Abstract: A heat pipe is provided having an enclosed vapor chamber and a wick disposed within the vapor chamber. The wick comprises a plurality of lands having a thickness and a plurality of vents formed between the lands, wherein each vent includes a layer of wick having a thickness that is less than the thickness of the lands.

Abstract: A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles and one or more vapor vents are defined in the capillary structer. In this way, a network of capillary passageways are formed between the particles and vapor-vents through the capillary structure so as to aid in the transfer of working fluid by capillary action, while the plurality of fillets provide enhanced thermal transfer properties between the plurality of particles so as to greatly improve over all heat transfer efficiency of the device. A method of making the capillary structure according to the invention is also presented.

Abstract: A modular based heat sink which can be easily optimized for a given heat source relies upon both phase change based heat transfer and condenser modules that combine the efficiency of folded fin cooling and the efficiency of the two phase heat transfer.

Abstract: An evaporator includes an enclosure having a fluid inlet manifold and a vapor outlet manifold. At least one blind passageway is arranged within the enclosure so as to open into a portion of the vapor outlet manifold. The interior surface of the enclosure that defines each passageway is covered with a capillary wick. A porous valve is arranged in fluid communication between the fluid inlet manifold and a blind end of the at least one blind passageway.

Abstract: A burn-in testing cooling system includes a heat pipe having a tubular body. A capillary wick is disposed on an evaporator portion of the tubular body, and a base seals off the evaporator portion. The base is sized and shaped so as to be releasably thermally engaged with a semiconductor device during burn-in testing. A working fluid is disposed within the heat pipe in sufficient quantity to at least saturate the wick. A hollow tube is coiled around the exterior surface of the heat pipe such that a first set of interior coils are formed adjacent to the exterior surface. These interior coils are brazed to the exterior surface so as to enhance their thermal interface with the heat pipe. A second set of coils are wrapped around the first set of coils, in overlying relation to them.

Abstract: A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles and one or more vapor vents are defined in the capillary structer. In this way, a network of capillary passageways are formed between the particles and vapor-vents through the capillary structure so as to aid in the transfer of working fluid by capillary action, while the plurality of fillets provide enhanced thermal transfer properties between the plurality of particles so as to greatly improve over all heat transfer efficiency of the device. A method of making the capillary structure according to the invention is also presented.

Abstract: An evaporator includes an enclosure having a fluid inlet manifold and a vapor outlet manifold. At least one blind passageway is arranged within the enclosure so as to open into a portion of the vapor outlet manifold. The interior surface of the enclosure that defines each passageway is covered with a capillary wick. A porous valve is arranged in fluid communication between the fluid inlet manifold and a blind end of the at least one blind passageway.

Abstract: The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.

Abstract: A wick for use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated PCM particles has the advantage of providing an additional heat absorber. This greatly enhances the ability of the heat pipe to absorb excess heat and may help to prevent damage to the heat pipe or heat generating component, such as an electronic device, especially at times of peak thermal loads.

Abstract: The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.

Abstract: A wick for use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated PCM particles has the advantage of providing an additional heat absorber. This greatly enhances the ability of the heat pipe to absorb excess heat and may help to prevent damage to the heat pipe or heat generating component, such as an electronic device, especially at times of peak thermal loads.

Abstract: An improved electronic chip package is disclosed, which may include an electrical insulator, top and bottom metallization layers associated with said insulator, an integrated circuit (IC) device, and a heat pipe placed between the electrical insulator and the IC device, and soldered to the IC device, wherein the wall of the heat pipe may be constructed so that thermal stresses in the IC device are reduced.

Abstract: A heat pipe diode assembly is provided that includes at least two heat pipes and at least two working fluid reservoirs, with one working fluid reservoir arranged in fluid communication with each the heat pipes. A cold finger is arranged in thermal engagement with each of the heat pipes. A device to be cooled is arranged in thermal engagement with a portion of each of the heat pipes. Another embodiment provides a heat pipe diode assembly formed in accordance with the invention includes three heat pipes and six working fluid reservoirs, with two working fluid reservoirs arranged in fluid communication with each of the three heat pipes. Three cold fingers are provided, with one arranged in thermal engagement with each of the three heat pipes. A device to be cooled is arranged in thermal engagement with a portion of each of the three heat pipes. Methods are also provided for operation of a heat pipe diode assembly.

Abstract: The apparatus is an assembly of cooling fins attached to pipes or heat pipes. The fins are formed into a corrugated configuration of troughs and peaks with large sections of the peaks removed to permit air flow along the depths of the troughs as well as along the lengths of the troughs. Holes are also formed into the fins to accept and grip a pipe or heat pipe. The preferred embodiment has holes surrounded by split collars formed into each fin, with the collars aligned to accept and grip the pipe.

Abstract: The apparatus is an assembly of cooling fins attached to pipes or heat pipes. The fins are formed into a corrugated configuration of troughs and peaks with large sections of the peaks removed to permit air flow along the depths of the troughs as well as along the lengths of the troughs. Holes are also formed into the fins to accept and grip a pipe or heat pipe. The preferred embodiment has holes surrounded by split collars formed into each fin, with the collars aligned to accept and grip the pipe.

Abstract: The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.

Abstract: The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.

Abstract: An improved electronic chip package is disclosed, which may include an electrical insulator, top and bottom metallization layers associated with said insulator, an integrated circuit (IC) device, and a heat pipe placed between the electrical insulator and the IC device, and soldered to the IC device, wherein the wall of the heat pipe may be constructed so that thermal stresses in the IC device are reduced.

Abstract: The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.

Abstract: A heater which uses the electrolysis of a liquid to produce heat from electricity and transfers the heat from the electrolyte by means of a heat exchanger. One embodiment includes electrodes of nickel and platinum and an electrolyte of potassium carbonate with a heat exchanger immersed in and transferring heat from the electrolyte.