Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a LDO regulator circuit and methods of manufacture. The structure includes a comparator connected to a first transistor of a low drop-out (LDO) circuit; a second transistor connected to the first transistor; and a feedback loop connected to the first transistor and an output of the LDO circuit.

Abstract: Embodiments of the present disclosure provide a level shifter, including: first and second NMOS transistors, wherein the sources of the first and second NMOS transistors are coupled to a first voltage, the gate of the first NMOS transistor is connected to an inverse of an input signal that varies between a second voltage and a third voltage, and wherein the gate of the second NMOS transistor receives a buffer of the input signal. a breakdown protection circuit has third and fourth NMOS transistors, the gates of the third and fourth NMOS transistors being connected to the third voltage, the drain of the first NMOS transistor being connected to the source of the third NMOS transistor, and the drain of the second NMOS transistor being connected to the source of the fourth NMOS transistor. A pull-up circuit is connected to the drains of the third and fourth NMOS transistors.

Abstract: Various embodiments include memory devices and related methods. An embodiment includes circuitry including: a first inverter having a first inverter storage node, the first inverter cross-coupled to a second inverter having a second inverter storage node, wherein each of the first inverter and the second inverter has a reverse bit line controlled feedback transistor coupled between an pull-down transistor and a pull-up transistor, and wherein each pull-down transistor is further coupled to a ground; a first signal line coupled with the reverse bit line controlled feedback transistor of the second inverter; a second signal line coupled with the reverse bit line controlled feedback transistor of the first inverter; a first access transistor coupled with the first inverter storage node, the first signal line, and a third signal line; and a second access transistor coupled with the second inverter storage node, the second signal line, and the third signal line.

Abstract: Various embodiments include memory devices and related methods. An embodiment includes circuitry including: a first inverter having a first inverter storage node, the first inverter cross-coupled to a second inverter having a second inverter storage node, wherein each of the first inverter and the second inverter has a reverse bit line controlled feedback transistor coupled between an pull-down transistor and a pull-up transistor, and wherein each pull-down transistor is further coupled to a ground; a first signal line coupled with the reverse bit line controlled feedback transistor of the second inverter; a second signal line coupled with the reverse bit line controlled feedback transistor of the first inverter; a first access transistor coupled with the first inverter storage node, the first signal line, and a third signal line; and a second access transistor coupled with the second inverter storage node, the second signal line, and the third signal line.

Abstract: A method for reading a memory cell (20) of a semiconductor memory (10) includes initiating a precharge or predischarge operation on a bit line (24) prior to arrival of a triggering edge of a clock signal (32) that initiates a read operation. A word line (22) is activated responsive to the triggering edge of the clock signal (32), and data is read from the memory cell (20).

Abstract: A method for reading a memory cell (20) of a semiconductor memory (10) includes initiating a precharge or predischarge operation on a bit line (24) prior to arrival of a triggering edge of a clock signal (32) that initiates a read operation. A word line (22) is activated responsive to the triggering edge of the clock signal (32), and data is read from the memory cell (20).

Abstract: A memory device for efficient word line, bit line and precharge tracking is provided. The memory device includes a memory array, one or more address decoders, a word line driver, a plurality of sense amplifiers, a reference word line column, a reference bit line column, and a control circuit. The control circuit generates a control signal to perform read and write operations on the memory device. The address decoder selects a bit line and a word line. The selected word line is activated by the word line driver. While the reference word line column is used for vertical tracking of the word line, the reference bit line column is used for vertical tracking of the bit line. The sense amplifiers are activated to read the bit line.

Abstract: A memory device for efficient word line, bit line and precharge tracking is provided. The memory device includes a memory array, one or more address decoders, a word line driver, a plurality of sense amplifiers, a reference word line column, a reference bit line column, and a control circuit. The control circuit generates a control signal to perform read and write operations on the memory device. The address decoder selects a bit line and a word line. The selected word line is activated by the word line driver. While the reference word line column is used for vertical tracking of the word line, the reference bit line column is used for vertical tracking of the bit line. The sense amplifiers are activated to read the bit line.

Abstract: A memory device for efficient word line, bit line and precharge tracking is provided. The memory device includes a memory array, one or more address decoders, a word line driver, a plurality of sense amplifiers, a reference word line column, a reference bit line column, and a control circuit. The control circuit generates a control signal to perform read and write operations on the memory device. The address decoder selects a bit line and a word line. The selected word line is activated by the word line driver. While the reference word line column is used for vertical tracking of the word line, the reference bit line column is used for vertical tracking of the bit line. The sense amplifiers are activated to read the bit line.

Abstract: A sensing circuit for a semiconductor memory includes a multiplexer coupled to a bit line and a data line coupling the multiplexer to a sense amplifier. The data line is configured to be precharged to a voltage level higher than a precharge voltage level of the bit line.

Abstract: A method for reading a memory cell (20) of a semiconductor memory (10) includes initiating a precharge or predischarge operation on a bit line (24) prior to arrival of a triggering edge of a clock signal (32) that initiates a read operation. A word line (22) is activated responsive to the triggering edge of the clock signal (32), and data is read from the memory cell (20).

Abstract: A memory device has a first core memory array, a second core memory array, a third core memory array and a fourth core memory array, and a first common reference section for the first core memory array and the second core memory array, and a second common reference section for the third core memory array and the fourth core memory array. Another memory device with shared signals and a method is also provided.

Abstract: A method supplies voltage to a bit line of a memory device. The method includes precharging, with a precharging device, the bit line to an output potential, deactivating the precharging device during a read action related to the bit line, reading, during the read action, an information via the bit line, and routing, during the read action, a virtual voltage supply line to a supply potential of the memory device to supply voltage to memory cells of the memory device assigned to the bit line. The precharging device of the bit line is activated/deactivated as a function of the potential of the virtual voltage supply line.

Abstract: A memory device has a first core memory array, a second core memory array, a third core memory array and a fourth core memory array, and a first common reference section for the first core memory array and the second core memory array, and a second common reference section for the third core memory array and the fourth core memory array. Another memory device with shared signals and a method is also provided.

Abstract: A technique for reducing the bitline leakage current while maintaining a level of performance characteristics of low threshold voltage transistors in deep submicron CMOS technology incorporates a reference voltage generator circuit in combination with bias transistor MBIAS. The output of a static logic gate is connected to the input terminal of the pull-down devices. The reduction in leakage current through pull-down devices whenever a read operation is not performed contributes to a significant reduction in overall leakage current in the circuit.

Abstract: A method supplies voltage to a bit line of a memory device. The method includes precharging, with a precharging device, the bit line to an output potential, deactivating the precharging device during a read action related to the bit line, reading, during the read action, an information via the bit line, and routing, during the read action, a virtual voltage supply line to a supply potential of the memory device to supply voltage to memory cells of the memory device assigned to the bit line. The precharging device of the bit line is activated/deactivated as a function of the potential of the virtual voltage supply line.

Abstract: A technique for reducing the bitline leakage current while maintaining a level of performance characteristics of low threshold voltage transistors in deep submicron CMOS technology incorporates a reference voltage generator circuit in combination with bias transistor MBIAS. The output of a static logic gate is connected to the input terminal of the pull-down devices. The reduction in leakage current through pull-down devices whenever a read operation is not performed contributes to a significant reduction in overall leakage current in the circuit.