Patents by Inventor Dominique Vicard

Dominique Vicard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10452969
    Abstract: The treatment device (100) is capable of cooperating with an elongate element (1) provided with a plurality of electronic chips (2a, 2b, 2c, 2d) staggered along the length of the elongate element (1). This treatment device (100) has a housing (101) with an input orifice (102) and an output orifice (103) for the elongate element (1), and a treatment cavity (104) arranged between the input orifice (102) and the output orifice (103) and provided with a treatment probe (105) for electronic chip. Furthermore, the treatment device comprises an isolation system (106) configured to isolate an electronic chip to be treated present in the cavity (104) from other electronic chips of the plurality of electronic chips arranged outside of the cavity (104).
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: October 22, 2019
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Loïc Marnat, Laurent Dussopt, Dominique Vicard
  • Publication number: 20180218251
    Abstract: The treatment device (100) is capable of cooperating with an elongate element (1) provided with a plurality of electronic chips (2a, 2b, 2c, 2d) staggered along the length of the elongate element (1). This treatment device (100) has a housing (101) with an input orifice (102) and an output orifice (103) for the elongate element (1), and a treatment cavity (104) arranged between the input orifice (102) and the output orifice (103) and provided with a treatment probe (105) for electronic chip. Furthermore, the treatment device comprises an isolation system (106) configured to isolate an electronic chip to be treated present in the cavity (104) from other electronic chips of the plurality of electronic chips arranged outside of the cavity (104).
    Type: Application
    Filed: July 28, 2016
    Publication date: August 2, 2018
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Loïc Marnat, Laurent Dussopt, Dominique Vicard
  • Patent number: 9888573
    Abstract: The cap (1) is intended to be assembled with at least one chipped element (2), said cap comprising a stack of a plurality of electrically insulating layers (1a) delimiting at least one shoulder (3) forming a part of a first groove (4) for housing a wired element (12). The cap further comprises: at least one electrical bump contact (6) arranged at an assembly surface (7) of the stack intended to be mounted on a face of the chipped element (2); at least one electrical connection terminal (5, 5?) arranged at a wall of the shoulder (3); an electrical link element (8), electrically linking said electrical connection terminal (5) to the electrical bump contact (6).
    Type: Grant
    Filed: September 13, 2013
    Date of Patent: February 6, 2018
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Dominique Vicard, Jean Brun
  • Publication number: 20150318409
    Abstract: The assembly has a central block that includes a first main face, a second main face and side faces. The second main face is opposite to the first main face, and the side faces connect the first main face to the second main face. The assembly also includes a first cover arranged on the first main face. The first main face and a first external surface of the first cover form a first groove for housing a first wire element, and the first groove extends along an entire length of the first main face. The assembly further includes a second cover arranged on the second main face. The second main face and a second external surface of the second cover form a second groove for housing a second wire element, and the second groove extends along an entire length of the second main face.
    Type: Application
    Filed: July 14, 2015
    Publication date: November 5, 2015
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Dominique VICARD, Jean BRUN, Pierre PERICHON
  • Patent number: 9112079
    Abstract: The photovoltaic cell has a block that includes at least one semiconductor substrate in which is formed at least one photovoltaic junction that is connected to a first electrical contact element of a first pole and to a second electrical contact element of a second pole. The cell includes a first transparent cover that is placed on a first surface of the block and defines with the block of the cell a first recess groove of a first electrically conductive wire element.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: August 18, 2015
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Dominique Vicard, Jean Brun, Pierre Perichon
  • Publication number: 20150230336
    Abstract: The cap (1) is intended to be assembled with at least one chipped element (2), said cap comprising a stack of a plurality of electrically insulating layers (1a) delimiting at least one shoulder (3) forming a part of a first groove (4) for housing a wired element (12). The cap further comprises: at least one electrical bump contact (6) arranged at an assembly surface (7) of the stack intended to be mounted on a face of the chipped element (2); at least one electrical connection terminal (5, 5?) arranged at a wall of the shoulder (3); an electrical link element (8), electrically linking said electrical connection terminal (5) to the electrical bump contact (6).
    Type: Application
    Filed: September 13, 2013
    Publication date: August 13, 2015
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Dominique Vicard, Jean Brun
  • Patent number: 9093289
    Abstract: A method for assembling a device on two substantially parallel taut threads. The device includes an electronic chip and two substantially parallel grooves open on opposite sides of the device. The distance separating the grooves corresponds to the distance separating the threads. The device presents a penetrating shape along an axis perpendicular to the plane of the grooves, having a base at the level of the grooves and an apex of smaller size than the distance separating the threads. The method includes the steps consisting in placing the apex of the device between the two threads; in moving the device between the two threads resulting in the threads being separated from one another by the penetrating shape of the device; and in continuing movement of the device until the threads penetrate into the grooves reverting to their initial separation distance.
