Patents by Inventor Dietrich Schubert
Dietrich Schubert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9239339Abstract: An acceleration sensor has a substrate, a seismic mass and a detection unit. The seismic mass is configured to be deflected based on an external acceleration acting on the acceleration sensor, the deflection being in the form of a deflection motion with respect to the substrate along a deflection direction. The detection unit is configured to be deflected for the detection of a deflection of the seismic mass, the detection being in the form of a detection motion with respect to the substrate along a detection direction. The detection unit is connected to the seismic mass in such a way that the amplitude of the deflection motion along the deflection direction is greater than the amplitude of the detection motion along the detection direction.Type: GrantFiled: September 26, 2012Date of Patent: January 19, 2016Assignee: ROBERT BOSCH GMBHInventors: Rolf Kaack, Dietrich Schubert, Harald Emmerich, Patrick Wellner
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Publication number: 20140083190Abstract: An acceleration sensor has a substrate, a seismic mass and a detection unit. The seismic mass is configured to be deflected based on an external acceleration acting on the acceleration sensor, the deflection being in the form of a deflection motion with respect to the substrate along a deflection direction. The detection unit is configured to be deflected for the detection of a deflection of the seismic mass, the detection being in the form of a detection motion with respect to the substrate along a detection direction. The detection unit is connected to the seismic mass in such a way that the amplitude of the deflection motion along the deflection direction is greater than the amplitude of the detection motion along the detection direction.Type: ApplicationFiled: September 26, 2012Publication date: March 27, 2014Inventors: Rolf Kaack, Dietrich Schubert, Harald Emmerich, Patrick Wellner
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Patent number: 8429971Abstract: A micromechanical acceleration sensor includes a substrate, an elastic diaphragm which extends parallel to the substrate plane and which is partially connected to the substrate, and which has a surface region which may be deflected perpendicular to the substrate plane, and a seismic mass whose center of gravity is situated outside the plane of the elastic diaphragm. The seismic mass extends at a distance over substrate regions which are situated outside the region of the elastic diaphragm and which include a system composed of multiple electrodes, each of which together with oppositely situated regions of the seismic mass forms a capacitor in a circuit. In its central region the seismic mass is attached to the elastic diaphragm in the surface region of the elastic diaphragm which may be deflected perpendicular to the substrate plane.Type: GrantFiled: November 14, 2007Date of Patent: April 30, 2013Assignee: Robert Bosch GmbHInventors: Johannes Classen, Axel Franke, Dietrich Schubert, Kersten Kehr, Ralf Reichenbach
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Patent number: 8393215Abstract: A micromechanical acceleration sensor having a substrate, a suspension, a seismic mass, and stationary capacitive electrodes, in which the seismic mass is suspended over the substrate with the help of the suspension, the seismic mass has a mass center of gravity, the suspension has at least two anchors on the substrate, the two anchors are situated on opposite sides of the mass center of gravity, the distance between the two anchors being small compared to a horizontal extension of the seismic mass, the two anchors determine a central axis, the seismic mass have recesses which are situated on opposite sides of the central axis and are laterally open outward on the sides facing away from the central axis, and the stationary electrodes at least engage in the recesses of the seismic mass.Type: GrantFiled: May 19, 2009Date of Patent: March 12, 2013Assignee: Robert Bosch GmbHInventors: Heiko Stahl, Dietrich Schubert, Lars Tebje
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Patent number: 8336382Abstract: An acceleration sensor is described that has a base substrate, a first electrode structure situated in stationary fashion relative to the base substrate, a sensor element having a first electrode area, and a spring device having at least one spring element. Via the spring element, the sensor element is coupled to the base substrate so that the sensor element is deflected relative to the base substrate as the result of an acceleration acting on the sensor element, thus changing the distance between the first electrode structure and the first electrode area. The sensor element and the first electrode structure are situated at least partially one over the other and are formed from a common functional layer.Type: GrantFiled: November 2, 2009Date of Patent: December 25, 2012Assignee: Robert Bosch GmbHInventors: Johannes Classen, Arnd Kaelberer, Patrick Wellner, Dietrich Schubert, Lars Tebje
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Publication number: 20120073370Abstract: A micromechanical structure, in particular an acceleration sensor, is described, having a substrate, a seismic mass, which is movable relative to the substrate, and at least one anchoring element, which is fixedly connected to the substrate, the seismic mass being attached to the substrate by the anchoring element, and at least one spring element being situated between the seismic mass and the anchoring element, and furthermore, the anchoring element has at least one stop element for interaction with at least one counterstop element of the seismic mass.Type: ApplicationFiled: January 20, 2010Publication date: March 29, 2012Inventors: Dietrich Schubert, Wolfgang Fuerst, Stefan Liebing, Stefan Rurlaender
