Abstract: A connector assembly (28) for mounting a daughter board (20) on a mother board (66) and providing electrical connections therebetween. The connector assembly (28) is made up of a housing (74) mounted on the daughter board (20), a plurality of coaxial cable subassemblies (30), a faceplate member (76) and a cover member (78). The cable subassemblies (30) are held in the housing (74) with their two ends in positions corresponding to contact positions on the daughter board (20) and the mother board (66), with the cable subassemblies (30) being arranged to make a right angle turn. The faceplate member (76) includes a shroud portion (102) which surrounds contact assemblies (38) adapted for matingly engaging corresponding contact assemblies in a housing block (70) which is part of connector assembly (68) mounted on the mother board (66). The shroud portion (102) is sized to surround and frictionally engage the housing block (70).

Abstract: A connector assembly (26) for use with a printed circuit board (30) wherein a true coaxial connection is provided. The connector assembly includes a housing block (36) with a plurality of bores (38) aligned with the plated-through apertures (42) of the circuit board. Each of the bores (38) contains a coaxial connector subassembly (50) which provides surface contact with the signal pads (46) and ground pads (48) surrounding the apertures (42).

Abstract: A connector (28) for use with a printed circuit board (26) and adaptable for single or double sided use as a signal launcher or feed-through, respectively. The connector includes an outer sleeve element (58) and a center contact element (46) which has a support portion (54) extending through an aperture (40) in the printed circuit board. The distal end (68) of the contact element (46) is secured by interference fit with a locking ring (72) on the other side of the circuit board.

Abstract: Strip retainer and stripper which is used on a stamping and forming machine for stripping or removing the stock material from the pilot pins and punches when the punches and pilot pins move from their closed positions to their open positions, comprises one or more wires in the operating zone of the machine. Each wire extends transversely across, and intersects, the path of reciprocation of the punch assmebly. The wire does not intersect the path of reciprocation of the pilot pins or the punches and is located between the punches and pilot pins and the surface of the stock material. The ends of the wires extend beyond the path or reciprocation of the punch assembly and are secured by fixed securing devices.

Abstract: A film mounted semiconductor device is applied to a socket therefor by means of a protective carrier from which project four posts arranged in such a way that a line drawn between two opposite posts would pass through the center of the carrier. The film is formed with elongate slots each receiving one of the posts with clearance in the longitudinal direction of the slot but the post closely fitting the slot in its transverse direction. Each post is fitted snugly into a pocket in the socket. The slots allow relative movement between the film and the posts to take up dimensional changes resulting from temperature and humidity changes, but as the posts fit the slots in their transverse direction, the film, the carrier and the socket are maintained concentric.

Abstract: An integrated circuit semiconductor chip carrier system (10) which provides reliable interconnection of one or more semiconductor chips (13) to external circuitry in environments of variable temperature and stress. The system (10) includes a housing (11), one or more semiconductor chips (13) mounted on a substrate (12), and a plurality of electrical terminals (36) which extend through one or more walls (21, 22, 23, 24) of the housing (11). Each terminal (36) having an inner resilient portion (36b) which is adapted to be electrically connected to a contact pad (32) which is in electrical engagement with a semiconductor chip (13) on the substrate (12). The inner resilient portions (36b) being directly connected to the pads (32) in such a manner so that as the substrate (12) expands and contracts according to temperature variations, the inner resilient portions (36b) move accordingly, thereby eliminating harmful stresses which results in "bi-metal effect".

Abstract: The present invention is directed to a multi-pin coax connector assembly having connector housings made of metal or conductive plastic which serves as a reference ground for all signals. The connectors have passages extending therethrough. Pin and socket terminals are insert molded with insulating material and are positioned in the passages. The insulating material spaces the terminals from the conductive connector housing as well as providing air gaps along most of the length of the terminals. The air gaps cooperate with the insulating material to provide controlled impedance. As the signals travel at a high rate of speed along the terminals, the terminals are bent to minimize the reflection of the signal. The connectors are provided with power and ground busses along the outside surfaces thereof, the busses of the first connector making electrical connection with the respective busses of the second connector.

