Abstract: A point etching module using an annular surface-discharge plasma apparatus is disclosed. The point etching module using an annular surface-discharge plasma apparatus comprises: a plate-shaped dielectric; a circular electrode disposed on and in contact with the upper surface of the dielectric; an annular electrode disposed on and in contact with the lower surface of the dielectric and providing a gas receiving space for receiving gas; and a power supplier for applying high voltage between the circular electrode and the annular electrode, wherein when the application of the high voltage starts an electric discharge, filament type plasma is irradiated toward a substrate to be treated, by using plasma flowing in the center direction of the annular electrode from between the inner surface of the annular electrode and the lower surface of the dielectric.

Abstract: The present invention relates to a method of improving aqueous dispersibility of conductive carbon powders, and to a method of preparing a colloid solution of conductive carbon powders. The present invention comprises a step of exposing conductive carbon powders to a plasma jet or reacting same with a plasma-treated reaction gas, wherein the step is characterized by reacting the plasma-treated reaction gas (ionized gas) with the conductive carbon powders, and accordingly by using plasma, the aqueous dispersibility of the conductive carbon powders may be improved in a convenient manner.

Abstract: Disclosed is a plasma surface treatment apparatus for conductive powder. The plasma surface treatment apparatus for conductive powder comprises: a reaction chamber including a linear gas inlet at the lower end thereof and a gas outlet at the upper end thereof, and having a vertical cross section that is funnel-shaped; and a plasma jet generation device that is located below the linear gas inlet and is configured to discharge a plasma jet into the reaction chamber from below in an upward direction through the linear gas inlet, wherein powder is accommodated in the reaction chamber and is treated by plasma while buoyed by the plasma jet.

Abstract: Disclosed in the present invention are a method for water-repellent coating treatment of a boron nitride powders and water-repellent treated boron nitride, the method comprising producing a water-repellent coating layer on the surface of the boron nitride powders by plasma treatment using a silicon-containing organic compound containing silicone, wherein the water-repellent coating layer remains on the boron nitride through chemical binding with the boron nitride even after ultrasonic water washing.

Abstract: An atomic layer polishing method is described. The method includes: scanning the surface of a specimen to measure a peak site on the specimen surface; spraying toward the measured peak site a gas containing an element capable of binding to a first atom, which is an ingredient of the material of the specimen to form a first reaction gas layer in which the first reaction gas binds to the first atom on the surface of the peak; and projecting ions of inert gas to the peak site on which the first reaction gas layer is deposited to separate the first atom bound to the first reaction gas from the specimen.

Abstract: A point etching module using an annular surface-discharge plasma apparatus is disclosed. The point etching module using an annular surface-discharge plasma apparatus comprises: a plate-shaped dielectric; a circular electrode disposed on and in contact with the upper surface of the dielectric; an annular electrode disposed on and in contact with the lower surface of the dielectric and providing a gas receiving space for receiving gas; and a power supplier for applying high voltage between the circular electrode and the annular electrode, wherein when the application of the high voltage starts an electric discharge, filament type plasma is irradiated toward a substrate to be treated, by using plasma flowing in the center direction of the annular electrode from between the inner surface of the annular electrode and the lower surface of the dielectric.

Abstract: An atomic layer polishing method is described. The method includes: scanning the surface of a specimen to measure a peak site on the specimen surface; spraying toward the measured peak site a gas containing an element capable of binding to a first atom, which is an ingredient of the material of the specimen to form a first reaction gas layer in which the first reaction gas binds to the first atom on the surface of the peak; and projecting ions of inert gas to the peak site on which the first reaction gas layer is deposited to separate the first atom bound to the first reaction gas from the specimen.

Abstract: A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus is a powder plasma processing apparatus of a circular surface discharge plasma module, and the apparatus includes a plate-like electrode layer serving as an external surface of the circular surface discharge plasma module, an insulating layer disposed on an internal surface of the plate-like electrode layer, and a plasma generating electrode disposed on the insulating layer, wherein the circular surface discharge plasma module rotates, an alternating voltage is applied to the plasma generating electrode and the plate-like electrode layer to generate plasma around the plasma generating electrode, and a powder for plasma processing is processed by the plasma within the circular surface discharge plasma module.

Abstract: A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus includes: a chamber configured to perform plasma processing on a powder; a powder supply unit disposed in an upper portion of the chamber; and a plurality of plate-like surface discharge plasma modules disposed below the powder supply unit and positioned within the chamber, wherein surfaces of the surface discharge plasma modules are spaced apart from each other. According to the powder plasma processing apparatus, the powder can be uniformly processed, and the time that the powder spends in contact with the plasma can be controlled, thereby allowing efficient powder processing to be performed.

