Abstract: A memory device including a memory array and address lines; and decoder circuitry to apply a first bias to a WL coupled to a memory cell selected for a memory operation, a second bias to a BL coupled to the selected memory cell, and one or more neutral biases to the other BLs and WLs of the memory array; wherein the decoder circuitry comprises a plurality of bias circuits coupled to the address lines, a first bias circuit of the plurality of bias circuits comprising a transistor pair and an additional transistor coupled to an address line of the plurality of address lines, wherein the bias circuit is to apply, to the address line, the first bias through the transistor pair in a first state, the second bias through the transistor pair in a second state, and the neutral bias through the additional transistor in a third state.

Abstract: Apparatuses and methods for performing multithread, concurrent access of different partition of a memory are disclosed herein. An example apparatus may include a non-volatile memory array comprising a plurality of partitions. Each of the plurality of partitions may include a respective plurality of memory cells. The apparatus may include a plurality of local controllers that each independently and concurrently access a respective one of the plurality of partitions to execute a respective memory access command of a plurality of memory access commands. The apparatus may include a controller to receive the plurality of memory access commands and to determine a respective target partition of the plurality of partitions for each of the plurality of memory access commands. The controller may be provide each of the plurality of memory access commands to a local controller of the plurality of local controllers associated with the respective target partition.

Abstract: Subject matter disclosed herein relates to a memory device, and more particularly to a self-aligned cross-point phase change memory-switch array and methods of fabricating same.

Abstract: Integrated circuit (IC) devices with stacked two-level backend memory, and associated systems and methods, are disclosed. An example IC device includes a front end of line (FEOL) layer, including frontend transistors, and a back end of line (BEOL) layer above the FEOL layer. The BEOL layer includes a first memory layer with memory cells of a first type, and a second memory layer with memory cells of a second type. The first memory layer may be between the FEOL layer and the second memory layer, thus forming stacked backend memory. Stacked backend memory architecture may allow significantly increasing density of memory cells in a memory array having a given footprint area, or, conversely, reducing the footprint area of the memory array with a given memory cell density. Implementing two different types of backend memory may advantageously increase functionality and performance of backend memory.

Abstract: Apparatuses and methods for performing multithread, concurrent access of different partition of a memory are disclosed herein. An example apparatus may include a non-volatile memory array comprising a plurality of partitions. Each of the plurality of partitions may include a respective plurality of memory cells. The apparatus may further include a plurality of local controllers that are each configured to independently and concurrently access a respective one of the plurality of partitions to execute a respective memory access command of a plurality of memory access commands responsive to receiving the respective memory access command. The example apparatus may further include a controller configured to receive the plurality of memory access commands and to determine a respective target partition of the plurality of partitions for each of the plurality of memory access commands.

Abstract: A memory device structure includes a first plurality of line structures, where each line structure, in the first plurality of line structures, includes a first transistor channel. The memory device structure further includes a second plurality of line structures substantially orthogonal to the first plurality of line structures, where each line structure, in the second plurality of line structures, includes a second transistor channel A memory cell is at each cross-point between the first plurality of line structures and the second plurality of line structures.

Abstract: A memory structure includes a plurality of memory cells between a first and a second terminal and a pair of first conductors within a first tier, where individual ones of the first conductors are coupled to the first terminal of a first adjacent pair of memory cells in a first row orthogonal to the first conductors. The memory structure further includes a pair of second conductors within a second tier and parallel to the first conductors, where individual ones of the second conductors are coupled to the first terminal of a second adjacent pair of memory cells in a second row. The memory structure further includes a third conductor between the first and second tiers, and between each of the pair of the first conductors and the pair of the second conductors. The third conductor is coupled to second terminals of both the first and second adjacent pairs of memory cells.

Abstract: A memory device structure includes a vertical transistor having a channel between a source and a drain, a gate electrode adjacent the channel, where the gate electrode is in a first direction orthogonal to a longitudinal axis of the channel. A gate dielectric layer is between the gate electrode and the channel A first terminal of a first interconnect is coupled with the source or the drain, where the first interconnect is colinear with the longitudinal axis. The memory device structure further includes a pair of memory cells, where individual ones of the memory cells includes a selector and a memory element, where a first terminal of the individual ones of the memory cell is coupled to a respective second and a third terminal of the first interconnect. A second terminal of the individual ones of the memory cell is coupled to individual ones of the pair of second interconnects.

Abstract: Apparatuses and methods for performing multithread, concurrent access of different partition of a memory are disclosed herein. An example apparatus may include a non-volatile memory array comprising a plurality of partitions. Each of the plurality of partitions may include a respective plurality of memory cells. The apparatus may further include a plurality of local controllers that are each configured to independently and concurrently access a respective one of the plurality of partitions to execute a respective memory access command of a plurality of memory access commands responsive to receiving the respective memory access command. The example apparatus may further include a controller configured to receive the plurality of memory access commands and to determine a respective target partition of the plurality of partitions for each of the plurality of memory access commands.

