole that extends from the groove through the adapter plate to provide communication between a vacuum channel in the chuck and the vacuum grooves in the plate. The polymer film of the hoop assembly is disposed on the upper surface to seal the vacuum grooves to hold the film in place during scribing of materials placed on the film.

Abstract: A system for adhering a plurality of parts to a support film is provided. The parts are positioned between a support base with a heater and a cover membrane. The cover membrane is located beneath a sealed chamber. The chamber has an inlet through which gas is input. A downward force caused by gas pressure in the chamber causes the cover membrane to contact the parts and presses the plurality of parts against the film. A heating device heats the film to cause the parts to adhere to the film.

Abstract: A storage container for semiconductor objects is disclosed. The invention has a mounting structure having an inner frame, a temperature sensitive adherent film and an outer frame. Semiconductor objects are placed on the temperature sensitive adherent and covered. The cover does not touch the semiconductor objects because it has a spacer made of non-stick material. The invention stores semiconductor objects for a relatively long period of time in a safe and secure manner with minimal threat of breakage.

Abstract: A method and apparatus utilizing a thermal release mounting material to adhere a laser wafer to a wafer support during a semiconductor fabrication process is provided. A first surface of the mounting material contains an adhesive and is adhered to a wafer support. The wafer support contains apertures for allowing air bubbles to escape while the mounting material is being applied to the wafer support, thus, ensuring that the film is planar to the support. The laser wafer is adhered to a second surface of the mounting material. The second surface of the mounting material comprises a thermal release material. After undergoing the fabrication process, the thermal release material of the mounting material is heated to a release temperature allowing the laser wafer to be readily removed from the wafer support.

Abstract: A method and apparatus are disclosed for testing individual laser chips located on a laser bar containing a plurality of chips. Laser bars are transported widthwise on a moving plastic film sheet, which is passed over an elongated pedestal which is aligned with the film sheet. The pedestal has a width which is less than the length of a laser bar, so that the unsupported portion of the plastic film under the ends of the laser bars may be drawn downward and away from the bar. This provides access to the metalized underside of the bar, which serves as a common N-contact for all of the laser chips on the bar. A probe is placed in contact with the undersurface of the bar, and at least one additional probe is placed in contact with a P-contact on one of the laser devices. A chip activation signal is applied between the two probes, and a sensor detects whether or not the chip being probed emits radiation. Failure to emit radiation or to emit radiation in an expected manner is indicative of a bad chip.

Abstract: A slot is formed behind each face of a stackable laser bar spacer of the type having a laser bar supporting face and a lower face for contacting a laser bar therebelow, each slot being generally parallel to the face in front of it and being located near an edge thereof. This produces a thin, flap-like portion at an end of each face. When it is desired to release a stuck laser bar from a face, this flap portion is caused to flex in the direction of the laser bar. The laser bar, being relatively inflexible, will be lifted away from the corresponding face, breaking free thereof. The stacked spacers may then be separated and the laser bars removed therefrom.

Abstract: A system is provided for freeing laser bars stuck in a facet coating fixture. A roller device is provided that rolls into a facet coating fixture channel and applies a downward force to a stuck laser bar. The roller device and coating fixture combination provide an uncomplicated and reliable system for handling the bars.