Patents by Inventor Donald J. Svetkoff

Donald J. Svetkoff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8809734
    Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
    Type: Grant
    Filed: July 3, 2012
    Date of Patent: August 19, 2014
    Assignee: Electron Scientific Industries, Inc.
    Inventors: James J. Cordingley, Jonathan S. Ehrmann, David M. Filgas, Shepard D. Johnson, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
  • Publication number: 20130200050
    Abstract: The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.
    Type: Application
    Filed: September 10, 2012
    Publication date: August 8, 2013
    Applicant: GSI GROUP CORPORATION
    Inventors: Jonathan S. Ehrmann, Joseph J. Griffiths, James J. Cordingley, Donald J. Svetkoff, Shepard D. Johnson, Michael Plotkin
  • Publication number: 20120276754
    Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
    Type: Application
    Filed: July 3, 2012
    Publication date: November 1, 2012
    Applicant: GSI GROUP CORPORATION
    Inventors: James J. Cordingley, Jonathan S. Ehrmann, David M. Filgas, Shepard D. Johnson, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
  • Patent number: 8269137
    Abstract: The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.
    Type: Grant
    Filed: September 18, 2008
    Date of Patent: September 18, 2012
    Assignee: GSI Group Corporation
    Inventors: Jonathan S. Ehrmann, Joseph J. Griffiths, James J. Cordingley, Donald J. Svetkoff, Shepard D. Johnson, Michael Plotkin
  • Patent number: 8253066
    Abstract: Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: August 28, 2012
    Assignee: GSI Group Corporation
    Inventors: Bo Gu, Donald V. Smart, James J. Cordingley, Joohan Lee, Donald J. Svetkoff, Shepard D. Johnson, Jonathan S. Ehrmann
  • Patent number: 8217304
    Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
    Type: Grant
    Filed: March 27, 2002
    Date of Patent: July 10, 2012
    Assignee: GSI Group Corporation
    Inventors: James J. Cordingley, Jonathan S. Ehrmann, David M. Filgas, Shepard D. Johnson, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
  • Patent number: 7955906
    Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
    Type: Grant
    Filed: July 1, 2008
    Date of Patent: June 7, 2011
    Assignee: GSI Group Corporation
    Inventors: James J. Cordingley, Jonathan S. Ehrman, David M. Filgas, Shepard D. Johnson, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
  • Patent number: 7955905
    Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: June 7, 2011
    Assignee: GSI Group Corporation
    Inventors: James J. Cordingley, Jonathan S. Ehrmann, David M. Filgas, Shepard D. Johnson, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
  • Publication number: 20110062127
    Abstract: Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.
    Type: Application
    Filed: November 19, 2010
    Publication date: March 17, 2011
    Applicant: GSI GROUP CORPORATION
    Inventors: Bo Gu, Donald V. Smart, James J. Cordingley, Joohan Lee, Donald J. Svetkoff, Shepard D. Johnson, Jonathan S. Ehrmann
  • Patent number: 7838794
    Abstract: Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.
    Type: Grant
    Filed: January 31, 2007
    Date of Patent: November 23, 2010
    Assignee: GSI Group Corporation
    Inventors: Bo Gu, Donald V. Smart, James J. Cordingley, Joohan Lee, Donald J. Svetkoff, Shepard D. Johnson, Jonathan S. Ehrmann
  • Patent number: 7723642
    Abstract: A laser-based method of removing a target link structure of a circuit fabricated on a substrate includes generating a pulsed laser output at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: May 25, 2010
    Assignee: GSI Group Corporation
    Inventors: Bo Gu, Donald V. Smart, James J. Cordingley, Joohan Lee, Donald J. Svetkoff, Shepard D. Johnson, Jonathan S. Ehrmann
  • Publication number: 20090095722
    Abstract: The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.
    Type: Application
    Filed: September 18, 2008
    Publication date: April 16, 2009
    Applicant: GSI GROUP CORPORATION
    Inventors: Jonathan S. Ehrmann, Joseph J. Griffiths, James J. Cordingley, Donald J. Svetkoff, Shepard D. Johnson, Michael Plotkin
  • Patent number: 7469831
    Abstract: A laser-based method and system for processing targeted surface material and article produced thereby are provided. The system processes the targeted surface material within a region of a workpiece while avoiding undesirable changes to adjacent non-targeted material. The system includes a primary laser subsystem including a primary laser source for generating a pulsed laser output including at least one pulse having a wavelength and a pulse width less than 1 ns. A delivery subsystem irradiates the targeted surface material of the workpiece with the pulsed laser output including the at least one pulse to texture the targeted surface material. The pulsed laser output has sufficient total fluence to initiate ablation within at least a portion of the targeted surface material and the pulse width is short enough such that the region and the non-targeted material surrounding the material are substantially free of slag.