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Publication number: 20110174076Abstract: A micromechanical acceleration sensor includes a substrate, an elastic diaphragm which extends parallel to the substrate plane and which is partially connected to the substrate, and which has a surface region which may be deflected perpendicular to the substrate plane, and a seismic mass whose center of gravity is situated outside the plane of the elastic diaphragm. The seismic mass extends at a distance over substrate regions which are situated outside the region of the elastic diaphragm and which include a system composed of multiple electrodes, each of which together with oppositely situated regions of the seismic mass forms a capacitor in a circuit. In its central region the seismic mass is attached to the elastic diaphragm in the surface region of the elastic diaphragm which may be deflected perpendicular to the substrate plane.Type: ApplicationFiled: November 14, 2007Publication date: July 21, 2011Inventors: Johannes Classen, Axel Franke, Dietrich Schubert, Kersten Kehr, Ralf Reichenbach
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Patent number: 7878061Abstract: A micromechanical system includes a substrate, a first planar electrode, a second planar electrode, and a third planar electrode. The second planar electrode is movably positioned at a distance above the first planar electrode and the third planar electrode is positioned at a distance above the second electrode.Type: GrantFiled: November 26, 2008Date of Patent: February 1, 2011Assignee: Robert Bosch GmbHInventors: Johannes Classen, Arnd Kaelberer, Patrick Wellner, Dietrich Schubert, Lars Tebje
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Publication number: 20100107762Abstract: An acceleration sensor is described that has a base substrate, a first electrode structure situated in stationary fashion relative to the base substrate, a sensor element having a first electrode area, and a spring device having at least one spring element. Via the spring element, the sensor element is coupled to the base substrate so that the sensor element is deflected relative to the base substrate as the result of an acceleration acting on the sensor element, thus changing the distance between the first electrode structure and the first electrode area. The sensor element and the first electrode structure are situated at least partially one over the other and are formed from a common functional layer.Type: ApplicationFiled: November 2, 2009Publication date: May 6, 2010Inventors: Johannes CLASSEN, Arnd Kaelberer, Patrick Wellner, Dietrich Schubert, Lars Tebje
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Publication number: 20090314085Abstract: A micromechanical acceleration sensor having a substrate, a suspension, a seismic mass, and stationary capacitive electrodes, in which the seismic mass is suspended over the substrate with the help of the suspension, the seismic mass has a mass center of gravity, the suspension has at least two anchors on the substrate, the two anchors are situated on opposite sides of the mass center of gravity, the distance between the two anchors being small compared to a horizontal extension of the seismic mass, the two anchors determine a central axis, the seismic mass have recesses which are situated on opposite sides of the central axis and are laterally open outward on the sides facing away from the central axis, and the stationary electrodes at least engage in the recesses of the seismic mass.Type: ApplicationFiled: May 19, 2009Publication date: December 24, 2009Inventors: Heiko Stahl, Dietrich Schubert, Lars Tebje
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Publication number: 20090152654Abstract: A micromechanical system includes a substrate, a first planar electrode, a second planar electrode, and a third planar electrode. The second planar electrode is movably positioned at a distance above the first planar electrode and the third planar electrode is positioned at a distance above the second electrode.Type: ApplicationFiled: November 26, 2008Publication date: June 18, 2009Inventors: Johannes Classen, Arnd Kaelberer, Patrick Wellner, Dietrich Schubert, Lars Tebje
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Patent number: 6634232Abstract: The present invention relates to an acceleration sensor including an oscillating structure which is movably suspended on a substrate and deflectable in response to the action of an acceleration, a plane of oscillation of the oscillating structure being essentially parallel to a substrate plane, and further including evaluation arrangements for measuring a deflection of the oscillating structure due to acceleration. In this context, provision is made for stop arrangements which limit a deflection movement of the oscillating structure in a direction essentially perpendicular to the plane of oscillation (x-, y-plane) of the oscillating structure.Type: GrantFiled: September 19, 2002Date of Patent: October 21, 2003Assignee: Robert Bosch GmbHInventors: Rasmus Rettig, Oliver Kohn, Frank Fischer, Dietrich Schubert
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Patent number: 6360605Abstract: A micromechanical device, in particular an acceleration sensor, includes a seismic mass which is resiliently supported on a substrate via a first flexural spring device and which can be deflected in at least one direction by an acceleration, the deflection being able to be limited by a stop device. The stop device has at least one limit stop that is resiliently supported on the substrate via a second flexural spring device, the second flexural spring device having a greater flexural strength than the first flexural spring device.Type: GrantFiled: June 30, 2000Date of Patent: March 26, 2002Assignee: Robert Bosch GmbHInventors: Stefan Pinter, Martin Schoefthaler, Matthias Illing, Ralf Schellin, Helmut Baumann, Michael Fehrenbach, Dietrich Schubert, Georg Bischopink