Abstract: A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus includes: a chamber configured to perform plasma processing on a powder; a powder supply unit disposed in an upper portion of the chamber; and a plurality of plate-like surface discharge plasma modules disposed below the powder supply unit and positioned within the chamber, wherein surfaces of the surface discharge plasma modules are spaced apart from each other. According to the powder plasma processing apparatus, the powder can be uniformly processed, and the time that the powder spends in contact with the plasma can be controlled, thereby allowing efficient powder processing to be performed.

Abstract: A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus is a powder plasma processing apparatus of a circular surface discharge plasma module, and the apparatus includes a plate-like electrode layer serving as an external surface of the circular surface discharge plasma module, an insulating layer disposed on an internal surface of the plate-like electrode layer, and a plasma generating electrode disposed on the insulating layer, wherein the circular surface discharge plasma module rotates, an alternating voltage is applied to the plasma generating electrode and the plate-like electrode layer to generate plasma around the plasma generating electrode, and a powder for plasma processing is processed by the plasma within the circular surface discharge plasma module.

Abstract: The present invention relates to an apparatus for sterilization which may be applied to a medical dry sterilizer, and more particularly, to an apparatus which injects hydrogen peroxide so as to generate plasma and OH radicals which are effective in sterilization, so as to achieve the sterilization of a treated object. According to the present invention, the apparatus for sterilization comprises: a sterilizing reactor in which sterilization is performed on a treated object; a vacuuming unit which is equipped with a vacuum pump connected to the sterilizing reactor and which vacuumizes the interior of the sterilizing reactor; a hydrogen-peroxide supply unit which supplies hydrogen peroxide in a gas state to the interior of the sterilizing reactor; and a microwave-plasma generating unit which generates plasma using microwaves.

Abstract: A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus is a powder plasma processing apparatus of a circular surface discharge plasma module, and the apparatus includes a plate-like electrode layer serving as an external surface of the circular surface discharge plasma module, an insulating layer disposed on an internal surface of the plate-like electrode layer, and a plasma generating electrode disposed on the insulating layer, wherein the circular surface discharge plasma module rotates, an alternating voltage is applied to the plasma generating electrode and the plate-like electrode layer to generate plasma around the plasma generating electrode, and a powder for plasma processing is processed by the plasma within the circular surface discharge plasma module.

Abstract: A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus includes: a chamber configured to perform plasma processing on a powder; a powder supply unit disposed in an upper portion of the chamber; and a plurality of plate-like surface discharge plasma modules disposed below the powder supply unit and positioned within the chamber, wherein surfaces of the surface discharge plasma modules are spaced apart from each other. According to the powder plasma processing apparatus, the powder can be uniformly processed, and the time that the powder spends in contact with the plasma can be controlled, thereby allowing efficient powder processing to be performed.

Abstract: A liquid medium plasma discharge generating apparatus includes a main body; a power electrode, provided at one side within the main body, for receiving electric power; a diaphragm member provided within the main body, and consisting of a dielectric defining one or more holes or slits; and a liquid medium charged inside the main body, wherein a ground electrode may be further provided in the main body, opposite the power electrode with the diaphragm member therebetween, whereupon the diaphragm member is arranged contacting the ground electrode.

Abstract: The present invention relates to an apparatus for sterilization which may be applied to a medical dry sterilizer, and more particularly, to an apparatus which injects hydrogen peroxide so as to generate plasma and OH radicals which are effective in sterilization, so as to achieve the sterilization of a treated object. According to the present invention, the apparatus for sterilization comprises: a sterilizing reactor in which sterilization is performed on a treated object; a vacuuming unit which is equipped with a vacuum pump connected to the sterilizing reactor and which vacuumizes the interior of the sterilizing reactor; a hydrogen-peroxide supply unit which supplies hydrogen peroxide in a gas state to the interior of the sterilizing reactor; and a microwave-plasma generating unit which generates plasma using microwaves.

Abstract: A liquid medium plasma discharge generating apparatus includes a main body; a power electrode, provided at one side within the main body, for receiving electric power; a diaphragm member provided within the main body, and consisting of a dielectric defining one or more holes or slits; and a liquid medium charged inside the main body, wherein a ground electrode may be further provided in the main body, opposite the power electrode with the diaphragm member therebetween, whereupon the diaphragm member is arranged contacting the ground electrode.