Patents by Inventor Deok-Man Kang

Deok-Man Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220022310
    Abstract: A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.
    Type: Application
    Filed: March 17, 2021
    Publication date: January 20, 2022
    Inventors: Chang Hwa Park, Chi Seong Kim, Eun Heay Lee, Yo Han Song, Gun Hwi Hyung, Jae Heun LEE, Deok Man Kang, Jin Oh Park
  • Patent number: 11076487
    Abstract: An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and a stopper layer. An electronic component is disposed in the cavity. The stopper layer includes a first metal layer embedded in the first insulating body and having a portion of an inner surface exposed from the first insulating body, and a second metal layer disposed below the first metal layer and having at least a portion of an upper surface disposed as a bottom surface of the cavity. The cavity has an inner surface of the first metal layer and an inner surface of the first insulating body as a first wall surface and a second wall surface, respectively, and an inclination of the first wall surface is different from an inclination of the second wall surface.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: July 27, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Mi Sun Hwang, Deok Man Kang, Jun Hyeong Jang
  • Publication number: 20210185819
    Abstract: An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and a stopper layer. An electronic component is disposed in the cavity. The stopper layer includes a first metal layer embedded in the first insulating body and having a portion of an inner surface exposed from the first insulating body, and a second metal layer disposed below the first metal layer and having at least a portion of an upper surface disposed as a bottom surface of the cavity. The cavity has an inner surface of the first metal layer and an inner surface of the first insulating body as a first wall surface and a second wall surface, respectively, and an inclination of the first wall surface is different from an inclination of the second wall surface.
    Type: Application
    Filed: March 16, 2020
    Publication date: June 17, 2021
    Inventors: Mi Sun HWANG, Deok Man KANG, Jun Hyeong JANG
  • Patent number: 10849226
    Abstract: A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: November 24, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Mi-Sun Hwang, Hye-Won Jung, Jae-Sung Sim, Byung-Duk Na, Hee-Joon Chun, Sun-A Kim, Deok-Man Kang
  • Patent number: 10779409
    Abstract: A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: September 15, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung-Duk Na, Hye-Won Jung, Jae-Sung Sim, Mi-Sun Hwang, Hee-Joon Chun, Deok-Man Kang, Sun-A Kim
  • Publication number: 20200178392
    Abstract: A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.
    Type: Application
    Filed: October 25, 2019
    Publication date: June 4, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Mi-Sun HWANG, Hye-Won JUNG, Jae-Sung SIM, Byung-Duk NA, Hee-Joon CHUN, Sun-A KIM, Deok-Man KANG
  • Publication number: 20200154568
    Abstract: A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.
    Type: Application
    Filed: November 5, 2019
    Publication date: May 14, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung-Duk NA, Hye-Won JUNG, Jae-Sung SIM, Mi-Sun HWANG, Hee-Joon CHUN, Deok-Man KANG, Sun-A KIM
  • Publication number: 20150301452
    Abstract: A chemically amplified photoresist composition is provided which includes: a solute including a novolac resin with an acid decomposable protecting group, a photoacid generator, and an organic solvent.
    Type: Application
    Filed: September 30, 2014
    Publication date: October 22, 2015
    Inventors: Jeong-Min Park, Jun Chun, Ji-Hyun Kim, Sung-Kyun Park, Jung-Soo Lee, Ki-Hyun Cho, Jin-Ho Ju, Chang-Ik Lee, Se-Tae Oh, Deok-Man Kang
  • Patent number: 8808963
    Abstract: A photoresist composition includes a binder resin, a photo acid generator, an acryl resin having four different types of monomers, and a solvent.
    Type: Grant
    Filed: March 17, 2011
    Date of Patent: August 19, 2014
    Assignees: Samsung Display Co., Ltd., AZ Electronic Materials (KOREA) Ltd.
    Inventors: Hi-Kuk Lee, Sang-Hyun Yun, Min-Soo Lee, Deok-Man Kang, Sae-Tae Oh, Jae-Young Choi
  • Patent number: 8652749
    Abstract: A photoresist composition is provided. The photoresist composition includes an alkali-soluble resin; a photosensitizer containing a first compound that contains a diazonaphthoquinone represented by Formula 1 and a second compound that contains a diazonaphthoquinone represented by Formula 2; and a solvent. and R1 is selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 4 carbons, an alkenyl group having 2 to 4 carbons, a cycloalkyl group having 3 to 8 carbons, and an aryl group having 6 to 12 carbons, and R2 is selected from the group consisting of Cl, F, Br, and I.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: February 18, 2014
    Assignees: Samsung Display Co., Ltd., AZ Electronic Materials (Korea) Ltd.
