Patents by Inventor DER-LIN HSIA

DER-LIN HSIA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8642994
    Abstract: A light emitting diode (LED) array includes a substrate with an array having a plurality of LED chips thereon, a dielectric layer, a plug, and a conductive connection layer. Each of the LED chips is isolated from another LED chip adjacent thereto by a trench. The dielectric layer covers a surface of the substrate exposed by the trench and sidewalls and partial surfaces of the LED chips adjacent to the trench. The plug fills the trench. The conductive connection layer is disposed over the plug and the dielectric layer to connect the LED chips with the LED chips adjacent thereto. Radiation emitted from one of the LED chips can be reflected by the dielectric layer and the plug, and finally reflected and output from a side of the LED chip not adjacent to the trench, thereby not affecting the adjacent LED chip and being absorbed by it.
    Type: Grant
    Filed: August 13, 2012
    Date of Patent: February 4, 2014
    Assignee: Lextar Electronics Corporation
    Inventors: Wen-Fei Fong, Der-Lin Hsia
  • Publication number: 20130207071
    Abstract: A light emitting diode (LED) array includes a substrate with an array having a plurality of LED chips thereon, a dielectric layer, a plug, and a conductive connection layer. Each of the LED chips is isolated from another LED chip adjacent thereto by a trench. The dielectric layer covers a surface of the substrate exposed by the trench and sidewalls and partial surfaces of the LED chips adjacent to the trench. The plug fills the trench. The conductive connection layer is disposed over the plug and the dielectric layer to connect the LED chips with the LED chips adjacent thereto. Radiation emitted from one of the LED chips can be reflected by the dielectric layer and the plug, and finally reflected and output from a side of the LED chip not adjacent to the trench, thereby not affecting the adjacent LED chip and being absorbed by it.
    Type: Application
    Filed: August 13, 2012
    Publication date: August 15, 2013
    Applicant: LEXTAR ELECTRONICS CORPORATION
    Inventors: Wen-Fei Fong, Der-Lin Hsia
  • Publication number: 20130026491
    Abstract: The present invention discloses a LED structure and a method for manufacturing the LED structure. The LED structure includes a substrate, a reflection layer, a first conducting layer, a light emitting layer, and a second conducting layer. The substrate has a plurality of grooves, and the reflection layer is disposed inside the plurality of grooves. The reflection layer is formed as a reflection block inside each of the grooves. The first conducting layer is disposed on the substrate, that is, the reflection layer is disposed between the first conducting layer and the substrate. The light emitting layer and the second conducting layer are sequentially disposed on the first conducting layer. The light emitting layer generates light when a current pass through the light emitting layer. Accordingly, the light generated by the light emitting layer can be emitted to the same side of the LED structure.
    Type: Application
    Filed: September 23, 2011
    Publication date: January 31, 2013
    Applicant: LEXTAR ELECTRONICS CORP.
    Inventors: CHENG-HUNG CHEN, DER-LIN HSIA, CHIA-HUNG HOU