Patents by Inventor Dominick A. DeAngelis

Dominick A. DeAngelis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
    Patent number: 11462506
    Abstract: An ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: October 4, 2022
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventor: Dominick A. DeAngelis
  • ULTRASONIC TRANSDUCER SYSTEMS INCLUDING TUNED RESONATORS, EQUIPMENT INCLUDING SUCH SYSTEMS, AND METHODS OF PROVIDING THE SAME
    Publication number: 20210257330
    Abstract: An ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange.
    Type: Application
    Filed: April 6, 2021
    Publication date: August 19, 2021
    Inventor: Dominick A. DeAngelis
  • Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
    Patent number: 11011492
    Abstract: An ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: May 18, 2021
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventor: Dominick A. DeAngelis
  • Wedge bonding tools, wedge bonding systems, and related methods
    Patent number: 10987753
    Abstract: A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: April 27, 2021
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventor: Dominick A. DeAngelis
  • WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
    Publication number: 20190375043
    Abstract: A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.
    Type: Application
    Filed: August 22, 2019
    Publication date: December 12, 2019
    Inventor: Dominick A. DeAngelis
  • Wedge bonding tools, wedge bonding systems, and related methods
    Patent number: 10449627
    Abstract: A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: October 22, 2019
    Assignee: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventor: Dominick A. DeAngelis
  • ULTRASONIC TRANSDUCER SYSTEMS INCLUDING TUNED RESONATORS, EQUIPMENT INCLUDING SUCH SYSTEMS, AND METHODS OF PROVIDING THE SAME
    Publication number: 20190319005
    Abstract: An ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange.
    Type: Application
    Filed: June 27, 2019
    Publication date: October 17, 2019
    Inventor: Dominick A. DeAngelis
  • Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
    Patent number: 10381321
    Abstract: An ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: August 13, 2019
    Assignee: KULICKE AND SOFFA INDUSTRIES, INC
    Inventor: Dominick A. DeAngelis
  • Systems and methods for bonding semiconductor elements
    Patent number: 10312216
    Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: June 4, 2019
    Assignee: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Robert N. Chylak, Dominick A. DeAngelis
  • Systems and methods for bonding semiconductor elements
    Patent number: 10297568
    Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; (b) ultrasonically forming tack bonds between ones of the first conductive structures and respective ones of the second conductive structures; and (c) forming completed bonds between the first conductive structures and the second conductive structures.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: May 21, 2019
    Assignee: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Robert N. Chylak, Dominick A. DeAngelis, Horst Clauberg
  • ULTRASONIC TRANSDUCER SYSTEMS INCLUDING TUNED RESONATORS, EQUIPMENT INCLUDING SUCH SYSTEMS, AND METHODS OF PROVIDING THE SAME
    Publication number: 20180240774
    Abstract: An ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange.
    Type: Application
    Filed: February 12, 2018
    Publication date: August 23, 2018
    Inventor: Dominick A. DeAngelis
  • WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
    Publication number: 20180200828
    Abstract: A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.
    Type: Application
    Filed: March 16, 2018
    Publication date: July 19, 2018
    Inventor: Dominick A. DeAngelis
  • SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
    Publication number: 20180182733
    Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.
    Type: Application
    Filed: February 26, 2018
    Publication date: June 28, 2018
    Inventors: Robert N. Chylak, Dominick A. DeAngelis
  • Wedge bonding tools, wedge bonding systems, and related methods
    Patent number: 9931709
    Abstract: A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: April 3, 2018
    Assignee: Orthodyne Electronics Corporation
    Inventor: Dominick A. DeAngelis
  • Systems and methods for bonding semiconductor elements
    Patent number: 9905530
    Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: February 27, 2018
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Robert N. Chylak, Dominick A. DeAngelis
  • SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
    Publication number: 20180026006
    Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; (b) ultrasonically forming tack bonds between ones of the first conductive structures and respective ones of the second conductive structures; and (c) forming completed bonds between the first conductive structures and the second conductive structures.
    Type: Application
    Filed: October 2, 2017
    Publication date: January 25, 2018
    Inventors: Robert N. Chylak, Dominick A. DeAngelis, Horst Clauberg
  • Systems and methods for bonding semiconductor elements
    Patent number: 9779965
    Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures. A bonding surface of at least one of the first conductive structures and the second conductive structures includes a frangible coating.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: October 3, 2017
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Robert N. Chylak, Dominick A. DeAngelis, Horst Clauberg
  • Systems and methods for bonding semiconductor elements
    Patent number: 9780065
    Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; (b) ultrasonically forming tack bonds between ones of the first conductive structures and respective ones of the second conductive structures; and (c) forming completed bonds between the first conductive structures and the second conductive structures.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: October 3, 2017
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Robert N. Chylak, Dominick A. DeAngelis, Horst Clauberg
  • WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
    Publication number: 20170209956
    Abstract: A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.
    Type: Application
    Filed: January 18, 2017
    Publication date: July 27, 2017
    Inventor: Dominick A. DeAngelis
  • SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
    Publication number: 20170186627
    Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures. A bonding surface of at least one of the first conductive structures and the second conductive structures includes a frangible coating.
    Type: Application
    Filed: March 13, 2017
    Publication date: June 29, 2017
    Inventors: Robert N. Chylak, Dominick A. DeAngelis, Horst Clauberg