Abstract: A protective carrier (2) has a flexible circuit (6) attached thereto, the protective carrier (2) protecting the circuit (6) during transportation and handling thereof. The flexible circuit (6) is attached to the protective carrier (2) in such a manner as to ensure proper registration and to maintain the center of all components in coincidence as dimensional change occurs due to the different temperature coefficient of expansion of each component. The protective carrier (2) can be used to orient, position, and install an integrated circuit chip carrier (8) and lead frame (4) on an interposer socket (30). As the lead frame (4) has a large number of contact zones positioned thereon, contact force is required between the interposer socker (30) and the lead frame (4).

Abstract: Tooling system for a forming machine has a continuous guide passageway in which first and second tooling assemblies are contained for movement towards and away from each other. The passageway has passageway surfaces which serve as bearing and guiding surfaces for the tooling assemblies. Each of the tooling assemblies has a ram member and a tool holder mounted on the ram member. Additionally, a face plate is provided on one of the tooling assemblies at the leading end thereof and is movable relative to the leading end between a retracted position and an extended position. When in its extended position, it is spaced from the ram so that tools, such as punches have their ends in openings in the face plate. When the tooling assemblies move against strip material positioned therebetween, the punches or similar tools move from the face plate and perform operations on the strip. The face plate then serves as a stripper plate during reverse movement of the ram.

Abstract: A scrap removal system is disclosed for a stamping and forming machine in which strip material is fed in a vertical plane through a tooling assembly having punches and dies therein so that holes are punched in the strip when the punches move through the strip and into the die openings. Such punching operations produce small bits of scrap material commonly referred to as slugs. The die block is mounted against a supporting structure which has passageways extending therethrough in alignment with the die openings so that as the slugs are produced, they are pushed into the passageways and form stacks of aligned slugs. The passageways extend to outlets, past which a slug removing device in the form of an endless belt continuously moves. As the slugs are pushed from the slug outlets, the endless belt carries them laterally and disposes of them at a location beside the tooling assembly. A detecting means is also disclosed which stops the machine in the event of failure of the scrap removal system.

Abstract: Manufacturing method for integrated circuit chip carrier or similar devices comprises the steps of producing the substrate as a discrete part by pressing ceramic powder in a precision mold and sintering the pressed part. The discrete substrates are then placed in a work holder in which a plurality of substrates are precisely located with both surfaces of each substrate exposed. The manufacturing steps of metallizing the substrates, imaging, plating, resist removal, etching, and so on, can then be carried out on all of the substrates in the work holder simultaneously. The processes can be applied to both surfaces of each substrate simultaneously and in addition, further steps such as assembly of an IC chip to each substrate and wire bonding can be carried out while the substrates are in the work holder. The process greatly reduces the cost of manufacturing chip carriers, particularly the type having terminal pads on both surfaces of the substrate and conductors extending between the major surfaces.

Abstract: A chip carrier handler has an opening located therein for receiving a chip carrier of the type having leads extending from midsections of the sides thereof. The height of the chip carrier handler is essentially equal to the height of the chip carrier. Securing members for securing the chip carrier in the handler opening must be made from extremely thin material and mounted on the chip carrier handler in such a manner as to utilize the resilient nature of the securing members without overstressing the members. The configuration of the chip carrier handler is in a form to allow for manual or robotic manipulation.

Abstract: Hermaphroditic electrical connector comprises a dielectric housing having terminals therein with resilient contact tongues and shunt means fixed to a dielectric carrier which moves relative to housing in response to mating with a like connector as tongues engage respective like tongues. The shunt means engage portions of the terminals remote from the contact tongues to electrically connect alternate terminals when the connector is in an unmated conditon, the shunt means being in unmated relation with the terminals when the connector is mated.

Abstract: A protective carrier (2) has a flexible circuit (6) attached thereto, the protective carrier (2) protecting the circuit (6) during transportation and handling thereof. The flexible circuit (6) is attached to the protective carrier (2) in such a manner as to ensure proper registration and to maintain the center of all components in coincidence as dimensional change occurs due to the different temperature coefficient of expansion of each component. The protective carrier (2) can be used to orient, position, and install an integrated circuit chip carrier (8) and lead frame (4) on an interposer socket (30). As the lead frame (4) has a large number of contact zones positioned thereon, contact force is required between the interposer socket (30) and the lead frame (4).

