Patents by Inventor Deok-Man Kang
Deok-Man Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220022310Abstract: A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.Type: ApplicationFiled: March 17, 2021Publication date: January 20, 2022Inventors: Chang Hwa Park, Chi Seong Kim, Eun Heay Lee, Yo Han Song, Gun Hwi Hyung, Jae Heun LEE, Deok Man Kang, Jin Oh Park
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Patent number: 11076487Abstract: An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and a stopper layer. An electronic component is disposed in the cavity. The stopper layer includes a first metal layer embedded in the first insulating body and having a portion of an inner surface exposed from the first insulating body, and a second metal layer disposed below the first metal layer and having at least a portion of an upper surface disposed as a bottom surface of the cavity. The cavity has an inner surface of the first metal layer and an inner surface of the first insulating body as a first wall surface and a second wall surface, respectively, and an inclination of the first wall surface is different from an inclination of the second wall surface.Type: GrantFiled: March 16, 2020Date of Patent: July 27, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Sun Hwang, Deok Man Kang, Jun Hyeong Jang
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Publication number: 20210185819Abstract: An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and a stopper layer. An electronic component is disposed in the cavity. The stopper layer includes a first metal layer embedded in the first insulating body and having a portion of an inner surface exposed from the first insulating body, and a second metal layer disposed below the first metal layer and having at least a portion of an upper surface disposed as a bottom surface of the cavity. The cavity has an inner surface of the first metal layer and an inner surface of the first insulating body as a first wall surface and a second wall surface, respectively, and an inclination of the first wall surface is different from an inclination of the second wall surface.Type: ApplicationFiled: March 16, 2020Publication date: June 17, 2021Inventors: Mi Sun HWANG, Deok Man KANG, Jun Hyeong JANG
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Patent number: 10849226Abstract: A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.Type: GrantFiled: October 25, 2019Date of Patent: November 24, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Mi-Sun Hwang, Hye-Won Jung, Jae-Sung Sim, Byung-Duk Na, Hee-Joon Chun, Sun-A Kim, Deok-Man Kang
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Patent number: 10779409Abstract: A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.Type: GrantFiled: November 5, 2019Date of Patent: September 15, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Byung-Duk Na, Hye-Won Jung, Jae-Sung Sim, Mi-Sun Hwang, Hee-Joon Chun, Deok-Man Kang, Sun-A Kim
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Publication number: 20200178392Abstract: A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.Type: ApplicationFiled: October 25, 2019Publication date: June 4, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Mi-Sun HWANG, Hye-Won JUNG, Jae-Sung SIM, Byung-Duk NA, Hee-Joon CHUN, Sun-A KIM, Deok-Man KANG
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Publication number: 20200154568Abstract: A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.Type: ApplicationFiled: November 5, 2019Publication date: May 14, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Byung-Duk NA, Hye-Won JUNG, Jae-Sung SIM, Mi-Sun HWANG, Hee-Joon CHUN, Deok-Man KANG, Sun-A KIM
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Publication number: 20150301452Abstract: A chemically amplified photoresist composition is provided which includes: a solute including a novolac resin with an acid decomposable protecting group, a photoacid generator, and an organic solvent.Type: ApplicationFiled: September 30, 2014Publication date: October 22, 2015Inventors: Jeong-Min Park, Jun Chun, Ji-Hyun Kim, Sung-Kyun Park, Jung-Soo Lee, Ki-Hyun Cho, Jin-Ho Ju, Chang-Ik Lee, Se-Tae Oh, Deok-Man Kang
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Patent number: 8808963Abstract: A photoresist composition includes a binder resin, a photo acid generator, an acryl resin having four different types of monomers, and a solvent.Type: GrantFiled: March 17, 2011Date of Patent: August 19, 2014Assignees: Samsung Display Co., Ltd., AZ Electronic Materials (KOREA) Ltd.Inventors: Hi-Kuk Lee, Sang-Hyun Yun, Min-Soo Lee, Deok-Man Kang, Sae-Tae Oh, Jae-Young Choi
