Patents by Inventor Dong Gun Lee

Dong Gun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10438994
    Abstract: A method of fabricating a light emitting device package including forming a cell array that includes semiconductor light-emitters including first and second conductivity-type semiconductor layers and an active layer on a substrate, and a separation region, the cell array having a first surface contacting the substrate; exposing the first surface of the separation region by removing the substrate; forming a seed layer on the first surface in the separation region; forming a photoresist pattern on the light-emitters such that the photoresist pattern exposes the seed layer; forming a partition structure that separates the light-emitters by plating a region exposed by the photoresist pattern; forming light emitting windows of the partition structure by removing the photoresist pattern such that the light-emitters are exposed at lower ends of the light emitting windows; and forming wavelength converters by filling the light emitting windows with a wavelength conversion material.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: October 8, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Hye Yeon, Sung Hyun Sim, Ha Nul Yoo, Dong Gun Lee
  • Publication number: 20190270670
    Abstract: Methods for coating a glass-based article, for example a cover glass, with a coating layer that is not deposited on the perimeter edge of the glass-based article. The methods may include disposing a mask having an eave over a glass-based article to protect perimeter portions of the glass-based article from coating of the coating layer during a deposition process. The eave may be dimensioned to form a coating layer having non-uniform coating thickness region around the edge of the coating layer that is not visible to the naked eye on the surface of a glass-based article. The methods may be used to make a glass-based article with non-edge-to-edge coating layers.
    Type: Application
    Filed: October 31, 2017
    Publication date: September 5, 2019
    Inventors: Jae-chang Lee, Dong-gun Moon
  • Publication number: 20190235387
    Abstract: A system includes a plate configured for mounting of a reflective extreme ultra-violet (EUV) mask thereon and a zone plate configured to divide EUV light into zero-order light and first-order light and to pass the zero-order light and the first-order light to the reflective EUV mask. The system further includes a detector configured to receive EUV light reflected by the EUV mask and including a zero-order light detection region configured to generate a first image signal and a first-order light detection region configured to generate a second image signal, and a calculator configured to generate a compensated third image signal from the first image signal and the second image signal. The third image signal may be used to determine a distance between mask patterns of the EUV mask.
    Type: Application
    Filed: August 28, 2018
    Publication date: August 1, 2019
    Inventors: Ji Hoon Na, Dong Gun Lee, Hee Bom Kim
  • Patent number: 10347918
    Abstract: A surface-treated cathode active material useful for manufacturing a lithium secondary battery have excellent output characteristics by performing a double coating with metal oxide and an electron and ion conductive polymerized copolymer on a surface of a cathode active material for a lithium secondary battery to enhance electrochemical properties and thermal stability of the cathode active material.
    Type: Grant
    Filed: November 7, 2014
    Date of Patent: July 9, 2019
    Assignees: HYUNDAI MOTOR COMPANY, IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIV.)
    Inventors: Kyo Min Shin, Sa Heum Kim, Dong Gun Kim, Yun Chae Jung, Dong Won Kim, Ik Su Kang, Yoon Sung Lee
  • Publication number: 20190189853
    Abstract: A light emitting device package comprises a light emitting cell array including a first light emitting cell, a second light emitting cell, and a third light emitting cell, and including a first surface, and a second surface, disposed to oppose the first surface; a plurality of metal pillars disposed on the first surface of the light emitting cell array and electrically connected to the first light emitting cell, the second light emitting cell, and the third light emitting cell; and a molding portion encapsulating the light emitting cell array and the plurality of metal pillars, wherein the plurality of metal pillars include a conductive layer and a bonding layer disposed below the conductive layer, and an interface between the bonding layer and the conductive layer is higher than a lower surface of the molding portion.
