Abstract: Low-cost, robust, and high performance microelectromechanical systems (MEMS) acoustic sensors are described. Described MEMS acoustic sensors can comprise a set of etch release structures in the acoustic sensor membrane that facilitates rapid and/or uniform etch release of the acoustic sensor membrane. In addition, MEMS acoustic sensors can comprise a set of membrane position control structures of the acoustic sensor membrane that can reduce the bending stress of the acoustic sensor membrane. MEMS acoustic sensors can further comprise a three layer acoustic sensor membrane that provides increased robustness. Further design flexibility and improvements are described that provide increased robustness and/or cost savings, and a low cost fabrication process for MEMS acoustic sensors is provided.

Abstract: In an embodiment, a method for fabricating a Microelectromechanical System (MEMS) microphone includes depositing, on a frontside of a wafer, a first oxide layer over a silicon nitride thin film and over and adjacent the wafer, wherein the silicon nitride thin film is disposed over the wafer, depositing a membrane protection layer over the first oxide layer between a first side of a first cavity formed in the wafer and a second side of a second cavity formed in the wafer, depositing a second oxide layer over and adjacent the membrane protection layer, depositing a first membrane nitride layer over the second oxide layer, depositing a membrane polysilicon layer over the first membrane nitride layer, depositing a second membrane nitride layer over the membrane polysilicon layer, depositing a third oxide layer over the second membrane nitride layer and depositing a fourth oxide layer over the third oxide layer.

Abstract: A microphone component and a method for fabricating a microphone component are disclosed. In an embodiment, a method includes fabricating a microphone component having a backplate and a membrane in a MEMS technology, forming a plurality of holes in the membrane, the holes having diameters smaller than 5 ?m, choosing a value for a low frequency roll-off and a diameter of the holes in the membrane and choosing a number of holes such that the chosen value for low frequency roll-off is achieved.

Abstract: A microelectromechanical (MEMS) microphone with membrane trench reinforcements and method of fabrication is provided. The MEMS microphone includes a flexible plate and a rigid plate mechanically coupled to the flexible plate. The MEMS microphone includes a stoppage member affixed to the rigid plate and extending perpendicular relative to a surface of the rigid plate opposite the surface of the flexible plate. The stoppage member limits motion of the flexible plate. The rigid plate includes a reverse bending edge that include a first lateral etch stop that includes a first corner radius and a second lateral etch stop that includes a second corner radius. The first corner radius is more than 100 nanometers and the second corner radius is more than 25 nanometers. Further, a lateral step width between the first corner radius and the second corner radius is less than around 4 micrometers.

Abstract: A microphone component and a method for fabricating a microphone component are disclosed. In an embodiment, a microphone component includes a membrane and a backplate, wherein the membrane includes a plurality of holes, and wherein the holes have diameters smaller than 5 ?m.

Abstract: A microelectromechanical (MEMS) microphone with membrane trench reinforcements and method of fabrication is provided. The MEMS microphone includes a flexible plate and a rigid plate mechanically coupled to the flexible plate. The MEMS microphone includes a stoppage member affixed to the rigid plate and extending perpendicular relative to a surface of the rigid plate opposite the surface of the flexible plate. The stoppage member limits motion of the flexible plate. The rigid plate includes a reverse bending edge that includes a first lateral etch stop that includes a first corner radius and a second corner radius. The first corner radius is more than 100 nanometers and the second corner radius is more than 25 nanometers. Further, a lateral step width between the first corner radius and the second corner radius is less than around 4 micrometers.

Abstract: Robust microelectromechanical systems (MEMS) sensors and related manufacturing techniques are described. Disclosed MEMS membranes and backplate structures facilitate manufacturing robust MEMS microphones. Exemplary MEMS membranes and backplate structures can comprise edge pattern holes having a length to width ratio greater than one and/or configured in a radial arrangement. Disclosed implementations can facilitate providing robust MEMS membranes and backplate structures, having edge pattern holes with a profile resembling at least one of an oval, an egg, an ellipse, a droplet, a cone, or a capsule or similar suitable configurations according to disclosed embodiments.

Abstract: Technologies are provided for microelectromechanical microphones that can be robust to substantial pressure changes in the environment in which the micromechanical microphones operate. In some embodiments, a microelectromechanical microphone device can include a substrate defining a first opening to receive a pressure wave. The microelectromechanical microphone device also can include a flexible plate mechanically coupled to the substrate and a rigid plate mechanically coupled to the flexible plate. The flexible plate is deformable by the pressure wave. The rigid plate defines multiple openings that permit passage of the pressure wave. The microelectromechanical microphone device can further include at least one stoppage member assembled in a spatial relationship with the flexible plate. The at least one stoppage member can limit motion of the flexible plate in response to the pressure wave including a threshold amplitude.

