Abstract: Low temperature co-fired ceramic (LTCC) multichip modules are used to provide high density interconnects between electronic elements. A ceramic carrier includes a number of cavities which are sized to receive a variety of submodules. The submodules are constructed to hold a variety of circuit elements, such as circuit dice and provide the conduction paths for establishing interconnections between these chips. These circuit elements are attached on one side of the submodule and electrical contacts are provided on the opposite side. Upon installation into the cavity in the carrier module, the submodule is flipped such that the electrical connections are exposed. Once in the cavity, a layer of flex circuitry is applied over the submodule and the ceramic carrier in order to establish electrical connection between electrical elements in the submodules as well as components external to the ceramic carrier.

Abstract: ABSTRACT OF DISCLOSURE Low temperature co-fired ceramic (LTCC) multichip modules are used to provide high density interconnects between electronic elements. A ceramic carrier includes a number of cavities which are sized to receive a variety of submodules. The submodules are constructed to hold a variety of circuit elements, such as circuit dice and provide the conduction paths for establishing interconnections between these chips. These circuit elements are attached on one side of the submodule and electrical contacts are provided on the opposite side. Upon installation into the cavity in the carrier module, the submodule is flipped such that the electrical connections are exposed. Once in the cavity, a layer of flex circuitry is applied over the submodule and the ceramic carrier in order to establish electrical connection between electrical elements in the submodules as well as components external to the ceramic carrier.