    Type: Application
    Filed: June 19, 2018
    Publication date: June 20, 2019
    Inventors: Hanul YOO, Sung Hyun SIM, Ji Hye YEON, Yong Il KIM, Dong Gun LEE
  • Publication number: 20190189595
    Abstract: A light emitting device package includes a first wavelength conversion portion and a second wavelength conversion portion to provide a wavelength of incident light to provide light having a converted wavelength, a light-transmissive partition structure extending along side surfaces of the first and second wavelength conversion portions along a thickness direction to separate the first and second wavelength conversion portions part from each other along a direction crossing the thickness direction, and a cell array including a first light emitting device, a second light emitting device and a third light emitting device, overlapping the first wavelength conversion portion, the second wavelength conversion portion and the light-transmissive partition structure, respectively, along the thickness direction.
    Type: Application
    Filed: June 14, 2018
    Publication date: June 20, 2019
    Inventors: Dong Gun LEE, Yong Il KIM, Hye Seok NOH, Han Kyu SEONG, Sung Hyun SIM, Ha Nul YOO
  • Publication number: 20190189844
    Abstract: A semiconductor light emitting device includes a first light emitting portion including a first semiconductor stack, as well as a first lower dispersion Bragg reflector (DBR) layer and a first upper dispersion Bragg reflector (DBR) layer, disposed above and below the first semiconductor stack, a second light emitting portion including a second semiconductor stack, as well as a second lower dispersion Bragg reflector (DBR) layer and a second upper dispersion Bragg reflector (DBR) layer, disposed above and below the second semiconductor stack, a third light emitting portion including a third semiconductor stack, as well as a third lower dispersion Bragg reflector (DBR) layer and a third upper dispersion Bragg reflector (DBR) layer, disposed above and below the third semiconductor stack, a first bonding layer disposed between the first light emitting portion and the second light emitting portion, and a second bonding layer disposed between the second light emitting portion and the third light emitting portion.
    Type: Application
    Filed: June 19, 2018
    Publication date: June 20, 2019
    Inventors: Dong Gun LEE, Yong Il KIM, Jin Sub LEE
  • Publication number: 20190189876
    Abstract: A light emitting device package including a cell array including first, second and third light emitting devices each including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, the cell array having a first surface and a second surface opposing the first surface, a light-transmissive substrate including a first wavelength conversion portion and a second wavelength conversion portion corresponding to the first light emitting device and the second light emitting device, respectively, and bonded to the first surface, and a eutectic bonding layer including a first light emitting window, a second light emitting window and a third light emitting window corresponding to the first light emitting device, the second light emitting device and the third light emitting device, respectively, and bonding the light-transmissive substrate and the first to third light emitting devices to each other may be provided.
    Type: Application
    Filed: June 1, 2018
    Publication date: June 20, 2019
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dong Gun LEE, Yong II Kim, Han Kyu Seong, Ji Hye Yeon, Jin Sub Lee, Young Jin Choi
  • Publication number: 20190181181
    Abstract: A method of fabricating a light emitting device package including forming a cell array that includes semiconductor light-emitters including first and second conductivity-type semiconductor layers and an active layer on a substrate, and a separation region, the cell array having a first surface contacting the substrate; exposing the first surface of the separation region by removing the substrate; forming a seed layer on the first surface in the separation region; forming a photoresist pattern on the light-emitters such that the photoresist pattern exposes the seed layer; forming a partition structure that separates the light-emitters by plating a region exposed by the photoresist pattern; forming light emitting windows of the partition structure by removing the photoresist pattern such that the light-emitters are exposed at lower ends of the light emitting windows; and forming wavelength converters by filling the light emitting windows with a wavelength conversion material.
    Type: Application
    Filed: May 30, 2018
    Publication date: June 13, 2019
    Inventors: Ji Hye YEON, Sung Hyun SIM, Ha Nul YOO, Dong Gun LEE
  • Publication number: 20190181316
    Abstract: A method of manufacturing a light emitting device includes forming light emitting devices on a support portion, each of the light emitting devices including first to third light emitting cells respectively emitting light of different colors; supplying test power to at least a portion of the light emitting devices using a multi-probe; acquiring an image from the light emitted from the portion of the light emitting devices to which the test power is supplied using an image sensor; identifying normal light emitting devices of the portion of the light emitting devices by determining whether a defect is present in each of the light emitting devices of the portion of the light emitting devices by comparing the image acquired by the image sensor with a reference image; and based on the identifying step, measuring optical characteristics of each of the light emitting devices identified as normal of the portion of the light emitting devices.
