Abstract: The ends of shielded coaxial conductors are connected to each other by a housing assembly comprising two or more housing blocks. The housing blocks have mating faces which are opposed to, and against, each other. The conductors are prepared by stripping the insulation and the shielding from the end and stripping the insulation only from an adjacent portion of each conductor. The stripped ends are in overlapping relationship and are pressed against each other by compressed blocks of plastic material. The plastic compresing blocks are held against the conductors by compressing bars which in turn are urged against the compressing blocks by a compressed elastomeric material. The dielectric constant of the plastic compressing blocks and the spacing between the overlapping stripped ends of the conductors and the surfaces of the compressing bars are selected such that the impedance in the zone of the electrical connection is compatible with the impedance of the cables.

Abstract: Chip carrier socket has contact terminals therein comprising a web portion and first and second arms extending from the web. The first arm has a contact portion adjacent its free end for contacting a pad on a chip carrier and the second arm has a bearing portion adjacent to its free end. The intermediate portion of the second arm is not supported against wall surfaces of the chip carrier socket. The web is connected to a mounting portion by a neck which is compliantly responsive to stressing of the arms. When the contact portion engages a contact pad on a chip carrier, the entire system including the first and second arms and the web is stressed. The second arm is flexed and the freely supported end of the second arm is moved along its fixed support surface. The design permits the achievement of a high contact force and is capable of accommodating manufacturing tolerances in the chip carrier while maintaining the required contact force.

Abstract: A method and device for compliantly interconnecting a surface mount device or the like to a circuit board is taught. Briefly stated, an interposer having interconnect areas is placed between the circuit board and the device to be surface mounted with interconnect areas disposed between conductive strips on the circuit board and pads contained on the surface mount device. The interconnect area has disposed therein a plurality of fine wires having flux and solder disposed thereon.

Abstract: Apparatus for feeding a strip of articles and severing the leading article from the strip comprises a cylindrical surface having a helical feeding thread thereon which is dimensioned to enter gaps in the strip of articles being fed. The strip is fed along a strip feed path to an operating zone adjacent to which one end of the cylindrical surface is located. The cylindrical surface has movable shearing blades thereon at the one end which are cooperable with fixed shearing blades to shear the leading article from the strip in the operating zone.

Abstract: A manner of precisely mounting a surface mounting connector to a substrate is taught. Briefly stated, after soldering of the contacts of a connector to the substrate, a radially wound steel roll pin is positioned in the mounting holes of the connector housing and is then urged downwards so as to cut through the substrate. The radial forces of the roll pin are used to retain the roll pin in position in the connector housing and in the substrate, thereby rigidly holding the connector housing to the substrate upon which it is mounted.

Abstract: A LIF or ZIF connector having improved contact wiping is disclosed herein. Briefly stated, a connector having contacts therein is provided with the contacts moving into or out of engagement with traces disposed on a daughter board. At the time of, or immediately after engagement of the contacts of the connector with the traces on the daughter board, a wiping cam causes the daughter board to be moved with respect to the contacts thereby causing a wiping action between the traces and the contacts.

Abstract: Hermaphroditic electrical connector comprises a dielectric housing having terminals therein with resilient contact tongues and shunt means fixed to a dielectric carrier which moves relative to housing in response to mating with a like connector as tongues engage respective like tongues. The shunt means engage portions of the terminals remote from the contact tongues to electrically connect alternate terminals when the connector is in an unmated condition, the shunt means being in unmated relation with the terminals when the connector is mated.

Abstract: Copper lead frame for manufacturing a semiconductor chip carrier has signal leads extending from outer leads about the periphery of the frame and temporarily attached to a ground bus toward the center of the frame by fusible links. Ground leads extend from bus alternately with signal leads and have fusible links at outer leads which are melted to isolate them from signal leads and eliminate noise between signal leads in finished carrier. A power bus located within the ground bus and a chip mounting pad located with the power bus are similarly positioned by fusible links.

Abstract: A modular connector housing of relatively short length and having a coupling feature, such as a tab at one end and a recess at the other end, is connected with other similar connector housings. A filler material having a melting point lower than that of the particular soldering method chosen is then inserted into that portion where two housings are joined thereby forming a relatively rigid long connector housing. A hot-melt adhesive preform is then placed on the bottom of the connector housing with the entire connector housing assembly aligned with and attached to a printed circuit board. The hot-melt adhesive bonds the connector housing to the substrate while the filler material melts away from the filler openings, allowing the short incremental housing lengths to move relatively free with respect to each other.

Abstract: A device for connecting leadless integrated circuit packages to a chip carrier housing or socket and then to a printed circuit board is taught. Briefly stated, a mask is selectively disposed on a printed circuit board. Locating ribs are correspondently disposed on a chip carrier housing so as to cooperatively engage the slots created by the absence of the mask on the printed circuit board. Additionally, barriers for separating contacts contained in the chip carrier housing are maintained at the interior and the exterior portion of the chip carrier housing walls with no material disposed therebetween thereby minimizing capacitive as well as inductive effects which may come about.

