Patents by Inventor Dexter T. Chun

Dexter T. Chun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10067865
    Abstract: Systems and methods are provided for allocating memory to dissimilar memory devices. An exemplary embodiment includes a method for allocating memory to dissimilar memory devices. An interleave bandwidth ratio is determined, which comprises a ratio of bandwidths for two or more dissimilar memory devices. The dissimilar memory devices are interleaved according to the interleave bandwidth ratio to define two or more memory zones having different performance levels. Memory address requests are allocated to the memory zones based on a quality of service (QoS).
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: September 4, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Subrato K. De, Richard A. Stewart, Gheorghe Calin Cascaval, Dexter T. Chun
  • Patent number: 9875209
    Abstract: A synchronous data-link throughput enhancement technique based on data signal duty-cycle and phase modulation demodulation is disclosed. A method includes receiving multiple bits to be transmitted, encoding the multiple bits to generate a multi-bit signal that represents the multiple bits, and transmitting, via a synchronous interface, the multi-bit signal during a time period that corresponds to one-half of a cycle of a synchronization signal.
    Type: Grant
    Filed: May 6, 2013
    Date of Patent: January 23, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Lalan J. Mishra, Dexter T. Chun, Animesh Datta
  • Patent number: 9575884
    Abstract: Aspects include systems and methods for increasing performance of a flash translation layer (FTL) of a flash memory device. A copy of FTL tables stored on a flash memory device may be copied to a memory of a host device. The copy of the FTL tables may be directly accessed by the flash memory device to translate between logical addresses provided by the host device for read/write operations from/to a flash memory of the flash memory device, and the respective physical addresses of the flash memory. The flash memory device is granted direct memory access to a portion of the memory of the host device where the copy of the FTL tables is stored. The flash memory device bus masters communication busses connecting the flash memory device to the memory of the host device.
    Type: Grant
    Filed: May 13, 2013
    Date of Patent: February 21, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Dexter T. Chun, Anand Srinivasan, Hyunsuk Shin, Steven Haehnichen
  • Patent number: 9448947
    Abstract: In an embodiment, a stacked package-on-package system has a memory die and a logic die. The memory die comprises a first memory and a second memory, each operated independently of the other, and each having an inter-chip interface electrically connected to the logic die. The logic die has two independent clock sources, one to provide a first clock signal to the first memory, and the other clock source to provide a second clock signal to the second memory.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: September 20, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Jungwon Suh, Dexter T. Chun
  • Patent number: 9299457
    Abstract: Systems, methods, and computer programs are disclosed for kernel masking dynamic random access memory (DRAM) defects. One such method comprises: detecting and correcting a single-bit error associated with a physical address in a dynamic random access memory (DRAM); receiving error data associated with the physical address from the DRAM; storing the received error data in a failed address table located in a non-volatile memory; and retiring a kernel page corresponding to the physical address if a number of errors associated with the physical address exceeds an error count threshold.
    Type: Grant
    Filed: February 23, 2014
    Date of Patent: March 29, 2016
    Assignee: QUALCOMM INCORPORATED
    Inventors: Dexter T. Chun, Yanru Li, Xiangyu Dong, Jungwon Suh, Jung Pill Kim, Deepti Vijayalakshmi Sriramagiri
  • Patent number: 9274715
    Abstract: In a particular embodiment, a device includes memory address remapping circuitry and a remapping engine. The memory address remapping circuitry includes a comparison circuit to compare a received memory address to one or more remapped addresses. The memory address remapping circuitry also includes a selection circuit responsive to the comparison circuit to output a physical address. The physical address corresponds to a location in a random-access memory (RAM). The remapping engine is configured to update the one or more remapped addresses to include a particular address in response to detecting that a number of occurrences of errors at a particular location satisfies a threshold.
