Patents by Inventor Donald W. Schulte

Donald W. Schulte has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6549690
    Abstract: A thermally actuated fluidic optical switching circuit that includes a heater substructure having heater resistors and thermally conductive regions associated with the heater resistors and configured to tailor the thermal characteristics of the heater substructure.
    Type: Grant
    Filed: September 14, 2001
    Date of Patent: April 15, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Donald W. Schulte, Adam L Ghozeil
  • Patent number: 6513913
    Abstract: A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: February 4, 2003
    Assignee: Hewlett-Packard Company
    Inventors: Donald W Schulte, Richard Todd Miller, Susanne L Kumpf
  • Publication number: 20030022397
    Abstract: A through-substrate etching process is monitored by providing a sacrificial electrode in proximity to a desired etch window on the substrate. An etch process is performed on the substrate. The etch process is monitored by measuring an electrical property of either the substrate or the sacrificial electrode or both.
    Type: Application
    Filed: July 26, 2001
    Publication date: January 30, 2003
    Inventors: Jeffery S. Hess, Steven D. Leith, Donald W. Schulte, William Edwards, Jeffrey S. Obert, Timothy R. Emery
  • Patent number: 6512284
    Abstract: A semiconductor antifuse device that utilizes a resistive heating element as both a heating source or fuse blowing and as part of the fuse link. The antifuse device may also be utilized as a fuse and the antifuse or fuse embodiment can be programmed and read with the same two electrodes. The antifuse or fuse is well suited for use and efficient fabrication in a printhead apparatus or other circuit arrangements.
    Type: Grant
    Filed: April 27, 1999
    Date of Patent: January 28, 2003
    Assignee: Hewlett-Packard Company
    Inventors: Donald W. Schulte, Galen H. Kawamoto, Deepika Sharma
  • Publication number: 20020185947
    Abstract: A miniature ion pump, and method for fabricating the miniature ion pump, that may be included within a low-pressure microdevice microenclosure. The miniature ion pump comprises two charge plates separated by a constant distance, fabricated by well-known microchip fabrication techniques, to which a voltage potential difference is applied in order to create a perpendicular electric field that ionizes gas molecules. The resulting positively charged ions are adsorbed to charge plates, thus removing gas molecules from the interior of the low-pressure microenclosure and maintaining a low-pressure environment surrounding the enclosed microdevice.
    Type: Application
    Filed: June 11, 2001
    Publication date: December 12, 2002
    Inventors: Donald W. Schulte, Terry E. McMahon, Douglas Jay Edwards
  • Publication number: 20020167566
    Abstract: An inkjet printing device employs an inkjet printhead with a plurality of drop generators to eject drops of ink. Each drop generator includes a planar heater resistor, comprising three segments. Two of the segments are disposed on either side of the third segment and provide a reduced thermal loss for the third segment. This reduced thermal loss and other features cause a controlled nucleation point to occur over the third segment even though the two segments on either side will create ink vapor bubbles of variable size depending upon the applied energy.
    Type: Application
    Filed: March 4, 2002
    Publication date: November 14, 2002
    Inventor: Donald W. Schulte
  • Publication number: 20020158946
    Abstract: A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.
    Type: Application
    Filed: June 28, 2001
    Publication date: October 31, 2002
    Inventors: Donald W. Schulte, Richard Todd Miller, Susanne L. Kumpf
  • Publication number: 20020135642
    Abstract: A firing chamber configuration for the drop ejectors of inkjet printheads extends the life of the heat transducer by ensuring that bubble collapse (and attendant cavitation) occurs at a location well spaced from the heat transducer. The sidewalls of the firing chamber are shaped relative to the firing chamber entry in a manner such that a strong jet of inflow ink is provided for moving the collapsing vapor bubble from the center of the chamber and against a curved back wall of the firing chamber. In one preferred embodiment, the refill ink impinges on the back wall, divides, and is redirected away from the back wall toward pockets defined in chamber. The pockets are remote from the heat transducer. As a result, the refill ink urges the collapsing (bifurcated) bubble into the pockets where final collapse occurs away from the heat transducer.