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: December 30, 2008
    Assignee: GSI Group Corporation
    Inventors: Bo Gu, Jonathan S. Ehrmann, Donald J. Svetkoff, Steven P. Cahill, Kevin E. Sullivan
  • Publication number: 20080284837
    Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
    Type: Application
    Filed: July 1, 2008
    Publication date: November 20, 2008
    Applicant: GSI Group Corporation
    Inventors: James J. Cordingley, Jonathan S. Ehrmann, David M. Filgas, Shepard D. Johnson, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
  • Patent number: 7394476
    Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
    Type: Grant
    Filed: May 2, 2006
    Date of Patent: July 1, 2008
    Assignee: GSI Group Corporation
    Inventors: James J. Cordingley, Jonathan S. Ehrmann, Joseph J. Griffiths, Shepard D. Johnson, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
  • Patent number: 7382389
    Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
    Type: Grant
    Filed: November 7, 2006
    Date of Patent: June 3, 2008
    Assignee: GSI Lumonics Corporation
    Inventors: James J. Cordingley, Jonathan S. Ehrmann, David M. Filgas, Shepard D. Johnson, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
  • Publication number: 20070215575
    Abstract: A method and system for high-speed, precise, laser-based modification of at least one electrical element made of a target material is provided. The system includes a laser subsystem that generates a pulsed laser output wherein each laser pulse has a pulse energy, a laser wavelength within a range of ablation sensitivity of the target material, and a pulse duration short enough to substantially reduce ablation threshold energy density of the target material. The system further includes a beam positioner that selectively irradiates the at least one electrical element with the one or more laser pulses focused into at least one spot so as to cause the one or more laser pulses to selectively ablate a portion of the target material from the at least one element while avoiding both substantial spurious opto-electric effects and undesirable damage to the non-target material.
    Type: Application
    Filed: February 21, 2007
    Publication date: September 20, 2007
    Inventors: Bo Gu, Donald J. Svetkoff
  • Patent number: 7199882
    Abstract: A system including confocal and triangulation-based scanners or subsystems provides data which is both acquired and processed under the control of a control algorithm to obtain information such as dimensional information about microscopic targets which may be “non-cooperative.” The “non-cooperative” targets are illuminated with a scanning beam of electromagnetic radiation such as laser light incident from a first direction. A confocal detector of the electromagnetic radiation is placed at a first location for receiving reflected radiation which is substantially optically collinear with the incident beam of electromagnetic radiation. The system includes a spatial filter for attenuating background energy. The triangulation-based subsystem also includes a detector of electromagnetic radiation which is placed at a second location which is non-collinear with respect to the incident beam. This detector has a position sensitive axis. Digital data is derived from signals produced by the detectors.
    Type: Grant
    Filed: April 8, 2005
    Date of Patent: April 3, 2007
    Assignee: GSI Group Corporation
    Inventors: Donald J. Svetkoff, Donald B. T. Kilgus, Warren Lin, Jonathan S. Ehrmann
  • Patent number: 7192846
    Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
    Type: Grant
    Filed: May 9, 2005
    Date of Patent: March 20, 2007
    Assignee: GSI Group Corporation
    Inventors: James J. Cordingley, Roger D. Dowd, Jonathan S. Ehrmann, Joseph J. Griffiths, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
  • Patent number: 7181058
    Abstract: A method and system are provided for inspecting electronic components mounted on printed circuit boards utilizing both 3-D and 2-D data associated with the components and the background on which they are mounted on the printed circuit board. Preferably, a 3-D scanner in the form of a solid state dual detector laser images the components and solder paste on the printed circuit board to obtain the 3-D and 2-D data. Then, a high speed image processor processes the 3-D data to find the locations of the leads and the solder paste. Then, the high speed image processor processes the 2-D data together with the locations of the leads and the solder paste to distinguish the leads from the solder paste. The high speed image processor may calculate centroids of feet of the leads, average height of the feet and border violation percentage of the solder paste.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: February 20, 2007
    Assignee: GSI Group, Inc.
    Inventors: John J. Weisgerber, Donald J. Svetkoff, Donald K. Rohrer