Abstract: Embodiments herein relate to hydraulic bladders to provide a force against an integrated circuit package to be located between the hydraulic bladder and a system board. In various embodiments, a hydraulic force generator may include a block to be coupled with a system board and a hydraulic bladder to be located between the block and the system board, where the hydraulic bladder, in response to pressurization, is to provide a force against an integrated circuit package to be located between the hydraulic bladder and the system board. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure provide techniques and configurations for providing a thermal interface to a PCB. In some embodiments, the system for providing a thermal interface to a PCB may include a heat sink couplable to a printed circuit board (PCB) via a thermal interface. The heat sink may include a base configured to accommodate a plurality of heat pipes. The system may further include a heater block couplable to the base with the plurality of heat pipes, to conduct heat generated by the heater block to the base via the plurality of heat pipes, to heat the thermal interface, and cause the thermal interface to spread substantially evenly between the heat sink and the PCB. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure provide techniques and configurations for providing a thermal interface to a PCB. In some embodiments, the system for providing a thermal interface to a PCB may include a heat sink couplable to a printed circuit board (PCB) via a thermal interface. The heat sink may include a base configured to accommodate a plurality of heat pipes. The system may further include a heater block couplable to the base with the plurality of heat pipes, to conduct heat generated by the heater block to the base via the plurality of heat pipes, to heat the thermal interface, and cause the thermal interface to spread substantially evenly between the heat sink and the PCB. Other embodiments may be described and/or claimed.

Abstract: Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.

Abstract: Methods, apparatuses, and systems associated with tunable pumped two-phase liquid cooling thermal management are disclosed. In embodiments, a tunable cooling apparatus may include a thermoelectric cooler device, TEC, that has a hot side and a cold side, where the cold side is to cool the coolant in route to an inlet manifold of the cold plate before the coolant enters the inlet manifold, and the hot side may be to warm the coolant in route from an outlet manifold of the cold plate after the coolant flows through the cold plate and exits the outlet manifold and or vice versa. In embodiments, the coolant may be either in a liquid state or in a vapor state. Other embodiments may be described and/or claimed.

Abstract: Processes, apparatuses, and systems are associated with using coolant-driven fans to cool computer systems. In embodiments, the flow of coolant through tubes used to cool cold plates within the system may be used to drive one or more fans within the system to provide additional airflow to cool components, for example, components to be air cooled that are attached to a motherboard. Other embodiments may be described and/or claimed.

Abstract: Apparatuses, methods and storage medium associated with coolant systems for computer and electrical environments are disclosed herein. In embodiments, an apparatus for selectively transferring of heat within a computer environment may include a cold plate thermally coupled to a liquid line of a liquid coolant system of the computer environment, the cold plate to transfer heat to the liquid line and a thermally-conductive body to cool a component of the computer environment. The apparatus may further include a thermoelectric cooler (TEC) thermally coupled with the cold plate on a first side of the TEC and thermally coupled with the thermally-conductive body on a second side of the TEC, the TEC to increase an amount of heat transfer from the second side of the TEC to the first side of the TEC in response to energy provided to the TEC.

Abstract: Cooling assemblies and methods, including, for example, at least one bar (e.g., electrically insulated and/or thermally conductive bar(s)), members (e.g., i-beams, rectangular members, and the like), stator laminations, rotor laminations, and/or combinations thereof, such as those configured to cool electric machines (e.g., electric motors and generators).

Abstract: Methods, apparatuses, and systems associated with tunable pumped two-phase liquid cooling thermal management are disclosed. In embodiments, a tunable cooling apparatus may include a thermoelectric cooler device, TEC, that has a hot side and a cold side, where the cold side is to cool the coolant in route to an inlet manifold of the cold plate before the coolant enters the inlet manifold, and the hot side may be to warm the coolant in route from an outlet manifold of the cold plate after the coolant flows through the cold plate and exits the outlet manifold and or vice versa. In embodiments, the coolant may be either in a liquid state or in a vapor state. Other embodiments may be described and/or claimed.

Abstract: Cooling apparatuses and methods comprising cooling apparatuses, such as those configured to be coupled to and/or cool electric machines (e.g., motors, generators, and the like).

Abstract: Cooling assemblies, such as those configured to cool electric machines (e.g., electric motors and generators) and components of electric machines (e.g., rotors and stators).

Abstract: In an example embodiment, a cooling system is a pumpless passive system, and includes a cold plate configured to receive a flow of liquid coolant and to output a flow of vapor phase coolant, where the cold plate includes at least one heat pipe adapted therein to provide for transfer of the liquid coolant to the vapor phase coolant, a first connection member coupled to the at least one heat pipe, a first conduit coupled to the first connection member, the first conduit extending vertically to enable at least the vapor phase coolant to travel through the first conduit, and a heat exchanger located above and coupled to the first conduit, where the heat exchanger is to transfer the vapor phase coolant to the liquid coolant.

Abstract: In an embodiment, a medium voltage drive system includes a transformer, multiple power cubes each coupled to the transformer, and a manifold assembly. Each power cube includes cold plates each coupled to a corresponding switching device of the cube, an inlet port in communication with a first one of the cold plates and an outlet port in communication with a last one of the cold plates. The manifold assembly can support an inlet conduit and an outlet conduit and further support first and second connection members to enable blind mating of each of the first connection members to the inlet port of one of the power cubes and each of the second connection members to the outlet port of one of the power cubes to enable two phase cooling of the plurality of power cubes.

Abstract: Cooling assemblies, such as those configured to cool electric machines (e.g., electric motors and generators) and components of electric machines (e.g., rotors and stators).

Abstract: In an example embodiment, a cooling system is a pumpless passive system, and includes a cold plate configured to receive a flow of liquid coolant and to output a flow of vapor phase coolant, where the cold plate includes at least one heat pipe adapted therein to provide for transfer of the liquid coolant to the vapor phase coolant, a first connection member coupled to the at least one heat pipe, a first conduit coupled to the first connection member, the first conduit extending vertically to enable at least the vapor phase coolant to travel through the first conduit, and a heat exchanger located above and coupled to the first conduit, where the heat exchanger is to transfer the vapor phase coolant to the liquid coolant.

Abstract: Cooling assemblies (e.g., tubes, members (e.g., i-beams, rectangular members, and the like), stator windings, stator laminations, and/or combinations thereof), such as those configured to cool electric machines (e.g., electric motors and generators).

Abstract: Cooling assemblies and methods, including, for example, at least one bar (e.g., electrically insulated and/or thermally conductive bar(s)), members (e.g., i-beams, rectangular members, and the like), stator laminations, rotor laminations, and/or combinations thereof, such as those configured to cool electric machines (e.g., electric motors and generators).

Abstract: Cooling apparatuses and methods comprising cooling apparatuses, such as those configured to be coupled to and/or cool electric machines (e.g., motors, generators, and the like).

Abstract: In an embodiment, a medium voltage drive system includes a transformer, multiple power cubes each coupled to the transformer, and a manifold assembly. Each power cube includes cold plates each coupled to a corresponding switching device of the cube, an inlet port in communication with a first one of the cold plates and an outlet port in communication with a last one of the cold plates. The manifold assembly can support an inlet conduit and an outlet conduit and further support first and second connection members to enable blind mating of each of the first connection members to the inlet port of one of the power cubes and each of the second connection members to the outlet port of one of the power cubes to enable two phase cooling of the plurality of power cubes.