    Type: Grant
    Filed: August 2, 2013
    Date of Patent: March 1, 2016
    Assignee: Qualcomm Incorporated
    Inventors: Dexter T. Chun, Jungwon Suh, Stephen A. Molloy, Jung Pill Kim
  • Patent number: 9177623
    Abstract: A memory interface includes circuitry configured for applying a variable delay to a portion of a data signal and applying a variable delay to a data strobe. The delayed data strobe samples the delayed portion of the data signal. Delayed portions of the data signal are spaced away from non-delayed portions of the data signal by alternating the routing of delayed bits and non-delayed bits of the data signal. A training block determines and sets a value of the variable delay corresponding to a largest value of a number of recorded eye aperture widths.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: November 3, 2015
    Assignee: QUALCOMM INCORPORATED
    Inventors: Shree Krishna Pandey, Dexter T. Chun
  • Patent number: 9165854
    Abstract: Electronic devices incorporating a heat dissipation feature include an enclosure, and at least one heat-generating component positioned within the enclosure. The heat dissipation feature is sufficiently coupled to the at least one heat-generating component to facilitate conductive heat transfer from the heat-generating component. The heat dissipation feature includes a plurality of protrusions exposed externally to the enclosure. A thermally insulating material may be disposed on at least a tip portion of at least some of the protrusions. The thermally insulating material is selected to provide a touch temperature that is below a predetermined threshold. In some instances, the thermally insulating material can provide such a touch temperature by selecting the material to include properties for thermal conductivity (k), density (?), and specific heat (Cp) such that the product of k*?*Cp results in a value less than a product of k*?*Cp for human skin.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: October 20, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Dexter T. Chun, Victor A. Chiriac, James H. Thompson, Stephen A. Molloy
  • Publication number: 20150286565
    Abstract: Systems and methods are provided for allocating memory to dissimilar memory devices. An exemplary embodiment includes a method for allocating memory to dissimilar memory devices. An interleave bandwidth ratio is determined, which comprises a ratio of bandwidths for two or more dissimilar memory devices. The dissimilar memory devices are interleaved according to the interleave bandwidth ratio to define two or more memory zones having different performance levels. Memory address requests are allocated to the memory zones based on a quality of service (QoS).
    Type: Application
    Filed: June 19, 2015
    Publication date: October 8, 2015
    Inventors: Subrato K. De, Richard A. Stewart, Gheorghe Calin Cascaval, Dexter T. Chun
  • Patent number: 9148979
    Abstract: Some implementations provide a folding electronic device that includes a base portion, a cover portion and a coupler. The base portion includes a region configured to generate heat. The cover portion includes a display screen, a heat dissipating component, and a thermally insulating component. The heat dissipating component is coplanar to the display screen. The thermally insulating component is coplanar to the display screen. The thermally insulating component is located between the display screen and the heat dissipating component. The coupler is for thermally coupling the base portion to the cover portion. The coupler includes a first component and a second component. The first component is coupled to the region configured to generate heat. The second component is coupled to the heat dissipating component of the cover portion. The coupler provides a path for transferring heat.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: September 29, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Victor A. Chiriac, Dexter T. Chun
  • Patent number: 9110795
    Abstract: Systems and methods are provided for dynamically allocating a memory subsystem. An exemplary embodiment comprises a method for dynamically allocating a memory subsystem in a portable computing device. The method involves fully interleaving a first portion of a memory subsystem having memory components with asymmetric memory capacities. A second remaining portion of the memory subsystem is partial interleaved according to an interleave bandwidth ratio. The first portion of the memory subsystem is allocated to one or more high-performance memory clients. The second remaining portion is allocated to one or more relatively lower-performance memory clients.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: August 18, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Richard A. Stewart, Dexter T. Chun
  • Patent number: 9104413
    Abstract: Various embodiments of methods and systems for hardware (“HW”) based dynamic memory management in a portable computing device (“PCD”) are disclosed. One exemplary method includes generating a lookup table (“LUT”) to track each memory page located across multiple portions of a volatile memory. The records in the LUT are updated to keep track of data locations. When the PCD enters a sleep state to conserve energy, the LUT may be queried to determine which specific memory pages in a first portion of volatile memory (e.g., an upper bank) contain data content and which pages in a second portion of volatile memory (e.g., a lower bank) are available for receipt of content. Based on the query, the location of the data in the memory pages of the upper bank is known and can be quickly migrated to memory pages in the lower bank which are identified for receipt of the data.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: August 11, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Haw-Jing Lo, Ali Taha, Dexter T. Chun
  • Patent number: 9092327
    Abstract: Systems and methods are provided for allocating memory to dissimilar memory devices. An exemplary embodiment includes a method for allocating memory to dissimilar memory devices. An interleave bandwidth ratio is determined, which comprises a ratio of bandwidths for two or more dissimilar memory devices. The dissimilar memory devices are interleaved according to the interleave bandwidth ratio to define two or more memory zones having different performance levels. Memory address requests are allocated to the memory zones based on a quality of service (QoS).