    Type: Grant
    Filed: February 2, 2011
    Date of Patent: July 28, 2015
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Dominique Vicard, Jean Brun
  • Publication number: 20150035408
    Abstract: A device for recovering energy including a first assembly and a second assembly facing each other, the first assembly including a first conductive element and a first dielectric element carried by the first conductive element, and the second assembly including a second conductive element. The first dielectric element is arranged between the first conductive element and the second conductive element. The device further includes a mechanism ensuring that the first dielectric element comes into contact with the second conductive element. A material of the first dielectric element and the material of the second conductive element have different triboelectric affinities.
    Type: Application
    Filed: March 5, 2013
    Publication date: February 5, 2015
    Inventors: Ghislain Despesse, Sebastien Boisseau, Dominique Vicard
  • Patent number: 8814054
    Abstract: A method for forming a sheathed wire includes the steps of: axially advancing a core through a sheathing zone; wrapping a sheathing fiber around the core in the sheathing zone; and providing, in the sheathing zone, a series of microelectronic chip elements each provided with a wire section, in such a way that the sheathing fiber that wraps around the core also wraps around a chip element and the wire section thereof to form a sheathed wire incorporating spaced-apart chip elements.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: August 26, 2014
    Assignee: Commissariat a l'Energie Atomique et Aux Energies Alternatives
    Inventors: Jean Brun, Laurent Lancon, Dominique Vicard
  • Patent number: 8782880
    Abstract: An apparatus for assembling chip devices on a wire, each chip device comprising two substantially parallel lateral walls, and a groove in one of the lateral walls for receiving said wire. The apparatus includes a pinching device having two opposing surfaces, the distance between the opposing surfaces being substantially constant and substantially equal to the distance between the two lateral walls of a chip device. A wire feeder is adapted to continuously feed the wire in contact with one of the opposing surfaces of the pinching device. A chip device feeder is adapted to drive chip devices, one at a time, between the opposing surfaces, with their grooves turned towards the wire. The pinching device may comprise two cylindrical rollers having rotation axes substantially perpendicular to the wire, the opposing surfaces being formed by respective surfaces of the rollers.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: July 22, 2014
    Assignee: Commissariat a l'Energie Atomique et aux Energies Alternatives
    Inventors: Dominique Vicard, Jean Brun
  • Patent number: 8723312
    Abstract: The assembly comprises at least one microelectronic chip having two parallel main surfaces and lateral surfaces, at least one of the lateral faces comprising a longitudinal groove housing a wire element having an axis parallel to the longitudinal axis of the groove. The groove is delineated by at least two side walls. The wire element is secured to the chip at the level of a clamping area between at least one bump arranged on one of the side walls, and the side wall of the groove opposite said bump. The clamping area has a smaller height than the diameter of the wire element and a free area is arranged laterally to the bump along the longitudinal axis of the groove. The free area has a height, corresponding to the distance separating the two side walls, that is greater than the diameter of the wire element.
    Type: Grant
    Filed: October 21, 2008
    Date of Patent: May 13, 2014
    Assignee: Commissariat a l'Energie Atomique et aux Energies Alternatives
    Inventors: Jean Brun, Dominique Vicard, Sophie Verrun
  • Patent number: 8654540
    Abstract: A first step of the method for assembling a wire element with an electronic chip comprises arranging the wire element in a groove of the chip delineated by a first element and a second element, joined by a link element comprising a plastically deformable material, and a second step then comprises clamping the first and second elements to deform the link element until the wire element is secured in the groove.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: February 18, 2014
    Assignee: Commisariat a l'Energie Atomique et aux Energies Alternatives
    Inventors: Jean Brun, Dominique Vicard
  • Patent number: 8611101
    Abstract: Assembly of at least one microelectronic chip with a wire element, the chip comprising a groove for embedment of the wire element. The wire element is a strand with a longitudinal axis substantially parallel to the axis of the groove, comprising at least two electrically conducting wires covered with insulator. The chip comprises at least one electrically conducting bump in the groove, this bump being in electric contact with a stripped area of a single one of the electrically conducting wires of the strand.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: December 17, 2013
    Assignee: Commissariat a l'Energie Atomique et aux Energies Alternatives
    Inventors: Jean Brun, Sophie Verrun, Dominique Vicard
  • Patent number: 8471773
    Abstract: The invention relates to the fabrication of radiofrequency transmission/reception devices. The invention makes provision for: the making of radiofrequency transmission/reception chips devoid of antennas; the connecting in series of the chips by at least two conducting wire elements whose respective lengths between two neighboring chips are chosen as a function of the transmission/reception frequency, each element contacting electrically at least one terminal of a chip and ensuring an at least temporary function of mechanical holding of the chips chainwise; and the cutting at regular intervals of the serial connection to form, for each chip, two strands of an antenna of the device.