    Inventors: Hi-Kuk Lee, Sang-Hyun Yun, Cha-Dong Kim, Jung-In Park, Deok-Man Kang, Youn-Suk Kim, Sae-Tae Oh
  • Publication number: 20130048604
    Abstract: A photoresist composition includes from about 20% to about 50% by weight of a polymer, from about 0.5% to about 1.5% by weight of a photo-acid generator, from about 0.01% to about 0.5% by weight of a photo absorber and the remainder includes an organic solvent. Also provided is a method of forming a fine pattern including forming a thin film on a substrate; forming a photoresist pattern by using a photoresist composition that includes from about 20% to about 50% by weight of a polymer, from about 0.5% to about 1.5% by weight of a photo-acid generator, from about 0.01% to about 0.5% by weight of a photo absorber and a remainder comprising an organic solvent; and patterning the thin film by using the photoresist pattern as an etch-stop layer to form a fine pattern.
    Type: Application
    Filed: August 7, 2012
    Publication date: February 28, 2013
    Inventors: Min Kang, Jin-Ho Ju, Jong-Kwang Lee, Bong-Yeon Kim, Jeong-Won Kim, Deok-Man Kang, Jung-Hwan Cho, Kyung-Mi Choi
  • Publication number: 20120052438
    Abstract: A photoresist composition and method of forming pattern using the same are provided. The photoresist composition contains an alkali-soluble novolac resin, a photosensitizer including a compound of Chemical Formula 1, and a solvent.
    Type: Application
    Filed: May 26, 2011
    Publication date: March 1, 2012
    Inventors: Cha-Dong KIM, Sang-Hyun Yun, Jung-In Park, Hi-Kuk Lee, Deok-Man Kang, Youn-Suk Kim, Sae-Tae Oh
  • Publication number: 20110287360
    Abstract: A photoresist composition is provided. The photoresist composition includes an alkali-soluble resin; a photosensitizer containing a first compound that contains a diazonaphthoquinone represented by Formula 1 and a second compound that contains a diazonaphthoquinone represented by Formula 2; and a solvent. and R1 is selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 4 carbons, an alkenyl group having 2 to 4 carbons, a cycloalkyl group having 3 to 8 carbons, and an aryl group having 6 to 12 carbons, and R2 is selected from the group consisting of Cl, F, Br, and I.
    Type: Application
    Filed: February 28, 2011
    Publication date: November 24, 2011
    Applicants: AZ ELECTRONIC MATERIALS K.K., SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hi-Kuk LEE, Sang-Hyun YUN, Cha-Dong KIM, Jung-In PARK, Deok-Man KANG, Youn-Suk KIM, Sae-Tae OH
  • Publication number: 20110171581
    Abstract: A photoresist composition includes a binder resin, a photo acid generator, an acryl resin having four different types of monomers, and a solvent.
    Type: Application
    Filed: March 17, 2011
    Publication date: July 14, 2011
    Applicants: SAMSUNG ELECTRONICS CO., LTD., AZ ELECTRONIC MATERIALS(JAPAN) K.K.
    Inventors: Hi-Kuk LEE, Sang-Hyun YUN, Min-Soo LEE, Deok-Man KANG, Sae-Tae OH, Jae-Young CHOI
  • Patent number: 7955784
    Abstract: A photoresist composition includes about 100 parts by weight of resin mixture including novolak resin and acryl resin and about 10 parts to about 50 parts by weight of naphthoquinone diazosulfonic acid ester. A weight-average molecular weight of the novolak resin is no less than about 30,000. A weight-average molecular weight of the acryl resin is no less than about 20,000. The acryl resin makes up about 1% to about 15% of the total weight of the resin mixture. When a photoresist film formed using the photoresist composition is heated, a profile variation of the photoresist composition is relatively small. Therefore, a residual photoresist film has a uniform thickness, and a short circuit and/or an open defect in a TFT substrate may be reduced.