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: July 28, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Subrato K. De, Richard A. Stewart, Gheorghe Calin Cascaval, Dexter T. Chun
  • Patent number: 9088445
    Abstract: A method of controlling signal termination includes providing first logic for selectively terminating signals received at a first device on a bidirectional data bus, providing second logic for selectively terminating signals received at a second device on the bidirectional data bus, sending first signals from the first device to the second device on the bidirectional data bus at a first speed, stopping the sending of the first signals, after stopping the sending of the first signals, enabling the second logic and shifting a reference voltage of the second device from a first level to a second level, after enabling the second logic at the second device, sending second signals from the first device to the second device on the bidirectional data bus at a higher speed, and controlling the first logic based on a speed of signals received at the first device on the bidirectional data bus.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: July 21, 2015
    Assignee: QUALCOMM INCORPORATED
    Inventors: Dexter T. Chun, Sumeet S. Sethi, John D. Eaton, Vinodh R. Cuppu, Vikram Arora, Vaishnav Srinivas, Asim Muhammad Muneer, Isaac D. Berk
  • Patent number: 8959298
    Abstract: Systems and methods are provided for managing performance of a computing device having dissimilar memory types. An exemplary embodiment comprises a method for interleaving dissimilar memory devices. The method involves determining an interleave bandwidth ratio comprising a ratio of bandwidths for two or more dissimilar memory devices. The dissimilar memory devices are interleaved according to the interleave bandwidth ratio. Memory address requests are distributed from one or more processing units to the dissimilar memory devices according to the interleave bandwidth ratio.
    Type: Grant
    Filed: December 24, 2012
    Date of Patent: February 17, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Dexter T. Chun, Serag Gadelrab, Stephen Molloy, Thomas Zeng
  • Publication number: 20150039848
    Abstract: In a particular embodiment, a device includes memory address remapping circuitry and a remapping engine. The memory address remapping circuitry includes a comparison circuit to compare a received memory address to one or more remapped addresses. The memory address remapping circuitry also includes a selection circuit responsive to the comparison circuit to output a physical address. The physical address corresponds to a location in a random-access memory (RAM). The remapping engine is configured to update the one or more remapped addresses to include a particular address in response to detecting that a number of occurrences of errors at a particular location satisfies a threshold.
    Type: Application
    Filed: August 2, 2013
    Publication date: February 5, 2015
    Applicant: QUAL COMM Incorporated
    Inventors: Dexter T. Chun, Jungwon Suh, Stephen A. Molloy, Jung Pill Kim
  • Publication number: 20140337560
    Abstract: Aspects include systems and methods for increasing performance of a flash translation layer (FTL) of a flash memory device. A copy of FTL tables stored on a flash memory device may be copied to a memory of a host device. The copy of the FTL tables may be directly accessed by the flash memory device to translate between logical addresses provided by the host device for read/write operations from/to a flash memory of the flash memory device, and the respective physical addresses of the flash memory. The flash memory device is granted direct memory access to a portion of the memory of the host device where the copy of the FTL tables is stored. The flash memory device bus masters communication busses connecting the flash memory device to the memory of the host device.
    Type: Application
    Filed: May 13, 2013
    Publication date: November 13, 2014
    Inventors: Dexter T. Chun, Anand Srinivasan, Hyunsuk Shin, Steve Haehnichen
  • Publication number: 20140330994
    Abstract: A synchronous data-link throughput enhancement technique based on data signal duty-cycle and phase modulation demodulation is disclosed. A method includes receiving multiple bits to be transmitted, encoding the multiple bits to generate a multi-bit signal that represents the multiple bits, and transmitting, via a synchronous interface, the multi-bit signal during a time period that corresponds to one-half of a cycle of a synchronization signal.
    Type: Application
    Filed: May 6, 2013
    Publication date: November 6, 2014
    Applicant: QUALCOMM Incorporated
    Inventors: Lalan J. Mishra, Dexter T. Chun, Animesh Datta
  • Publication number: 20140281328
    Abstract: A memory interface includes circuitry configured for applying a variable delay to a portion of a data signal and applying a variable delay to a data strobe. The delayed data strobe samples the delayed portion of the data signal. Delayed portions of the data signal are spaced away from non-delayed portions of the data signal by alternating the routing of delayed bits and non-delayed bits of the data signal. A training block determines and sets a value of the variable delay corresponding to a largest value of a number of recorded eye aperture widths.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: QUALCOMM INCORPORATED
    Inventors: Shree Krishna Pandey, Dexter T. Chun
  • Publication number: 20140253173
    Abstract: A method of controlling signal termination includes providing first logic for selectively terminating signals received at a first device on a bidirectional data bus, providing second logic for selectively terminating signals received at a second device on the bidirectional data bus, sending first signals from the first device to the second device on the bidirectional data bus at a first speed, stopping the sending of the first signals, after stopping the sending of the first signals, enabling the second logic and shifting a reference voltage of the second device from a first level to a second level, after enabling the second logic at the second device, sending second signals from the first device to the second device on the bidirectional data bus at a higher speed, and controlling the first logic based on a speed of signals received at the first device on the bidirectional data bus.
    Type: Application
    Filed: March 7, 2013
    Publication date: September 11, 2014
    Applicant: QUALCOMM INCORPORATED
    Inventors: Dexter T. Chun, Sumeet S. Sethi, John D. Eaton, Vinodh R. Cuppu, Vikram Arora, Vaishnav Srinivas, Muhammad A. Muneer, Isaac D. Berk