Abstract: A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In one of the preferred embodiments, a solder deposit previously formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solder joint. The method and construction are useful for attaching a daughter board to motherboard, and for surface mounting a long header with multiple pins to the contact surfaces of a PCB without the need to separately add solder during a second reflow step to make a robust solder joint between the contact surfaces.

Abstract: A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In on of the preferred embodiments, a solder deposit previously formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solder joint. The method and construction are useful for attaching a daughter board to motherboard, and for surface mounting a long header with multiple pins to the contact surfaces of a PCB without the need to separately add solder during a second reflow step to make a robust solder joint between the contact surfaces.

Abstract: A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In a preferred embodiment, a solder deposit previously-formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solderjoint. When one of the contact surfaces is a contact or pin on a first PCB, and the other contact surface is a SMT pad on a second PCB serving, for example, as a memory card, the process of the invention makes for an easy SMT processed attachment of the memory card to the first PCB without the need to add solder during a second reflow step to make a robust solder joint between the contact surfaces.

Abstract: A bi-level connector for making mechanical and electrical contact between a mother printed circuit board and a daughter printed circuit board. The connector comprises lower level contacts with a varied spring rate when a daughter printed circuit board is inserted. The method of manufacturing the connector comprises forming a strip of two types of contacts, upper contacts and lower contacts, on a single carry strip in alternating fashion such that both the upper and lower contacts can be simultaneously inserted into a connector housing in a single insertion process.

Abstract: A bi-level connector for making mechanical and electrical contact between a mother printed circuit board and a daughter printed circuit board. The connector comprises lower level contacts with a varied spring rate when a daughter printed circuit board is inserted. The method of manufacturing the connector comprises forming a strip of two types of contacts, upper contacts and lower contacts, on a single carry strip in alternating fashion such that both the upper and lower contacts can be simultaneously inserted into a connector housing in a single insertion process.

Abstract: Binocular spectacles which include at least one post with means for adjusting the length of the post. The spectacles include means connected to each post for attaching the post to the eyeglasses. A rear hinge hingedly connects each post to the post attaching means so that the post can pivot through a vertical plane with respect to the eyeglasses. Additionally, the binocular spectacles have a spectacle portion with two lenses. The spectacle portion is connected to each post by a front hinge so it can be pivoted through a vertical plane with respect to the posts. The hinges of the binocular spectacles and the adjustable length of the posts allow the spectacles to be compacted into a small volume. Preferably, the lenses of the spectacle portion are easily interchangeable.