Patents by Inventor Dong-Gyu Lee

Dong-Gyu Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150107296
    Abstract: A heat exchanger that effectively distributes a refrigerant by varying the cross-sectional area of a header and an air conditioner having the same. The heat exchanger includes a plurality of refrigerant tubes disposed spaced apart from each other, a header joined to both ends of each of the refrigerant tubes, at least one baffle to divide the refrigerant tubes into a plurality of mutually adjacent groups and block a longitudinal flow of a refrigerant flowing in the header, each of the groups causing the refrigerant to flow in one direction, and a booster installed to vary a cross-sectional area of the header to uniformly distribute the refrigerant to refrigerant tubes in the same group among the refrigerant tubes. The booster to vary the cross-sectional area of the header may allow a refrigerant flowing through a header to be effectively distributed to the refrigerant tubes.
    Type: Application
    Filed: June 3, 2014
    Publication date: April 23, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong Gyu Lee, Sung Rok Kim, Dong Sik Jin, Kyoung Rock Kim, Hee Gak No
  • Publication number: 20150071550
    Abstract: An apparatus for detecting an afterimage candidate region includes: a comparison unit which compares gradation data of an n-th frame with integrated gradation data of an (n?1)-th frame and generates integrated gradation data of the n-th frame, where n is a natural number; a memory which provides the integrated gradation data of the (n?1)-th frame to the comparison unit and stores the integrated gradation data of the n-th frame; and an afterimage candidate region detection unit which detects an afterimage candidate region based on the integrated gradation data of the n-th frame, where each of the integrated gradation data of the n-th frame and the integrated gradation data of the (n?1)-th frame comprises a comparison region and a gradation region.
    Type: Application
    Filed: March 11, 2014
    Publication date: March 12, 2015
    Applicant: Samsung Display Co., Ltd.
    Inventors: Yong Jun JANG, Nam Gon CHOI, Joon Chul GOH, Gi Geun KIM, Geun Jeong PARK, Cheol Woo PARK, Yun Ki BAEK, Jeong Hun SO, Dong Gyu LEE
  • Publication number: 20150049123
    Abstract: A display device includes: a similar gray level block detector configured to detect a pixel data block in which a gray level difference between a plurality of pixel data included in an image signal is smaller than or equal to a threshold; a skin tone detector configured to detect the pixel data block including a skin tone; and a gamma processor configured to apply a first gamma to a plurality of pixel data included in the pixel data block when the pixel data block does not include the skin tone and apply a second gamma to the plurality of pixel data included in the pixel data block when the pixel data block includes the skin tone.
    Type: Application
    Filed: February 10, 2014
    Publication date: February 19, 2015
    Applicant: SAMSUNG DISPLAY CO., LTD.
    Inventors: Nam-Gon CHOI, Joon-Chul GOH, Gi Geun KIM, Yun Ki BAEK, Yong Jun JANG, Ah Reum KIM, Geun Jeong PARK, Cheol Woo PARK, Jeong-Hun SO, Dong Gyu LEE
  • Publication number: 20150017395
    Abstract: A cut-out laminated sheet can be prepared by laminating a protection sheet on a base sheet, followed by a simple two-step shearing process. The cut-out laminated sheet thus prepared features a protruding section that helps improving productivity by making the removal of the protection sheet easy; and thus, can be effectively used in a wide range of industrial applications such as a brittle sheet and a flexible sheet.
    Type: Application
    Filed: March 6, 2014
    Publication date: January 15, 2015
    Applicant: SKC CO., LTD.
    Inventors: Dong Gyu LEE, Jin Cheol KIM, Pyung Soo HA, II Hwan YOO, Dongjin PARK, Tae Kyoung KIM
  • Patent number: 8896732
    Abstract: Disclosed are a pixel, a pixel array, a method for manufacturing the pixel array, and an image sensor including the pixel array. The pixel includes a first color filter layer to transmit a visible light and an IR, and a second color filter layer to transmit a light, in which the visible light is blocked, at one side of the first color filter layer.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: November 25, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Seung Hoon Sa, Jung Chan Kyoung, Dong Gyu Lee, Jong Min You, Hyun Jong Ji, Jung Wan Jeong
  • Publication number: 20140327420
    Abstract: A power supply includes a rectifier circuit to rectify power, a smoothing circuit unit to smoothen a voltage of the rectified power, and a voltage drop circuit unit to drop the smoothened voltage. The voltage drop circuit unit includes an electric charge storage circuit to output the voltage-dropped voltage, a resonance circuit to receive first current from the smoothing circuit unit and to supply second current to the electric charge storage circuit, and a current interruption circuit to control the first current and the second current using zero current switching for performing switching when current does not flow using a resonance circuit.