    Type: Application
    Filed: March 13, 2001
    Publication date: September 26, 2002
    Inventors: Ronald W. Keil, Donald W. Schulte
  • Patent number: 6448100
    Abstract: An efficient and economical method for fabricating field emitter tips within a layered substrate. The layered substrate is patterned using standard photolithographic techniques and etched to form a rectangular or cylindrical column on top of the substrate composed of conductive and non-conductive layers. The layered substrate is then exposed to an anisotropic etching medium which removes the column to produce a well through the conductive and non-conductive layers and which produces a conical or pyramid-shaped field emitter tip within the silicon substrate directly below the well. Finally, a pull-back etch is used to remove dielectric material from the walls of the well. In an optional step, a thin metal coating may be sputtered onto the surface of the silicon-based field emitter tip.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: September 10, 2002
    Assignee: Hewlett-Packard Compnay
    Inventors: Donald W. Schulte, Terry E. McMahon
  • Patent number: 6447104
    Abstract: A firing chamber configuration for the drop ejectors of inkjet printheads extends the life of the heat transducer by ensuring that bubble collapse (and attendant cavitation) occurs at a location well spaced from the heat transducer. The sidewalls of the firing chamber are shaped relative to the firing chamber entry in a manner such that a strong jet of inflow ink is provided for moving the collapsing vapor bubble from the center of the chamber and against a curved back wall of the firing chamber. In one preferred embodiment, the refill ink impinges on the back wall, divides, and is redirected away from the back wall toward pockets defined in chamber. The pockets are remote from the heat transducer. As a result, the refill ink urges the collapsing (bifurcated) bubble into the pockets where final collapse occurs away from the heat transducer.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: September 10, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Ronald W. Keil, Donald W Schulte
  • Patent number: 6402283
    Abstract: An inkjet printing device employs an inkjet printhead with a plurality of drop generators to eject drops of ink. Each drop generator includes a planar heater resistor, comprising three segments. Two of the segments are disposed on either side of the third segment and provide a reduced thermal loss for the third segment. This reduced thermal loss and other features cause a controlled nucleation point to occur over the third segment even though the two segments on either side will create ink vapor bubbles of variable size depending upon the applied energy.
    Type: Grant
    Filed: May 14, 2001
    Date of Patent: June 11, 2002
    Assignee: Hewlett-Packard Company
    Inventor: Donald W. Schulte
  • Publication number: 20020060350
    Abstract: A semiconductor antifuse device that utilizes a resistive heating element as both a heating source or fuse blowing and as part of the fuse link. The antifuse device may also be utilized as a fuse and the antifuse or fuse embodiment can be programmed and read with the same two electrodes. The antifuse or fuse is well suited for use and efficient fabrication in a printhead apparatus or other circuit arrangements.
    Type: Application
    Filed: April 27, 1999
    Publication date: May 23, 2002
    Inventors: DONALD W. SCHULTE, GALEN H. KAWAMOTO, DEEPIKA SHARMA
  • Patent number: 6361150
    Abstract: This present invention is embodied in a system and a method for protecting an electrically-inactive component of a microsystem from an ESD event. The invention includes embodiments that protect the microsystem from ESD events that directly strike an electrically-inactive component and that are external to the electrically-inactive component. The present invention includes an ESD dissipation device having a connected chain of electrically-inactive components that are electrically floating. Alternatively, the electrically-inactive components can be held at the same potential as an electrical component. Further, a sacrificial ESD breakdown device is included that provides a preferential ESD breakdown site away from the protected component. Also, capacitively coupled thin-film layers can provide shielding to electrically-inactive components.
    Type: Grant
    Filed: August 30, 1999
    Date of Patent: March 26, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Donald W. Schulte, Matthew Giere, Tyler Sims, Noah C. Lassar, Mary Kent
  • Publication number: 20020015550
    Abstract: A thermally actuated fluidic optical switching circuit that includes a heater substructure having heater resistors and thermally conductive regions associated with the heater resistors and configured to tailor the thermal characteristics of the heater substructure.
    Type: Application
    Filed: September 14, 2001
    Publication date: February 7, 2002
    Inventors: Donald W. Schulte, Adam L. Ghozeil
  • Patent number: 6314216
    Abstract: A thermally actuated fluidic optical switching circuit that includes a heater substructure having heater resistors and thermally conductive regions associated with the heater resistors and configured to tailor the thermal characteristics of the heater substructure.
    Type: Grant
    Filed: January 28, 2000
    Date of Patent: November 6, 2001
    Assignee: Hewlett-Packard Company
    Inventors: Donald W. Schulte, Adam L Ghozeil
  • Publication number: 20010020967
    Abstract: An inkjet printing device employs an inkjet printhead with a plurality of drop generators to eject drops of ink. Each drop generator includes a planar heater resistor, comprising three segments. Two of the segments are disposed on either side of the third segment and provide a reduced thermal loss for the third segment. This reduced thermal loss and other features cause a controlled nucleation point to occur over the third segment even though the two segments on either side will create ink vapor bubbles of variable size depending upon the applied energy.
    Type: Application
    Filed: May 14, 2001
    Publication date: September 13, 2001
    Inventor: Donald W. Schulte
  • Patent number: 6276775
    Abstract: An inkjet printing device employs an inkjet printhead with a plurality of drop generators to eject drops of ink. Each drop generator includes a planar heater resistor, comprising three segments. Two of the segments are disposed on either side of the third segment and provide a reduced thermal loss for the third segment. This reduced thermal loss and other features cause a controlled nucleation point to occur over the third segment even though the two segments on either side will create ink vapor bubbles of variable size depending upon the applied energy.
    Type: Grant
    Filed: April 29, 1999
    Date of Patent: August 21, 2001
    Assignee: Hewlett-Packard Company
    Inventor: Donald W. Schulte