Abstract: The present invention relates to a camming means for a zero insertion force connector or the like. The camming means has cam profiles which extend through an extension of the housing of the connector. The cam profiles are configured to distribute the forces to the extension of the housing, thereby eliminating the forces applied the cam slides which are perpendicular to the longitudinal axis of the cam slides. The positioning of the cam profiles relative to each other ensures that the camming means can be used in connectors in which space is at a premium.

Abstract: The invention is directed to an electrical connector (2) for electrically connecting contact surfaces (74) of a daughter board (18) to contact areas (46) of mother board (34). The connector (2) has contacts (36) positioned therein, the connector (2) having posts (38) which extend from the connector (2) and make electrical engagement with contact areas (46) of the mother board (34). The daughter board (18) is then inserted into the connector (2) under reduced or zero insertion force conditions and rotated to its operating position. As this rotation occurs, contact projections (60, 72) of the contacts (36) engage the contact surfaces (74) of the daughter board (18). The rotation is translated into a positive wiping action between the contact projections (60, 72) and the contact surfaces (74), thereby ensuring that a positive electrical connection is effected. The resilient nature of the contacts (36) ensures that this wiping action occurs under normal force conditions. The configuration and characteristics, i.

Abstract: A workholder for holding a plurality of substrates, the workholder configured in a flat plate having a top surface and a bottom surface which is parallel to the top surface. The top surface spaced a distance from the bottom surface, such that the distance between the top surface and the bottom surface does not exceed a distance between an upper surface and a lower surface of an individual substrate. A plurality of substrate receiving openings extend through the plate, each opening being dimensioned to receive a respective substrate therein. A biasing spring means adjacent to each opening for biasing a substrate in the opening. The biasing spring means being between the top and bottom surfaces of the workholder and not extending beyond the top and bottom surfaces thereof. The configuration of the workholder allows the substrates to be held in the openings of the workholder, while having their upper and lower surfaces projecting beyond the top and bottom surfaces of the workholder respectively.

Abstract: Connector for a substrate such as an IC chip carrier comprises a housing assembly which in turn comprises a housing frame and a plurality of contact modules on the frame. Each module has a group of contact members therein. The contact members are located in predetermined positions in the frame and within predetermined dimensional tolerances. The housing frame and the substrate have substrate locating means for locating the substrate so that contact pads on the substrate will be in registry with the contact positions. Module locating means are also provided for locating the modules in the frame so that the contact members in the modules will be located in the predetermined positions. Each module has its own locating means which is directly related to the substrate locating means. The contact members in each module are thereby located within cumulative dimensional tolerances which are limited to the respective modules and are not cumulative beyond the individual modules.

Abstract: Chip carrier comprising a square chip carrier body as slots extending inwardly from its side surfaces midway between its corners. These slots function as keyways for keys that are contained in the chip carrier socket. The keys are located midway between the corners of the chip carrier receiving recess and each key is in the row of contact terminals which are positioned in the socket body in surrounding relationship to the recess. By virtue of this system of positioning the chip carrier in the chip carrier socket, the effects of differential thermal expansion of the chip carrier relative to the chip carrier socket are minimized.

Abstract: 44A tool and method are described for removing a chip carrier socket housing from terminals which are received in the housing and which are mounted on a substrate. The tool comprises a yoke having pulling arms pivoted thereto which have free ends that engage the housing at the corners thereof. A central axial opening extends through the yoke and a slide is slidable in the opening. The slide has a reaction plate on its end which is shaped to engage the upper free ends of the terminals. A locking cam is provided which locks the pulling arms in their engaged positions with the housing. An actuating means causes the yoke and the pulling arms to move upwardly (relative to the substrate on which the terminals are mounted) with respect to the reaction plate. The housing is thus pulled by the arms upwardly and from the terminals.