    Type: Application
    Filed: April 22, 2014
    Publication date: November 6, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Joon Hwan LEE, Min Kwang LEE, Soon Bae YANG, Jae Jin KIM, Dong Gyu LEE, Jung Suk CHU
  • Patent number: 8835302
    Abstract: A method of fabricating a package substrate including preparing a substrate having at least one conductive pad, forming an insulating layer having an opening to expose the conductive pad on the substrate, forming a separation barrier layer on the conductive pad inside the opening to be higher than the upper surface of the insulating layer along the side walls thereof, forming a post terminal on the separation barrier layer, and forming a solder bump on the post terminal.
    Type: Grant
    Filed: April 19, 2013
    Date of Patent: September 16, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dong Gyu Lee, Dae Young Lee, Tae Joon Chung, Seon Jae Mun, Jin Won Choi
  • Patent number: 8822841
    Abstract: Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: September 2, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dong Gyu Lee, Jin Won Choi, Sung Won Jeong, Dae Young Lee, Gi Sub Lee, Jin Ho Kim
  • Publication number: 20140138821
    Abstract: Disclosed herein is substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.
    Type: Application
    Filed: January 27, 2014
    Publication date: May 22, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hueng Jae OH, Tae Joon CHUNG, Dong Gyu LEE, Seon Jae MUN, Jin Won CHOI
  • Patent number: 8704928
    Abstract: Disclosed are a pixel, a pixel array, an image sensor including the pixel array and a method for operating the image sensor. The pixel includes a photo-electro conversion unit; a capacitor for storing charges converted by the photo-electro conversion unit; an output switching device for outputting an electric potential of the capacitor; and a removal unit for removing a part of the charges converted by the photo-electro conversion unit.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: April 22, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Seung Hoon Sa, Woon Il Choi, Seong Hyung Park, Chun Hee Jeong, Dong Hyuk Park, Cheong Yong Park, Jung Chan Kyoung, Jung Wan Jeong, Dong Gyu Lee, Jong Min You, Hyun Jong Ji
  • Patent number: 8673331
    Abstract: Disclosed herein are an anti-bacterial, anti-fungal and anti-viral composition with excellent sterilizing power, deodorization and adhesion activity, an application thereof, and a method for preparing the same. The composition with sterilizing activity against bacteria, fungus and virus comprises colloidal silver particles in an amount of from 11 wt % to 15 wt %, titanium dioxide nanoparticles in an amount of from 18 wt % to 25 wt %, a dispersion stabilizer in an amount of from 0.01 wt % to 10 wt %, a binder in an amount of from 0.1 wt % to 4 wt %, and a balance of water in an amount required to form 100 wt %.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: March 18, 2014
    Assignee: GP&E
    Inventors: Il Hoon Cho, Dong Gyu Lee, Young Yeol Yang
  • Patent number: 8671564
    Abstract: Disclosed is a substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.
    Type: Grant
    Filed: September 4, 2009
    Date of Patent: March 18, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hueng Jae Oh, Tae Joon Chung, Dong Gyu Lee, Seon Jae Mun, Jin Won Choi
  • Patent number: 8640638
    Abstract: A sewing machine having a rotatable head portion includes a sewing machine frame shaped in a box using supporting posts and supporting bars to hold the sewing machine; a sewing machine main body mounted on the sewing machine frame; a head portion disposed at the front end of the sewing machine main body and rotatably installed through head portion rotating means; a bed portion rotatably installed under the head portion through bed portion rotating means; X-axis transporting means moving the sewing machine main body mounted on the sewing machine frame in X direction; Y-axis transporting means moving the sewing machine main body mounted on the sewing machine frame in Y direction; and a sewing object fixing frame provided at the front part of the sewing machine frame where the sewing object is held. The head portion and the bed portion are rotated to sew the sewing object.
    Type: Grant
    Filed: May 18, 2012
    Date of Patent: February 4, 2014
    Assignee: Sunstar Co., Ltd.
    Inventor: Dong Gyu Lee
  • Publication number: 20140017486
    Abstract: Disclosed is a ceramic laminate sheet comprising a ceramic sheet having a plurality of cracks and a polymer resin layer disposed on one side or both sides of the ceramic sheet, wherein the plurality of cracks pass through the ceramic sheet from one side to the other side thereof, the cracks divide the ceramic sheet into a plurality of pieces, grooves for formation of the cracks are not provided in one side and the other side of the ceramic sheet.