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Patent number: 8652749Abstract: A photoresist composition is provided. The photoresist composition includes an alkali-soluble resin; a photosensitizer containing a first compound that contains a diazonaphthoquinone represented by Formula 1 and a second compound that contains a diazonaphthoquinone represented by Formula 2; and a solvent. and R1 is selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 4 carbons, an alkenyl group having 2 to 4 carbons, a cycloalkyl group having 3 to 8 carbons, and an aryl group having 6 to 12 carbons, and R2 is selected from the group consisting of Cl, F, Br, and I.Type: GrantFiled: February 28, 2011Date of Patent: February 18, 2014Assignees: Samsung Display Co., Ltd., AZ Electronic Materials (Korea) Ltd.Inventors: Hi-Kuk Lee, Sang-Hyun Yun, Cha-Dong Kim, Jung-In Park, Deok-Man Kang, Youn-Suk Kim, Sae-Tae Oh
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Publication number: 20130048604Abstract: A photoresist composition includes from about 20% to about 50% by weight of a polymer, from about 0.5% to about 1.5% by weight of a photo-acid generator, from about 0.01% to about 0.5% by weight of a photo absorber and the remainder includes an organic solvent. Also provided is a method of forming a fine pattern including forming a thin film on a substrate; forming a photoresist pattern by using a photoresist composition that includes from about 20% to about 50% by weight of a polymer, from about 0.5% to about 1.5% by weight of a photo-acid generator, from about 0.01% to about 0.5% by weight of a photo absorber and a remainder comprising an organic solvent; and patterning the thin film by using the photoresist pattern as an etch-stop layer to form a fine pattern.Type: ApplicationFiled: August 7, 2012Publication date: February 28, 2013Inventors: Min Kang, Jin-Ho Ju, Jong-Kwang Lee, Bong-Yeon Kim, Jeong-Won Kim, Deok-Man Kang, Jung-Hwan Cho, Kyung-Mi Choi
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Publication number: 20120052438Abstract: A photoresist composition and method of forming pattern using the same are provided. The photoresist composition contains an alkali-soluble novolac resin, a photosensitizer including a compound of Chemical Formula 1, and a solvent.Type: ApplicationFiled: May 26, 2011Publication date: March 1, 2012Inventors: Cha-Dong KIM, Sang-Hyun Yun, Jung-In Park, Hi-Kuk Lee, Deok-Man Kang, Youn-Suk Kim, Sae-Tae Oh
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Publication number: 20110287360Abstract: A photoresist composition is provided. The photoresist composition includes an alkali-soluble resin; a photosensitizer containing a first compound that contains a diazonaphthoquinone represented by Formula 1 and a second compound that contains a diazonaphthoquinone represented by Formula 2; and a solvent. and R1 is selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 4 carbons, an alkenyl group having 2 to 4 carbons, a cycloalkyl group having 3 to 8 carbons, and an aryl group having 6 to 12 carbons, and R2 is selected from the group consisting of Cl, F, Br, and I.Type: ApplicationFiled: February 28, 2011Publication date: November 24, 2011Applicants: AZ ELECTRONIC MATERIALS K.K., SAMSUNG ELECTRONICS CO., LTD.Inventors: Hi-Kuk LEE, Sang-Hyun YUN, Cha-Dong KIM, Jung-In PARK, Deok-Man KANG, Youn-Suk KIM, Sae-Tae OH
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Publication number: 20110171581Abstract: A photoresist composition includes a binder resin, a photo acid generator, an acryl resin having four different types of monomers, and a solvent.Type: ApplicationFiled: March 17, 2011Publication date: July 14, 2011Applicants: SAMSUNG ELECTRONICS CO., LTD., AZ ELECTRONIC MATERIALS(JAPAN) K.K.Inventors: Hi-Kuk LEE, Sang-Hyun YUN, Min-Soo LEE, Deok-Man KANG, Sae-Tae OH, Jae-Young CHOI