    Type: Application
    Filed: June 27, 2018
    Publication date: June 13, 2019
    Inventors: Hye Seok NOH, Young Jin CHOI, Yong Il KIM, Han Kyu SEONG, Dong Gun LEE, Jin Sub LEE
  • Publication number: 20190157487
    Abstract: The resent invention relates to a method for manufacturing a solar cell, the method comprising the steps of: (a) forming a lower electrode layer on a substrate; (b) forming a CIGS light absorbing layer on the lower electrode layer by supplying a copper precursor to deposit a copper thin film using chemical vapor deposition and then supplying a gallium precursor, an indium precursor, and a first selenium precursor to deposit a gallium thin film and an indium-selenium thin film using chemical vapor deposition; and (c) sequentially forming a buffer layer and a front electrode layer on the CIGS light absorbing layer.
    Type: Application
    Filed: January 13, 2016
    Publication date: May 23, 2019
    Applicant: MECARO CO.,LTD.
    Inventors: Hyuk Kyoo JANG, Dong Soo SEOK, Gyu Hyun LEE, Ho Gun LEE
  • Patent number: 10295874
    Abstract: A display device may include a switching device, a gate line, a data line, a pixel electrode, and an auxiliary line. The switching device includes a first electrode, a second electrode, and a third electrode. The gate line is electrically connected to the first electrode. The data line crosses the gate line in a plan view of the display device and is electrically connected to the second electrode. The pixel electrode is electrically connected to the third electrode. The auxiliary line is electrically connected through the first gate line to the first electrode and crosses the gate line in the plan view of the display device.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: May 21, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Dong Gun Oh, Sung Hoon Lim, Do Hyun Jung, Jean Ho Song, Hyeon Jun Lee
  • Publication number: 20190146355
    Abstract: Various examples of a technique for performing optical proximity correction and for forming a photomask are provided herein. In some examples, a layout is received that includes a shape to be formed on a photomask. A plurality of target lithographic contours are determined for the shape that includes a first target contour for a first set of process conditions and a second target contour that is different from the first target contour for a second set of process conditions. A lithographic simulation of the layout is performed to produce a first simulated contour at the first set of process conditions and a second simulated contour at the second set of process conditions. A modification to the layout is determined based on edge placement errors between the first simulated contour and the first target contour and between the second simulated contour and the second target contour.
    Type: Application
    Filed: August 7, 2018
    Publication date: May 16, 2019
    Inventors: Dong-Yo Jheng, Ken-Hsien Hsieh, Shih-Ming Chang, Chih-Jie Lee, Shuo-Yen Chou, Ru-Gun Liu
  • Publication number: 20180374738
    Abstract: A chip mounting method includes providing a first substrate including a light transmissive substrate having first and second surfaces, a sacrificial layer provided on the first surface, and a plurality of chips bonded to the sacrificial layer, obtaining first mapping data by testing the chips, the first mapping data defining coordinates of normal chips and defective chips among the chips, disposing a second substrate below the first surface, disposing the normal chips on the second substrate by radiating a first laser beam to positions of the sacrificial layer corresponding to the coordinates of the normal chips, based on the first mapping data, to remove portions of the sacrificial layer thereby separating the normal chips from the light transmissive substrate, and mounting the normal chips on the second substrate by radiating a second laser beam to a solder layer of the second substrate.
    Type: Application
    Filed: January 12, 2018
    Publication date: December 27, 2018
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Sub LEE, Han Kyu SEONG, Yong II KIM, Sung Hyun SIM, Dong gun LEE
  • Publication number: 20180258713
    Abstract: A drilling apparatus is provided. The drilling apparatus according to one aspect of the present invention comprises: first and second moving modules; first to third drawworks for vertically moving the first and second moving modules; a wire for successively connecting the first drawwork, the first moving module, the second drawwork, the second moving module and the third drawwork; a first fixing drum positioned between the first drawwork and the first moving module so as to support the wire; and a second fixing drum positioned between the second moving module and the third drawwork so as to support the wire.
