Patents by Inventor Dietmar Haberer

Dietmar Haberer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10840107
    Abstract: A method for forming a cavity in a silicon substrate, a surface of the silicon substrate having a tilting angle relative to a first plane of the silicon substrate, and the first plane being a {111} plane of the silicon substrate, and situation of an etching mask on the surface of the silicon substrate. The etching mask has a retarding structure that protrudes into the mask opening, and a first etching projection region. All further edges of the mask opening outside the first etching projection region are situated essentially parallel to {111} planes of the silicon substrate. The method includes an anisotropic etching of the silicon substrate during a defined etching duration. An etching rate in the <111> directions of the silicon substrate is lower than in other spatial directions, and the first retarding structure is undercut in a first undercut direction going out from the first etching projection region.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: November 17, 2020
    Assignee: Robert Bosch GmbH
    Inventors: Simon Armbruster, Benjamin Steuer, Stefan Pinter, Dietmar Haberer, Jochen Tomaschko
  • Publication number: 20190348300
    Abstract: A method for forming a cavity in a silicon substrate, a surface of the silicon substrate having a tilting angle relative to a first plane of the silicon substrate, and the first plane being a {111} plane of the silicon substrate, and situation of an etching mask on the surface of the silicon substrate. The etching mask has a retarding structure that protrudes into the mask opening, and a first etching projection region. All further edges of the mask opening outside the first etching projection region are situated essentially parallel to {111} planes of the silicon substrate. The method includes an anisotropic etching of the silicon substrate during a defined etching duration. An etching rate in the <111> directions of the silicon substrate is lower than in other spatial directions, and the first retarding structure is undercut in a first undercut direction going out from the first etching projection region.
    Type: Application
    Filed: July 23, 2019
    Publication date: November 14, 2019
    Inventors: Simon Armbruster, Benjamin Steuer, Stefan Pinter, Dietmar Haberer, Jochen Tomaschko
  • Patent number: 10431474
    Abstract: A method for forming a cavity in a silicon substrate, a surface of the silicon substrate having a tilting angle relative to a first plane of the silicon substrate, and the first plane being a {111} plane of the silicon substrate, and situation of an etching mask on the surface of the silicon substrate. The etching mask has a retarding structure that protrudes into the mask opening, and a first etching projection region. All further edges of the mask opening outside the first etching projection region are situated essentially parallel to {111} planes of the silicon substrate. The method includes an anisotropic etching of the silicon substrate during a defined etching duration. An etching rate in the <111> directions of the silicon substrate is lower than in other spatial directions, and the first retarding structure is undercut in a first undercut direction going out from the first etching projection region.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: October 1, 2019
    Assignee: Robert Bosch GmbH
    Inventors: Simon Armbruster, Benjamin Steuer, Stefan Pinter, Dietmar Haberer, Jochen Tomaschko
  • Patent number: 9663351
    Abstract: A production method for a wafer equipped with transparent plates includes: formation of a row of through-holes in a wafer; formation of at least one strip-shaped recess in a wafer surface, each of the through-holes of the same row intersecting partly with the respectively associated strip-shaped recess; an uninterrupted groove being formed in each intermediate region between two adjacent through-holes of the same row, the floor surface of the groove being oriented so as to be inclined relative to the wafer surface by an angle of inclination greater than 0° and less than 90°; and covering at least one through-hole with at least one transparent plate made of at least one material transparent to at least a sub-spectrum of electromagnetic radiation.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: May 30, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventors: Simon Armbruster, Dietmar Haberer, Stefan Pinter, Jochen Tomaschko, Benjamin Steuer
  • Publication number: 20170140943
    Abstract: A method for forming a cavity in a silicon substrate, a surface of the silicon substrate having a tilting angle relative to a first plane of the silicon substrate, and the first plane being a {111} plane of the silicon substrate, and situation of an etching mask on the surface of the silicon substrate. The etching mask has a retarding structure that protrudes into the mask opening, and a first etching projection region. All further edges of the mask opening outside the first etching projection region are situated essentially parallel to {111} planes of the silicon substrate. The method includes an anisotropic etching of the silicon substrate during a defined etching duration. An etching rate in the <111> directions of the silicon substrate is lower than in other spatial directions, and the first retarding structure is undercut in a first undercut direction going out from the first etching projection region.
