Abstract: Apparatuses, systems, and methods are provided for scalable networking systems. An example system includes a plurality of core switches and a first stage patch panel associated with operation of a first set of network ports. In an operational configuration in which the first stage patch panel is coupled with the plurality of core switches, the first stage patch panel is configured to operatively couple the first set of network ports and a first portion of the plurality of core switches such that signals may pass therebetween. Furthermore, the first stage patch panel may preclude communication to a remaining portion of the plurality of core switches. The system may include a second stage patch panel associated with a second set of network ports that is operatively coupled with the plurality of core switches in the absence of the first stage patch panel so as to scale the networking system.

Abstract: Apparatuses, systems, and associated methods of manufacturing are described that provide a dynamic data interconnect and networking cable configuration. The dynamic data interconnect includes a substrate, transmitters supported on the substrate configured to generate signals, and receivers supported on the substrate configured to receive signals. The dynamic data interconnect further includes a number of connection pads that receive data cables attached thereto and a number of transmission lanes that operably couple the transmitters and receivers to the connection pads. The dynamic data interconnect further includes transmission circuitry in communication with each of the transmitters and receivers such that, in an operational configuration, the transmission circuitry determines a transmission state of the dynamic data interconnect and selectively disables operation of at least a portion of the transmitters or at least a portion of the receivers.

Abstract: Embodiments are disclosed for providing a serializer and/or a deserializer with redundancy using optical modulators. An example system includes an MZM structure that comprises a first waveguide interferometer arm structure and a second waveguide interferometer arm structure. The first waveguide interferometer arm structure comprises a first segmented electrode associated with at least a first electrode and a second electrode. The second waveguide interferometer arm structure comprises a second segmented electrode associated with at least a third electrode and a fourth electrode. The MZM structure is configured to convert an optical input signal into an optical output signal through application of a digital data signal to the first electrode and the third electrode, and application of a redundant digital data signal to the second electrode and the fourth electrode.

Abstract: Optical communication devices and associated methods of manufacturing are provided. An example optical communication device includes a substrate defining a first end and a second end. The optical communication device also includes a primary optical communication medium attached to the second end and a secondary optical communication medium attached to the second end. The optical communication device further includes a signal preclusion component supported by the substrate that selectively preclude signal transmission of optical signals received via the first end to either the primary optical communication medium or the secondary optical communication medium.

Abstract: Apparatuses, systems, and techniques to monitor health data from components and predict needs for maintenance. In at least one embodiment, monitoring health data of cables having one or more known characteristics ands analyzing the health data to determine the health metrics of the one or more cable to generate profiles of the cables used to predict future health metrics of the cables and related cables sharing known characteristics.

Abstract: Systems, computer program products, and methods are described herein for network discovery, port identification, and/or identifying fiber link failures in an optical network, in accordance with an embodiment of the invention. The present invention may be configured to sequentially connect each port of an optical switch to a network port of a server and generate, based on information associated with network devices connected to the ports, a network map. The network map may identify which network devices are connected to which ports of the optical switch and may permit dynamic port mapping for network installation, upgrades, repairs, and/or the like. The present invention may also be configured to determine a fiber link in which a failure occurred and reconfigure the optical switch to allow communication between an optical time-domain reflectometer and the fiber link to test the fiber link.

Abstract: A transceiver module for providing operational resilience is presented. The transceiver module is configured to receive first data via a first optical module in a first configuration of operation and detect, using an adapter that is operationally connected to the first optical module, an operational failure of the first optical module. In response to detecting the operational failure, the transceiver module is configured to switch, via the adapter, from the first configuration of operation to a second configuration of operation by: automatically engaging a second optical module; triggering the first data that was initially directed into a first input port of the first optical module to be directed into a second input port of the second optical module; and receiving the first data from a second output port of the second optical module.

Abstract: Embodiments are disclosed for providing a dual-facet distributed feedback (DFB) laser in a Mach-Zehnder modulator (MZM) structure. An example system includes an MZM structure that includes a DFB laser, a first waveguide interferometer arm structure, and a second waveguide interferometer arm structure. The DFB laser is configured to generate an optical input signal where the DFB laser includes a first output facet and a second output facet. The first waveguide interferometer arm structure is coupled to the first output facet of the DFB laser, and the first output facet of the DFB laser emits the optical input signal to the first waveguide interferometer arm structure. The second waveguide interferometer arm structure is coupled to the second output facet of the DFB laser, and the second output facet of the DFB laser emits the optical input signal to the second waveguide interferometer arm structure.

Abstract: Embodiments are disclosed for a coupling element with embedded modal filtering for a laser and/or a photodiode. An example system includes a laser and an optical coupling element. The laser is configured to emit an optical signal. The optical coupling element is configured to receive the optical signal emitted by the laser. The optical coupling element is also configured to be connected to an optical fiber such that, in operation, the optical signal is transmitted from the laser to the optical fiber via the optical coupling element. Furthermore, the coupling element comprises a tapered section that provides modal filtering of the optical signal.

Abstract: A multi-chip module (MCM-10) includes a substrate (11), one or more photonic chips (14) disposed on the substrate, and an electronic chip (12) disposed on the substrate. The one or more photonic chips include one or more optical channels (22), which are configured to guide propagating optical signals, and two or more photonic modulator-segments (18) coupled to each of the optical channels, each photonic modulator-segment configured to modulate the propagating optical signals responsively to digitally modulated driving electrical signals provided thereto.