Abstract: Robust microelectromechanical systems (MEMS) sensors and related manufacturing techniques are described. Disclosed MEMS membranes and backplate structures facilitate manufacturing robust MEMS microphones. Exemplary MEMS membranes and backplate structures can comprise edge pattern holes having a length to width ratio greater than one and/or configured in a radial arrangement.

Abstract: A microelectromechanical (MEMS) microphone with membrane trench reinforcements and method of fabrication is provided. The MEMS microphone includes a flexible plate and a rigid plate mechanically coupled to the flexible plate. The MEMS microphone includes a stoppage member affixed to the rigid plate and extending perpendicular relative to a surface of the rigid plate opposite the surface of the flexible plate. The stoppage member limits motion of the flexible plate. The rigid plate includes a reverse bending edge that include a first lateral etch stop that includes a first corner radius and a second lateral etch stop that includes a second corner radius. The first corner radius is more than 100 nanometers and the second corner radius is more than 25 nanometers. Further, a lateral step width between the first corner radius and the second corner radius is less than around 4 micrometers.

Abstract: Technologies are provided for microelectromechanical microphones that can be robust to substantial pressure changes in the environment in which the micromechanical microphones operate. In some embodiments, a microelectromechanical microphone device can include a substrate defining a first opening to receive a pressure wave. The microelectromechanical microphone device also can include a flexible plate mechanically coupled to the substrate and a rigid plate mechanically coupled to the flexible plate. The flexible plate is deformable by the pressure wave. The rigid plate defines multiple openings that permit passage of the pressure wave. The microelectromechanical microphone device can further include at least one stoppage member assembled in a spatial relationship with the flexible plate. The at least one stoppage member can limit motion of the flexible plate in response to the pressure wave including a threshold amplitude.

Abstract: A microphone component and a method for fabricating a microphone component are disclosed. In an embodiment, a microphone component includes a membrane and a backplate, wherein the membrane includes a plurality of holes, and wherein the holes have diameters smaller than 5 ?m.

Abstract: A MEMS microphone including a carrier board and a MEMS chip mounted thereon over a sound opening. A filter chip includes a bulk material with an aperture covered and closed by a mesh. The mesh includes a layer of the filter chip with parallel through-going first holes structured in the layer. The filter chip is arranged in or on the carrier board such that the mesh covers the sound opening.

Abstract: A MEMS device having a sensor system that is resiliently mounted on a carrier by means of spring elements. The air gap between sensor system and carrier is reduced by a damping structure present on one of facing surfaces of sensor system and carrier. The spring elements are at least partially accommodated within recesses of the damping structure. The height of the air gap is small enough to allow squeeze film damping.

Abstract: A MEMS microphone is provided comprising a carrier board and a MEMS chip mounted thereon over a sound opening. A filter chip comprises a bulk material with an aperture covered and closed by a mesh. The mesh comprises a layer of the filter chip with parallel through-going first holes structured in the layer. The filter chip is arranged in or on the carrier board such that the mesh covers the sound opening.

Abstract: A non-uniform stress distribution of a MEMS microphone having a non-circular shape is compensated by a structured back plate that has a compensating structure to provide a stress distribution opposite to that of the membrane.

Abstract: A package for a top port microphone with an enlarged back volume. The package includes on a substrate a lid enclosing thereunder a total volume and accommodating a MEMS chip and an ASIC. A stopper seals the ASIC against the lid thereby separating and dividing the total volume under the lid in a volume extension and a remaining volume. The volume extension can be used to arbitrarily enlarge the back volume or the front volume dependent on a placement of a sound port to the volume extension or the remaining volume. A sound path connects the volume extension and a partial volume enclosed between MEMS chip and substrate.

Abstract: A package for a top port microphone with an enlarged back volume comprises on a substrate a lid enclosing thereunder a total volume and accommodating a MEMS chip and an ASIC. A stopper seals the ASIC against the lid thereby separating and dividing the total volume under the lid in a volume extension and a remaining volume. The volume extension can be used to arbitrarily enlarge the back volume or the front volume dependent on a placement of a sound port to the volume extension or the remaining volume. A sound path connects the volume extension and a partial volume enclosed between MEMS chip and substrate.

Abstract: A MEMS device comprises a sensor system that is resiliently mounted on a carrier by means of spring elements. The air gap between sensor system and carrier is reduced by a damping structure present on one of facing surfaces of sensor system and carrier. The spring elements are at least partially accommodated within recesses of the damping structure. The height of the air gap is small enough to allow squeeze film damping.

Abstract: A non-uniform stress distribution of a MEMS microphone having a non-circular shape is compensated by a structured back plate that has a compensating structure to provide a stress distribution opposite to that of the membrane.