    Type: Application
    Filed: August 31, 2016
    Publication date: September 13, 2018
    Inventors: Young Youl HA, Dong Gun LEE, Hyun Goo KIM, Sung June BAE
  • Patent number: 10048601
    Abstract: An apparatus for measuring a mask error and a method for measuring a mask error are provided. The apparatus for measuring a mask error includes a stage configured to accommodate a reference mask having a reference pattern, and a target mask adjacent to the reference mask such that a mask pattern of the target mask faces the reference pattern, a light source configured to irradiate the first beam onto the reference mask and the target mask, a light receiving unit including an image sensor, and the image sensor configured to receive a composite image including a first image generated from the reference pattern and a second image generated from the mask pattern, and generate a third image from the first image and the second image, and a measuring unit configured to measure an error of the mask pattern from the third image.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: August 14, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hak-Seung Han, Dong-Gun Lee, Dong-Hoon Chung
  • Publication number: 20180182931
    Abstract: A light emitting device package includes a light emitting structure including a first light emitting cell, a second light emitting cell, and a third light emitting cell, each of the first to third light emitting cells including an active layer to emit light of a first wavelength in a first direction and being separated from each other in a second direction, orthogonal to the first direction, a first light adjusting portion including a first wavelength conversion layer in a first recess portion of the first light emitting cell, the first wavelength conversion layer to convert light of the first wavelength to light of a second wavelength, and a second light adjusting portion including a second wavelength conversion layer in a second recess portion of the second light emitting cell, the second wavelength conversion layer to convert light of the first wavelength to light of a third wavelength.
    Type: Application
    Filed: August 23, 2017
    Publication date: June 28, 2018
    Inventors: Dong Gun LEE, Yong Il KIM, Young Soo PARK, Jin Sub LEE, Wan Tae LIM
  • Publication number: 20180087093
    Abstract: The present invention relates to a probe for detecting drug-resistant gram-positive pathogens, a probe set, and a method of detecting drug-resistant gram-positive pathogens using them. The probe for detecting drug-resistant gram-positive pathogens, the probe set, and the method for detecting drug-resistant gram-positive pathogens using them according to the present invention can contribute not only to shortening a detection time, compared to a conventional detection time, by optimizing a hybridization time, but also to increasing the sensitivity of detection by pre-amplification of the specific sequence of drug-resistant gram-positive pathogens, and thereby multiple detections of drug-resistant gram-positive pathogens can be accurately and efficiently performed.
    Type: Application
    Filed: June 8, 2017
    Publication date: March 29, 2018
    Inventors: Yeun Jun CHUNG, Dong Gun LEE, Chul Min PARK, Bo Ram CHUNG
  • Patent number: 9897554
    Abstract: A method of inspecting a surface includes loading an inspection object on a stage of a multibeam inspection device configured to generate a beam array, and scanning a plurality of inspection areas of the inspection object at a same time with the beam array, wherein one of the first inspection areas is smaller than an area formed by a quadrangle connecting respective centers of corresponding four adjacent beams of the beam array, and an adjacent area of the one first inspection area is not scanned with the beam array.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: February 20, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-hoon Na, Dong-gun Lee, Byung-gook Kim, Rae-won Yi
  • Patent number: 9893251
    Abstract: A light-emitting device package includes a plurality of luminescent structures arranged spaced apart from each other in a horizontal direction, an intermediate layer on the plurality of luminescent structures, and wavelength conversion layers on the intermediate layer, the wavelength conversion layers vertically overlapping separate, respective luminescent structures of the plurality of luminescent structures. The intermediate layer may include a plurality of layers, the plurality of layers associated with different refractive indexes, respectively. The intermediate layer may include a plurality of sets of holes, each set of holes may include a separate plurality of holes, and each wavelength conversion layer may vertically overlap a separate set of holes on the intermediate layer.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: February 13, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-sub Kim, Yong-il Kim, Dong-gun Lee, Kyung-wook Hwang, Jin-sub Lee, Min-gyeong Gwon