Abstract: Optical components and associated methods of manufacturing are provided. An example optical component includes a body defined by an optical interposer substrate and a passivation layer applied to the optical interposer substrate. The optical interposer substrate defines a first surface of the body, and the passivation layer defines a second surface of the body opposite the first surface. The passivation layer includes a metallic shielding element configured to prevent interference between the first surface and the second surface. The optical component further includes an opening extending from the second surface to the optical interposer substrate, the opening defining an optical path through the passivation layer. The optical interposer substrate receives an optical signal from an optical transmitter supported by the second surface via the optical path.

Abstract: A photonics frequency comb generator includes two integrated dies: an indium phosphide die laser of a first wavelength is grown on from, and a silicon photonics die having a microring resonator connected to the laser and frequency modulators. The microring resonator converts the first wavelength into a number of second wavelengths. One type of the microring resonator is a hybrid non-linear optical wavelength generator, comprising non-silicon materials, such as SiC or SiGe built on silicon to yield a non-linear wavelength generation. The second wavelengths are generated by adjusting the ring's geometric size and a distance between the ring and the traverse waveguide. Another type of microring resonator splits the first wavelength into a plurality of second wavelengths and transmits the multiple second wavelengths to filters and modulators, and each selects and modulates one of the second wavelengths in a one-to-one relationship.

Abstract: An optoelectronic component may include a substrate, an electronic integrated circuit supported by the substrate, and a photonic integrated circuit supported by the substrate. The optoelectronic component may include a plurality of substrate interconnect connectors disposed on the substrate, a plurality of electronic integrated circuit interconnect connectors disposed on the electronic integrated circuit, and a plurality of photonic integrated circuit interconnect connectors disposed on the photonic integrated circuit. The optoelectronic component may include a first plurality of cable connectors, each cable connector connected to the substrate, the electronic integrated circuit, and the photonic integrated circuit via respective interconnect connectors. The first plurality of cable connectors may be configured to facilitate electrical communication between the substrate, the electronic integrated circuit, and the photonic integrated circuit.

Abstract: An apparatus includes multiple ports, packet communication processing circuitry coupled to the ports, and a processor that is configured to receive, from the packet communication processing circuitry, metadata that is indicative of a temporal pattern of control messages communicated via one or more of the ports, and to identify a network attack by applying anomaly detection to the temporal pattern of the control messages.

Abstract: An optoelectronic transmitter (10) includes an electro-optic modulator (12), digital driving circuitry (14), and feedback circuitry (30). The electro-optic modulator is configured to modulate an optical signal in response to an electrical drive signal. The digital driving circuitry is coupled to the electro-optical modulator and is configured to generate the electrical drive signal. The feedback circuitry is configured to measure a quantity indicative of a power level of the modulated optical signal produced by the electro-optic modulator, and to adapt a supply voltage to the digital driving circuitry in response to the measured quantity.

Abstract: Apparatuses, systems, and associated methods are described that provide an optical device with sealed optoelectronic component(s) without impacting effective optical performance of the optical device. An example optical device includes a substrate that defines a first surface and a second surface opposite the first surface. The optical device further includes an optoelectronic component supported by the first surface of the substrate where the optoelectronic component operates with optical signals. The optical device further includes a conformal coating applied to the first surface of the substrate such that at least a portion of the conformal coating is disposed on the optoelectronic component. The conformal coating substantially seals the optoelectronic component from an external environment of the optical device without impacting effective optical performance of the optical device.

Abstract: Apparatuses, systems, and associated methods are described that provide an optical device with sealed optoelectronic component(s) without impacting effective optical performance of the optical device. An example optical device includes a substrate that defines a first surface and a second surface opposite the first surface. The optical device further includes an optoelectronic component supported by the first surface of the substrate where the optoelectronic component operates with optical signals. The optical device further includes a conformal coating applied to the first surface of the substrate such that at least a portion of the conformal coating is disposed on the optoelectronic component. The conformal coating substantially seals the optoelectronic component from an external environment of the optical device without impacting effective optical performance of the optical device.

Abstract: A transceiver comprises a transmitter including a light source, a modulator coupled to the light source, a driver that drives the modulator according to a set of driving conditions to cause the modulator to output optical signals based on light from the light source, and an output that passes first portions of the optical signals output by the modulator. The transceiver further comprises a first detector that detects second portions of the optical signals output from the modulator, and a receiver including a second detector that detects optical signals from an external transmitter.

Abstract: Embodiments are disclosed for providing a serializer and/or a deserializer with redundancy using optical modulators. An example system includes an MZM structure that comprises a first waveguide interferometer arm structure and a second waveguide interferometer arm structure. The first waveguide interferometer arm structure comprises a first segmented electrode associated with at least a first electrode and a second electrode. The second waveguide interferometer arm structure comprises a second segmented electrode associated with at least a third electrode and a fourth electrode. The MZM structure is configured to convert an optical input signal into an optical output signal through application of a digital data signal to the first electrode and the third electrode, and application of a redundant digital data signal to the second electrode and the fourth electrode.

Abstract: An apparatus comprises a support structure and one or more first optical components on the support structure that communicatively couple with a first endpoint. The one or more first optical components are configured to output and receive optical signals that travel over a free space medium to establish a secure link between the first endpoint and a second endpoint.