    Type: Grant
    Filed: October 30, 2006
    Date of Patent: June 7, 2011
    Assignees: Samsung Electronics Co., Ltd., AZ Electronic Materials (Japan) K.K.
    Inventors: Hi-Kuk Lee, Woo-Seok Jeon, Doo-Hee Jung, Jeong-Min Park, Deok-Man Kang, Si-Young Jung, Jae-Young Choi
  • Patent number: 7927897
    Abstract: A photoresist composition includes a binder resin, a photo acid generator, an acryl resin having four different types of monomers, and a solvent.
    Type: Grant
    Filed: December 3, 2008
    Date of Patent: April 19, 2011
    Assignees: Samsung Electronics Co., Ltd., AZ Electronic Materials (Japan) K.K.
    Inventors: Hi-Kuk Lee, Sang-Hyun Yun, Min-Soo Lee, Deok-Man Kang, Sae-Tae Oh, Jae-Young Choi
  • Publication number: 20100167206
    Abstract: A photoresist composition includes a novolac resin, a benzophenone photosensitizer and an ethylidyne tris phenol photosensitizer, and an organic solvent. Thus, a micropattern having a higher resolution than the resolution of an exposure apparatus is formed to decrease an amount of exposure and/or exposure time, thereby improving manufacturing reliability and productivity.
    Type: Application
    Filed: September 10, 2009
    Publication date: July 1, 2010
    Applicants: SAMSUNG ELECTRONICS CO., LTD., AZ ELECTRONIC MATERIALS (JAPAN) K.K.
    Inventors: Woo-Seok JEON, Sang-Hyun YUN, Hi-Kuk LEE, Deok-Man KANG, Sae-Tae OH
  • Publication number: 20100009482
    Abstract: A photoresist composition includes 5% to 50% by weight of an alkali-soluble resin, 0.5% to 30% by weight of a quinone diazide compound, 0.1% to 15 % by weight of a curing agent, and a remainder of an organic solvent. A method of forming a metal pattern includes coating a photoresist composition on a base substrate having a metal layer, and forming a first photoresist film. The photoresist composition includes 5% to 50% by weight of an alkali-soluble resin, 0.5% to 30% by weight of a quinone diazide compound, 0.1% to 15% by weight of a curing agent, and a remainder of an organic solvent. The first photoresist film is patterned, and forms a first photo pattern. The base substrate having the first photo pattern is heated, and forms a first baked pattern. The metal layer is patterned using the first baked pattern, and forms a metal pattern.
    Type: Application
    Filed: April 7, 2009
    Publication date: January 14, 2010
    Applicants: Samsung Electronics Co., Ltd., AZ Electronic Materials(Japan) K.K.
    Inventors: Jeong-Min PARK, Jung-Soo LEE, Doo-Hee JUNG, Hi-Kuk LEE, Deok-Man KANG, Sae-Tae OH, Sang-Won SON, Young-Jin KIM
  • Publication number: 20090215233
    Abstract: A photoresist composition includes a binder resin, a photo acid generator, an acryl resin having four different types of monomers, and a solvent.
    Type: Application
    Filed: December 3, 2008
    Publication date: August 27, 2009
    Applicants: Samsung Electronics Co., Ltd., AZ Electronic Materials(Japan) K.K.
    Inventors: Hi-Kuk Lee, Sang-Hyun Yun, Min-Soo Lee, Deok-Man Kang, Sae-Tae Oh, Jae-Young Choi
  • Publication number: 20070259272
    Abstract: A photoresist composition includes about 100 parts by weight of resin mixture including novolak resin and acryl resin and about 10 parts to about 50 parts by weight of naphthoquinone diazosulfonic acid ester. A weight-average molecular weight of the novolak resin is no less than about 30,000. A weight-average molecular weight of the acryl resin is no less than about 20,000. A content of the acryl resin is about 1% to about 15% by weight based on a total weight of the resin mixture. When a photoresist film formed using the photoresist composition is heated, a profile variation of the photoresist composition is relatively small. Therefore, a residual photoresist film has a uniform thickness, and a short circuit and/or an open defect in a TFT substrate may be reduced.
    Type: Application
    Filed: October 30, 2006
    Publication date: November 8, 2007
    Applicant: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Hi-Kuk LEE, Woo-Seok JEON, Doo-Hee JUNG, Jeong-Min PARK, Deok-Man KANG, Si-Young JUNG, Jae-Young CHOI