    Type: Grant
    Filed: June 18, 2008
    Date of Patent: June 25, 2013
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Dominique Vicard, Jean Brun, Benoît Lepine
  • Publication number: 20130092742
    Abstract: A method for forming a sheathed wire includes the steps of axially advancing a core through a sheathing zone; wrapping a sheathing fiber around the core in the sheathing zone; and providing, in the sheathing zone, a series of microelectronic chip elements each provided with a wire section, in such a way that the sheathing fiber that wraps around the core also wraps around a chip element and the wire section thereof to form a sheathed wire incorporating spaced-apart chip elements.
    Type: Application
    Filed: June 23, 2011
    Publication date: April 18, 2013
    Applicant: Commissariat A L'Energie Atomique et aux Energies Alternatives
    Inventors: Jean Brun, Laurent Lancon, Dominique Vicard
  • Publication number: 20130077281
    Abstract: The invention relates to a chain including multiple microelectronic chip elements that are connected to a wire. The wire has notches that define preferred breaking points when the wire is subject to tensile stress. If the wire is conductive, the notches can be spread so that the length of the wire between a chip element and a notch is equal to the length of an antenna.
    Type: Application
    Filed: June 23, 2011
    Publication date: March 28, 2013
    Applicant: Commissariat A L'Energie Atomique Et Aux Energies Alternatives
    Inventors: Jean Brun, Francois Frassati, Dominique Vicard
  • Patent number: 8375563
    Abstract: A method for making an assembly of chips equipped with radiofrequency transmission-reception means, including successively: making a plurality of chips, on a substrate, each chip having at least one reception area, connecting the reception areas of the chips of the assembly in series with an electrically insulating flat ribbon having a plurality of metallic patterns electrically insulated from one another, each pattern forming at least a part of a flat antenna electrically connected at the level of at least one connection area of the antenna to a corresponding reception area, and separating the chips at the level of the substrate, the chips being mechanically connected to one another by the ribbon.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: February 19, 2013
    Assignee: Commissariat a l'Energie Atomique et aux Energies Alternatives
    Inventor: Dominique Vicard
  • Publication number: 20130033879
    Abstract: A method for assembling a device on two substantially parallel taut threads. The device includes an electronic chip and two substantially parallel grooves open on opposite sides of the device. The distance separating the grooves corresponds to the distance separating the threads. The device presents a penetrating shape along an axis perpendicular to the plane of the grooves, having a base at the level of the grooves and an apex of smaller size than the distance separating the threads. The method includes the steps consisting in placing the apex of the device between the two threads; in moving the device between the two threads resulting in the threads being separated from one another by the penetrating shape of the device; and in continuing movement of the device until the threads penetrate into the grooves reverting to their initial separation distance.
    Type: Application
    Filed: February 2, 2011
    Publication date: February 7, 2013
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Dominique Vicard, Jean Brun
  • Publication number: 20120298173
    Abstract: The photovoltaic cell has a block that includes at least one semiconductor substrate in which is formed at least one photovoltaic junction that is connected to a first electrical contact element of a first pole and to a second electrical contact element of a second pole. The cell includes a first transparent cover that is placed on a first surface of the block and defines with the block of the cell a first recess groove of a first electrically conductive wire element.
    Type: Application
    Filed: December 18, 2009
    Publication date: November 29, 2012
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Dominique Vicard, Jean Brun, Pierre Perichon
  • Patent number: 8258011
    Abstract: The method relates to production of a set of chips mechanically interconnected by means of a flexible connection. The chips, integrated on a substrate, each comprise a receiving area. The chips of the set are connected in series in the receiving areas by a connecting element. The chips are then released, the connecting element forming a flexible connection.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: September 4, 2012
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Jean Brun, Bruno Mourey, Dominique Vicard