Abstract: It is disclosed a wireless sensing device comprising a vibration sensor configured to detect a mechanical vibration and to generate an electric signal in response to the mechanical vibration. The device also comprises a transceiver suitable for establishing a wireless connection between the wireless sensing device and a remote device. The transceiver is configured to receive at least a portion of the electric signal from the vibration sensor and, depending on the intensity of electric signal portion, to switch on and transmit a radio signal to the remote device. The radio signal is suitable for triggering a consequent action at the remote device.

Abstract: An apparatus for providing transfer of a heat load between a heat source and a heat receiver includes a female part configured to be fixed to the heat source or the heat receiver and a male part configured to be fixed to the other of the heat source or the heat receiver. The female part includes a female structure. The male part includes a male structure. The male part and the female part are configured to form a heat transfer surface for the heat load therebetween when the male part is placed in the female part. Structures are configured to provide a heat transfer surface that increases with the temperature, so as to increase the heat load transfer between the structures.

Abstract: A heat sink comprising a base, fins attached to the base and a flow diverter in contact with the base or at least one of the fins. The flow diverter has a rectangular cross-sectional profile in a plane that is coplanar with and elevated above a plane of the base and spanning the entire separation distance, and, a segment of the flow diverter is angled towards the base to direct the fluid flow towards the base.

Abstract: A heat sink comprising a base, fins attached to the base and a flow diverter in contact with the base or at least one of the fins. The flow diverter has a rectangular cross-sectional profile in a plane that is coplanar with and elevated above a plane of the base and spanning the entire separation distance, and, a segment of the flow diverter is angled towards the base to direct the fluid flow towards the base.

Abstract: The battery thermal management device includes a thermally conductive structure and a thermoelectric module. The thermally conductive structure is coupleable to a battery and operable to provide a thermal path between the battery and the thermoelectric module. The thermoelectric module is operable to transfer heat between itself and the thermally conductive structure thereby maintaining temperature of the battery within a desired range. Such a device can allow battery temperature management in an industrial deployment without requiring use of a battery enclosure and active cooling mechanisms.

Abstract: A heat sink includes a base and a heat exchange element coupled to the base. The heat exchange element includes a foam structure that is coupled to the base.

Abstract: An apparatus comprising a rack having one or more shelves, a plurality of electronics circuit boards and heat conduits and a cooler. Each board is held by one of the one or more shelves, some of the boards having a localized heat source thereon. Each heat conduit forms a heat conducting path over and adjacent to a particular one of the boards from a region adjacent to the heat source thereon to a connection zone, the zone being remote from the heat source. The cooler is located on a side of the rack and coupled to the zones such that heat is transferable from the paths to the cooler. The cooler is configured to flow a cooling fluid therein to cool localized thermal interfaces at the cooler, each interface being adjacent to and at a corresponding one of the zones.

Abstract: Use of vortex generators to improve efficacy of heat sinks used to cool telecommunications, electrical and electro-optical components.

Abstract: An improved apparatus and system are provided for heat dissipation in a bank of circuit components using heat pipes and/or vapor chambers, wherein the heat pipes and/or vapor chambers efficiently transport heat away from high heat components.

Abstract: Use of vortex generators to improve efficacy of heat sinks used to cool telecommunications, electrical and electro-optical components.

Abstract: An improved apparatus and system are provided for heat dissipation in a bank of circuit components using heat pipes and/or vapor chambers, wherein the heat pipes and/or vapor chambers efficiently transport heat away from high heat components.

Abstract: A heat sink includes a base and a heat exchange element monolithically connected to the base. The heat exchange element has a surface that at least partially bounds first and second paths through the heat exchange element. The surface forms an upper boundary of the first and second paths and includes an opening therethrough connecting the first and second paths.

Abstract: A heat sink includes a base and fins attached to the base. A flow diverter is in contact with the base or at least one of the fins and is configured to disturb a laminar flow region of a fluid flowing adjacent to at least one of the fins or the base.

Abstract: A heat sink includes a surface and a first active element connected to the surface. The first active element is configured to move from a first position relative to the surface to a second position relative to the surface. The movement alters the heat transfer characteristics of the heat sink.