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Patent number: 7955784Abstract: A photoresist composition includes about 100 parts by weight of resin mixture including novolak resin and acryl resin and about 10 parts to about 50 parts by weight of naphthoquinone diazosulfonic acid ester. A weight-average molecular weight of the novolak resin is no less than about 30,000. A weight-average molecular weight of the acryl resin is no less than about 20,000. The acryl resin makes up about 1% to about 15% of the total weight of the resin mixture. When a photoresist film formed using the photoresist composition is heated, a profile variation of the photoresist composition is relatively small. Therefore, a residual photoresist film has a uniform thickness, and a short circuit and/or an open defect in a TFT substrate may be reduced.Type: GrantFiled: October 30, 2006Date of Patent: June 7, 2011Assignees: Samsung Electronics Co., Ltd., AZ Electronic Materials (Japan) K.K.Inventors: Hi-Kuk Lee, Woo-Seok Jeon, Doo-Hee Jung, Jeong-Min Park, Deok-Man Kang, Si-Young Jung, Jae-Young Choi
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Patent number: 7927897Abstract: A photoresist composition includes a binder resin, a photo acid generator, an acryl resin having four different types of monomers, and a solvent.Type: GrantFiled: December 3, 2008Date of Patent: April 19, 2011Assignees: Samsung Electronics Co., Ltd., AZ Electronic Materials (Japan) K.K.Inventors: Hi-Kuk Lee, Sang-Hyun Yun, Min-Soo Lee, Deok-Man Kang, Sae-Tae Oh, Jae-Young Choi
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Publication number: 20100167206Abstract: A photoresist composition includes a novolac resin, a benzophenone photosensitizer and an ethylidyne tris phenol photosensitizer, and an organic solvent. Thus, a micropattern having a higher resolution than the resolution of an exposure apparatus is formed to decrease an amount of exposure and/or exposure time, thereby improving manufacturing reliability and productivity.Type: ApplicationFiled: September 10, 2009Publication date: July 1, 2010Applicants: SAMSUNG ELECTRONICS CO., LTD., AZ ELECTRONIC MATERIALS (JAPAN) K.K.Inventors: Woo-Seok JEON, Sang-Hyun YUN, Hi-Kuk LEE, Deok-Man KANG, Sae-Tae OH
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Publication number: 20100009482Abstract: A photoresist composition includes 5% to 50% by weight of an alkali-soluble resin, 0.5% to 30% by weight of a quinone diazide compound, 0.1% to 15 % by weight of a curing agent, and a remainder of an organic solvent. A method of forming a metal pattern includes coating a photoresist composition on a base substrate having a metal layer, and forming a first photoresist film. The photoresist composition includes 5% to 50% by weight of an alkali-soluble resin, 0.5% to 30% by weight of a quinone diazide compound, 0.1% to 15% by weight of a curing agent, and a remainder of an organic solvent. The first photoresist film is patterned, and forms a first photo pattern. The base substrate having the first photo pattern is heated, and forms a first baked pattern. The metal layer is patterned using the first baked pattern, and forms a metal pattern.Type: ApplicationFiled: April 7, 2009Publication date: January 14, 2010Applicants: Samsung Electronics Co., Ltd., AZ Electronic Materials(Japan) K.K.Inventors: Jeong-Min PARK, Jung-Soo LEE, Doo-Hee JUNG, Hi-Kuk LEE, Deok-Man KANG, Sae-Tae OH, Sang-Won SON, Young-Jin KIM
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Publication number: 20090215233Abstract: A photoresist composition includes a binder resin, a photo acid generator, an acryl resin having four different types of monomers, and a solvent.Type: ApplicationFiled: December 3, 2008Publication date: August 27, 2009Applicants: Samsung Electronics Co., Ltd., AZ Electronic Materials(Japan) K.K.Inventors: Hi-Kuk Lee, Sang-Hyun Yun, Min-Soo Lee, Deok-Man Kang, Sae-Tae Oh, Jae-Young Choi
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Publication number: 20070259272Abstract: A photoresist composition includes about 100 parts by weight of resin mixture including novolak resin and acryl resin and about 10 parts to about 50 parts by weight of naphthoquinone diazosulfonic acid ester. A weight-average molecular weight of the novolak resin is no less than about 30,000. A weight-average molecular weight of the acryl resin is no less than about 20,000. A content of the acryl resin is about 1% to about 15% by weight based on a total weight of the resin mixture. When a photoresist film formed using the photoresist composition is heated, a profile variation of the photoresist composition is relatively small. Therefore, a residual photoresist film has a uniform thickness, and a short circuit and/or an open defect in a TFT substrate may be reduced.Type: ApplicationFiled: October 30, 2006Publication date: November 8, 2007Applicant: SAMSUNG ELECTRONICS CO., LTDInventors: Hi-Kuk LEE, Woo-Seok JEON, Doo-Hee JUNG, Jeong-Min PARK, Deok-Man KANG, Si-Young JUNG, Jae-Young CHOI