    Type: Application
    Filed: May 29, 2015
    Publication date: May 18, 2017
    Inventors: Simon Armbruster, Benjamin Steuer, Stefan Pinter, Dietmar Haberer, Jochen Tomaschko
  • Publication number: 20170081183
    Abstract: A micromechanical layer system, having at least two mechanically active functional layers patterned independently of each other, which are arranged vertically one on top of the other and are functionally coupled to each other.
    Type: Application
    Filed: May 29, 2015
    Publication date: March 23, 2017
    Inventors: Simon Armbruster, Rainer Straub, Stefan Pinter, Ralf Hausner, Dietmar Haberer, Johannes Baader
  • Patent number: 9365410
    Abstract: A method for producing a micromechanical component, and a micromechanical component, includes providing a substrate having first and second outer surfaces, the second surface facing away from the first surface; forming a through-hole through the substrate from the first outer surface up to the second outer surface; attaching an optical functional layer, on the second outer surface, to cover the through-hole; removing a first segment of the substrate on the first surface of the substrate so that there arises a third outer surface inclined relative to the second surface, the third surface facing away from the second surface, the inclined surface enclosing the through-hole; and separating the micromechanical component by separating a first part of the substrate, having the through-hole, and a second part, attached to the first part, of the optical functional layer from a remaining part of the substrate and a remaining part of the optical functional layer.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: June 14, 2016
    Assignee: ROBERT BOSCH GMBH
    Inventor: Dietmar Haberer
  • Publication number: 20150232328
    Abstract: A production method for a wafer equipped with transparent plates includes: formation of a row of through-holes in a wafer; formation of at least one strip-shaped recess in a wafer surface, each of the through-holes of the same row intersecting partly with the respectively associated strip-shaped recess; an uninterrupted groove being formed in each intermediate region between two adjacent through-holes of the same row, the floor surface of the groove being oriented so as to be inclined relative to the wafer surface by an angle of inclination greater than 0° and less than 90°; and covering at least one through-hole with at least one transparent plate made of at least one material transparent to at least a sub-spectrum of electromagnetic radiation.
    Type: Application
    Filed: January 30, 2015
    Publication date: August 20, 2015
    Inventors: Simon ARMBRUSTER, Dietmar Haberer, Stefan Pinter, Jochen Tomaschko, Benjamin Steuer
  • Publication number: 20150232323
    Abstract: A method for producing a micromechanical component, and a micromechanical component, includes providing a substrate having first and second outer surfaces, the second surface facing away from the first surface; forming a through-hole through the substrate from the first outer surface up to the second outer surface; attaching an optical functional layer, on the second outer surface, to cover the through-hole; removing a first segment of the substrate on the first surface of the substrate so that there arises a third outer surface inclined relative to the second surface, the third surface facing away from the second surface, the inclined surface enclosing the through-hole; and separating the micromechanical component by separating a first part of the substrate, having the through-hole, and a second part, attached to the first part, of the optical functional layer from a remaining part of the substrate and a remaining part of the optical functional layer.
    Type: Application
    Filed: February 17, 2015
    Publication date: August 20, 2015
    Inventor: Dietmar HABERER
  • Publication number: 20140376089
    Abstract: A manufacturing method for manufacturing a window-equipped cover for an optical device includes: forming an opening in a front side of a substrate, which opening has a first base partial surface at a first depth and a second base partial surface at a greater second depth; introducing a window plate into the opening in such a way that the window plate is supported on a first partial area of the first base partial surface and on a second partial area of the second base partial surface of the opening; and at least partially filling and/or covering a gap between at least one outer edge of the window plate and the opening, with the aid of at least one sealant and/or adhesive, from a side of the window plate oriented toward the front side of the substrate.
    Type: Application
    Filed: June 23, 2014
    Publication date: December 25, 2014
    Applicant: Robert Bosch GmbH
    Inventor: Dietmar Haberer