Abstract: An electrical contact for use with high density, high frequency electrical signals is taught. Briefly stated, an electrical contact which is generally "U"-shaped having at the end of one leg an outer beam portion perpendicularly attached at the end thereof. A second generally "U"-shaped bent portion is perpendicularly disposed at the end of the other leg in overlapping relationship with the outer beam with the free leg of the second "U"-shaped portion resiliently biased against the lower portion of the outer beam.

Abstract: Machine for performing operations on strip material comprises a plurality of modules on a supporting bed. Each module has a strip feeder, a tooling assembly, and an actuating assembly. Strip is fed through the modules by the feeder and in each module the tooling assembly performs an operation such as stamping, forming, marking, etc. The modules feed the strip in a vertical plane and the modules are symmetrical with respect to the vertical plane of the strip. Preferably the actuating assembly and the tooling assembly is dynamically balanced. Advantages achieved include high speeds, reduced power requirements, reduced noise, and reduced tooling cost.

Abstract: Strip feeding apparatus comprises a feed screw having a feeding thread on its surface. The thread is received in notches in one edge of the strip so that rotation of the screw advances the strip. Guides are provided for guiding the strip along the feed path and maintaining the strip in engagement with the thread. The thread may have a portion of each turn which causes no feeding during each revolution so that strip is fed intermittently. The feeding apparatus may be used under a wide variety of circumstances and is disclosed in conjunction with a stamping and forming or similar machine.

Abstract: Zero insertion force connector for a substrate comprises housing having a surface against which the substrate is positioned. Terminals in the housing engage conductors on the substrate. A clamping bar is located beside the housing and is movable between first and second positions, the bar being relatively remote from the surface when in the second position and proximate to the surface when in the first position so that it clamps the substrate against the surface. The clamping bar is moved between its first and second positions by a force multiplying actuator.

Abstract: A miniature circuit board edge connector having a very short electrical contact path is taught. Briefly stated, an insulative housing has contained therein a resiliently flexible and electrically conductive contact. A camming device is disposed in the housing and impinges upon the contact and through lateral motion of the cam, urges the contact vertically downward so as to cause downward and outward movement of a portion of the contact with respect to the housing which thereby comes in contact with an electrically conductive path on a daughter board which is adjacent thereto. A portion of the contact is in slidable electrical communication with a conductive post which is mounted in the base of the connector assembly and attached to a mother circuit board. The electrical path between the daughter board circuit board and the mother board conductive post through the contact is very short and in a slightly arcuate manner and minimizes inductive, capacitive and propagation delay effects.

Abstract: A connector for connecting leads from an integrated circuit package to a printed circuit board or the like wherein the connection between the circuit board and the semiconductor chip leads are as short as possible. This is accomplished by providing a frame which abuts the chip carrier and leads extending therefrom whereby the leads are formed over a frame and travel in a direct path to pads on the printed circuit board. Spring members are held in the frame by a yoke, there being one spring element for each lead which forces the chip carrier leads against the printed circuit pad directly thereby obtaining the shortest possible path.

Abstract: A ceramic chip carrier having a lead frame thereon with a removable lead frame support which does not bond to the ceramic during the bonding procedure and is later removed. A perforated ground pad is bonded to the substrate simultaneously with the leads of the lead frame and is attached to the lead frame support. The support area is of reduced thickness relative to the rest of the lead frame so that it does not come in contact with the ceramic substrate during the bonding procedure. After firing and bonding of the lead frame to the substrate, the unbonded support rim is removed by pinch cutting, etching or the like.

Abstract: A moisture getter, which is a material capable of absorbing moisture, is painted within the cap of an integrated circuit package prior to sealing. The package is then heated to the high sealing temperature necessary to provide sealing without affecting the getter material. The getter material is formed from a family of materials which is capable of withstanding the high temperature of the sealing process without degradation and which can absorb a large amount of water after exposure to sealing temperatures.

Abstract: Technique for terminating signal leads on a substrate for a semiconductor chip to discrete resistors to eliminate impedance discontinuities involves a substrate having signal leads connected to resistive material which is in turn connected to a ground bus. Laser trimming equipment is used to selectively disconnect signal leads from the resistor zone, or to create separate resistor paths for each signal lead to bus, while trimming the resistor to the required transmission line terminating value. The signal leads are connected to the semiconductor chip by elevated leads which pass over the resistive material and the ground bus.

Abstract: A chip carrier having a plurality of leads thereon for external interconnection with preferably only one of the leads utilized to provide a source of power to the chip and preferably a single lead utilized as a ground connection. The power and ground leads are connected in a bus structure around the chip at the center of the chip carrier with the chip being secured to the chip carrier with the bus structure over a thermal pad formed within the bus structure. A decoupling capacitor is located in close proximity to the chip on the substrate to assure low reaction due to switching.