    Type: Application
    Filed: July 11, 2013
    Publication date: January 16, 2014
    Inventors: Il Hwan YOO, Jin Cheol KIM, Tae Kyoung KIM, Dong Gyu LEE, Yu Jin LEE
  • Patent number: 8599294
    Abstract: Disclosed are a pixel, a pixel array, an image sensor including the pixel array and a method for operating the image sensor. The pixel includes a photo-electro conversion unit; a first capacitor for storing a first quantity of charges of the photo-electro conversion unit; a second capacitor for storing a second quantity of charges of the photo-electro conversion unit; and an output unit to output the first and second quantities of the charges.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: December 3, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventors: Seung Hoon Sa, Woon II Choi, Seong Hyung Park, Chun Hee Jeong, Dong Hyuk Park, Cheong Yong Park, Jung Chan Kyoung, Jung Wan Jeong, Dong Gyu Lee, Jong Min You, Hyun Jong Ji
  • Patent number: 8558780
    Abstract: A display apparatus includes a backlight assembly, a first display panel assembly and a second display panel assembly. The backlight assembly includes a plurality of lamps disposed substantially parallel with each other. The backlight assembly emits first light through a first face and second light through a second face. The first display panel assembly is disposed adjacent to the first face to receive the first light. The second display panel assembly is disposed adjacent to the second face to receive the second light. The backlight assembly may further include a driving inverter electrically connected to first and second ends of the lamps to provide the lamps with driving voltages. Therefore, the backlight assembly applies light to the first and second display panel assemblies to reduce the number of backlight assemblies. Therefore, costs for manufacturing a display apparatus may be reduced.
    Type: Grant
    Filed: March 6, 2008
    Date of Patent: October 15, 2013
    Assignee: Samsung Display Co., Ltd.
    Inventors: Young-A Lee, Yong-Hyun Hwang, Kwang-Soo Lee, Dong-Gyu Lee, Doo-Won Lee, Jong-Young Yun, Neung-Beom Lee
  • Publication number: 20130237049
    Abstract: A method of fabricating a package substrate including preparing a substrate having at least one conductive pad, forming an insulating layer having an opening to expose the conductive pad on the substrate, forming a separation barrier layer on the conductive pad inside the opening to be higher than the upper surface of the insulating layer along the side walls thereof, forming a post terminal on the separation barrier layer, and forming a solder bump on the post terminal.
    Type: Application
    Filed: April 19, 2013
    Publication date: September 12, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Gyu Lee, Dae Young Lee, Tae Joon Chung, Seon Jae Mun, Jin Won Choi
  • Patent number: 8486760
    Abstract: There is provided a method of manufacturing a substrate for flip chip, and a substrate for flip chip manufactured using the same. The method includes providing a base substrate including at least one conductive pad, forming a solder resist layer on the base substrate, the solder resist layer including a first opening exposing the conductive pad, forming a dry film on the solder resist layer, the dry film including a second opening connected with the first opening, forming a metal post in the first opening and a part of the second opening, filling the second opening above the metal post with solder paste, forming a solder cap by performing a reflow process on the filled solder paste, planarizing a surface of the solder cap, and removing the dry film. Accordingly, fine pitches and improve reliability can be achieved.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: July 16, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Joon Chung, Jin Won Choi, Dong Gyu Lee, Hueng Jae Oh, Seon Jae Mun
  • Patent number: 8456003
    Abstract: There is provided a package substrate capable of controlling the degree of warpage thereof by improving the composition and formation of a post terminal and a method of fabricating the same. The package substrate includes a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a separation barrier layer provided on the conductive pad inside the opening and formed to be higher than the upper surface of the insulating layer along the side walls thereof; a post terminal provided on the separation barrier layer; and a solder bump provided on the post terminal.
    Type: Grant
    Filed: November 9, 2010
    Date of Patent: June 4, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dong Gyu Lee, Dae Young Lee, Tae Joon Chung, Seon Jae Mun, Jin Won Choi
  • Publication number: 20130129805
    Abstract: Disclosed herein are an anti-bacterial, anti-fungal and anti-viral composition with excellent sterilizing power, deodorization and adhesion activity, an application thereof, and a method for preparing the same. The composition with sterilizing activity against bacteria, fungus and virus comprises colloidal silver particles in an amount of from 11 wt % to 15 wt %, titanium dioxide nanoparticles in an amount of from 18 wt % to 25 wt %, a dispersion stabilizer in an amount of from 0.01 wt % to 10 wt %, a binder in an amount of from 0.1 wt % to 4 wt %, and a balance of water in an amount required to form 100 wt %.
    Type: Application
    Filed: November 18, 2011
    Publication date: May 23, 2013
    Applicant: GP&E
    Inventors: Il Hoon CHO, Dong Gyu LEE, Young Yeol YANG