Abstract: A memory device including a three dimensional crosspoint memory array comprising memory cells each comprising two terminals and a storage element programmable to one of a plurality of program states each representing distinct values for at least two bits; and access circuitry to apply a first program pulse with a positive polarity across the two terminals of a first memory cell of the memory cells to program the first memory cell to a first program state of the program states; and apply a second program pulse with a negative polarity across the two terminals of the first memory cell to program the first memory cell to a second program state of the program states.

Abstract: A memory device including a memory array and address lines; and decoder circuitry to apply a first bias to a WL coupled to a memory cell selected for a memory operation, a second bias to a BL coupled to the selected memory cell, and one or more neutral biases to the other BLs and WLs of the memory array; wherein the decoder circuitry comprises a plurality of bias circuits coupled to the address lines, a first bias circuit of the plurality of bias circuits comprising a transistor pair and an additional transistor coupled to an address line of the plurality of address lines, wherein the bias circuit is to apply, to the address line, the first bias through the transistor pair in a first state, the second bias through the transistor pair in a second state, and the neutral bias through the additional transistor in a third state.

Abstract: A method, apparatus and system to address memory cells in a memory array that includes address lines comprising wordlines (WLs) and bitlines (BLs). The method comprises: controlling a decoder circuitry of a memory array, the memory array including a plurality of WLs and a plurality of BLs, the decoder circuitry including a plurality of switches coupled respectively to the WLs, or respectively to the BLs; and causing a selected switch of the plurality of switches to change a bias of a corresponding selected address line coupled thereto from a floating bias at an idle state of the decoder circuitry to either a positive bias or a negative bias without changing a bias at deselected address lines corresponding to deselected switches of the plurality of switches from the floating bias at the idle state.

Abstract: A method, apparatus and system to address memory cells in a memory array that includes address lines comprising wordlines (WLs) and bitlines (BLs). The method comprises: controlling a decoder circuitry of a memory array, the memory array including a plurality of WLs and a plurality of BLs, the decoder circuitry including a plurality of switches coupled respectively to the WLs, or respectively to the BLs; and causing a selected switch of the plurality of switches to change a bias of a corresponding selected address line coupled thereto from a floating bias at an idle state of the decoder circuitry to either a positive bias or a negative bias without changing a bias at deselected address lines corresponding to deselected switches of the plurality of switches from the floating bias at the idle state.

Abstract: A memory decoder enables the selection of a conductor of a row or column of a crosspoint array memory. The decoder includes a circuit to apply a bias voltage to select or deselect the conductor. The conductor can be either a wordline or a bitline. The decoder also includes a select device to selectively provide both high voltage bias and low voltage bias to the circuit to enable the circuit to apply the bias voltage. Thus, a single end device provides either rail to the bias circuit.

Abstract: Cross point memory architectures, devices, systems, and methods are disclosed and described, and can include a cross point memory core subsystem having increased bandwidth that is scalable. The memory core can include a plurality of independently operating partitions, each comprising a plurality of cross point memory arrays.

Abstract: Embodiments include apparatuses, methods, and systems including a semiconductor photonic device having a substrate, a waveguide disposed above the substrate, a phase change layer disposed above the waveguide, and a heater disposed above the phase change layer. The waveguide has a modifiable refractive index based at least in part on a state of a phase change material included in the phase change layer. The phase change material of the phase change layer is in a first state of a set of states, and the waveguide has a first refractive index determined based on the first state of the phase change material. The heater is to generate heat to transform the phase change material to a second state of the set of states, and the waveguide has a second refractive index determined based on the second state of the phase change material. Other embodiments may also be described and claimed.

Abstract: Apparatuses and methods for performing multithread, concurrent access of different partition of a memory are disclosed herein. An example apparatus may include a non-volatile memory array comprising a plurality of partitions. Each of the plurality of partitions may include a respective plurality of memory cells. The apparatus may further include a plurality of local controllers that are each configured to independently and concurrently access a respective one of the plurality of partitions to execute a respective memory access command of a plurality of memory access commands responsive to receiving the respective memory access command. The example apparatus may further include a controller configured to receive the plurality of memory access commands and to determine a respective target partition of the plurality of partitions for each of the plurality of memory access commands.

Abstract: Some embodiments include apparatuses and methods having a memory cell, first and second conductive lines configured to access the memory cell, and a switch configured to apply a signal to one of the first and second conductive lines. In at least one of such embodiments, the switch can include a phase change material. Other embodiments including additional apparatuses and methods are described.

Abstract: Subject matter disclosed herein relates to a memory device, and more particularly to a self-aligned cross-point phase change memory-switch array and methods of fabricating same.

Abstract: A memory decoder enables the selection of a conductor of a row or column of a crosspoint array memory. The decoder includes a circuit to apply a bias voltage to select or deselect the conductor. The conductor can be either a wordline or a bitline. The decoder also includes a select device to selectively provide both high voltage bias and low voltage bias to the circuit to enable the circuit to apply the bias voltage. Thus, a single end device provides either rail to the bias circuit.