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Patent number: 6318177Abstract: A method for producing a micromechanical component (e.g., a capacitive acceleration sensor) having one or several electrical or mechanical function variables dependent on at least one geometric design parameter. The micromechanical component is produced by an etching process via which a structure with bars and trenches is formed. The structure is formed by drafting a design for the micromechanical component in such a way that the geometric design parameter within the local area of the micromechanical component is subject to a predetermined process-related regularity. The design parameter is essentially constant in relation to function blocks in particular, so that in the etching process, the process tolerance of the design parameter within the micromechanical component essentially shows no locus dependency.Type: GrantFiled: April 29, 1999Date of Patent: November 20, 2001Assignee: Robert Bosch GmbHInventors: Nicholas Buchan, Michael Fehrenbach, Dietrich Schubert
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Publication number: 20010017058Abstract: A method for producing a micromechanical component (e.g., a capacitive acceleration sensor) having one or several electrical or mechanical function variables dependent on at least one geometric design parameter. The micromechanical component is produced by an etching process via which a structure with bars and trenches is formed. The structure is formed by drafting a design for the micromechanical component in such a way that the geometric design parameter within the local area of the micromechanical component is subject to a predetermined process-related regularity. The design parameter is essentially constant in relation to function blocks in particular, so that in the etching process, the process tolerance of the design parameter within the micromechanical component essentially shows no locus dependency.Type: ApplicationFiled: April 29, 1999Publication date: August 30, 2001Inventors: NICHOLAS BUCHAN, MICHAEL FEHRENBACH, DIETRICH SCHUBERT
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Patent number: 6272926Abstract: A micromechanical component, in particular an acceleration sensor, includes a substrate, at least one spring element and at least one seismic mass. The spring element is joined at a first end to the substrate and at a second end to the mass, and the rigidity of the spring element is set such that a movement of the mass relative to the substrate can be caused by an acceleration parallel to a surface of the substrate. For the spring element, provision is made for a spring limit stop which limits a deformation of the spring element in response to an acceleration parallel to the surface of the substrate.Type: GrantFiled: April 16, 1999Date of Patent: August 14, 2001Assignee: Robert Bosch GmbHInventors: Michael Fehrenbach, Dietrich Schubert, Heinz-Georg Vossenberg
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Patent number: 6106735Abstract: A wafer stack with sensor elements hermetically sealed in caverns and a method of fabricating the sensors permitting a reduction in the size of the sensors formed after cutting the wafer stack and also yielding considerable savings in chip area in the manufacture of the wafer stack. The wafer stack includes bonding strips arranged between the individual sensor elements. The wafer stack is diced to form individual sensors by sawing in the middle through the bonding strips.Type: GrantFiled: January 12, 1998Date of Patent: August 22, 2000Assignee: Robert Bosch GmbHInventors: Jurgen Kurle, Kurt Weiblen, Stefan Pinter, Horst Muenzel, Helmut Baumann, Dietrich Schubert, Karl Bender, Markus Lutz
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Patent number: 6055858Abstract: An acceleration sensor is composed of a three-layer system. The acceleration sensor and conductor tracks are patterned out of the third layer. The conductor tracks are electrically isolated from other regions of the third layer by recesses and electrically insulated from a first layer by a second electrically insulating layer. In this manner, a simple electrical contacting is achieved, which is configured out of a three-layer system. One exemplary application of the acceleration sensor includes mounting the acceleration sensor on a vibrational system of an rpm (rate-of-rotation sensor). This simplifies the manufacturing of an rpm sensor, since the vibrational system and the acceleration sensor are configured out of a three-layer system, wherein the conductor tracks are run into the frame of the rpm sensor in which the vibrational system is suspended, so as to allow excursion.Type: GrantFiled: July 28, 1999Date of Patent: May 2, 2000Assignee: Robert Bosch GmbHInventors: Horst Muenzel, Dietrich Schubert, Alexandra Boehringer, Michael Offenberg, Klaus Heyers, Markus Lutz
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Patent number: 5959208Abstract: An acceleration sensor is composed of a three layer system. The acceleration sensor and conductor tracks are patterned out of the third layer. The conductor tracks are electrically isolated from other regions of the third layer by recesses and electrically insulated from a first layer by a second electrically insulating layer. In this manner, a simple electrical contacting is achieved, which is configured out of a three-layer system.Type: GrantFiled: September 18, 1997Date of Patent: September 28, 1999Assignee: Robert Bosch GmbHInventors: Horst Muenzel, Dietrich Schubert, Alexandra Boehringer, Michael Offenberg, Klaus Heyers, Markus Lutz
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Patent number: 5723353Abstract: An acceleration sensor is composed of a three-layer system. The acceleration sensor and conductor tracks are patterned out of the third layer. The conductor tracks are electrically isolated from other regions of the third layer by recesses and electrically insulated from a first layer by a second electrically insulating layer. In this manner, a simple electrical contacting is achieved, which is configured out of a three-layer system.Type: GrantFiled: February 12, 1996Date of Patent: March 3, 1998Assignee: Robert Bosch GmbHInventors: Horst Muenzel, Dietrich Schubert, Alexandra Boehringer, Michael Offenberg, Klaus Heyers, Markus Lutz