Abstract: The present invention relates to an in-document search method and device for a query vector, and an object of the present invention is to improve the accuracy of a response by generating sentence data corresponding to data in a table form stored in database. The in-document search method for a query vector includes a step A of receiving a user query from a user terminal, a step B of generating a user query vector for the user query, a step C of extracting candidate table data based on the user query vector in a data storage module, a step D of searching for a response corresponding to the user query vector in the candidate table data, and a step E of providing the response to the user terminal.

Abstract: Disclosed is an electronic device. The An electronic device including a storage, and a processor configured to perform convolution processing on target data and kernel data based on stride information that indicates an interval at which the kernel data is applied to the target data stored in the storage, in which the processor is further configured to divide the target data into a plurality of pieces of sub-data based on first stride information, perform the convolution processing on the plurality of pieces of sub-data and a plurality of pieces of sub-kernel data respectively corresponding to the plurality of pieces of sub-data based on second stride information that is different from the first stride information, and combine a plurality of processing results, the plurality of pieces of sub-kernel data are obtained by dividing the kernel data based on the first stride information, and the second stride information indicates that the interval at which the kernel data is applied to the target data is 1.

Abstract: A capacitor structure, a semiconductor memory device including the same, a method for fabricating the same, and a method for fabricating a semiconductor device including the same are provided. The capacitor structure includes a lower electrode, an upper electrode, and a capacitor dielectric film which is interposed between the lower electrode and the upper electrode, wherein the lower electrode includes an electrode film including a first metal element, and a doping oxide film including an oxide of the first metal element between the electrode film and the capacitor dielectric film, and the doping oxide film further includes a second metal element including at least one of Group 5 to Group 11 and Group 15 metal elements, and an impurity element including at least one of silicon (Si), aluminum (Al), zirconium (Zr) and hafnium (Hf).

Abstract: A method to sublimate a wide variety of coatings onto optical lens includes printing a first coating using a sublimation transfer ink onto a sublimation paper, positioning the sublimation paper onto the optical lens to align the sublimation paper to a first surface of the optical lens, placing the sublimation paper thereon, preheating a chamber of a vacuum oven to a predetermined temperature, placing the optical lens into the chamber of the vacuum oven with the first surface of the optical lens facing upward, closing the vacuum oven and setting a predetermined time for heating, heating and vacuuming the chamber of the vacuum oven during about the predetermined time such that the first coating sublimates onto the first surface of the optical lens from the sublimation paper, removing from the vacuum oven and cooling the optical lens having the first coating on its first surface.

Abstract: The present invention relates to a novel nicotinamide compound, a method for preparing the same, and a herbicide comprising the compound. The compound of the present invention is useful as a herbicide for foliar treatment or soil treatment because it has high safety for wheat or corn and has excellent herbicidal activity against grassy weeds, sedge weeds or broadleaf weeds.

Abstract: A device for spatially normalizing a medical image includes: an adaptive template generation unit configured such that when a plurality of functional medical images are input to a deep learning architecture, the adaptive template generation unit generates, based on prestored learning data, an adaptive template for spatially normalizing the plurality of functional medical images; a learning unit configured to learn by repeating a process of generating an image from an input functional medical image of a user based on the adaptive template through a generative adversarial network (GAN) and determine authenticity of the generated image; and a spatial normalization unit configured to provide the functional medical image of the user which is spatially normalized based on results of the learning.

Abstract: The present invention relates to a method for manufacturing a core plug of a gas turbine vane, and more particularly to plan and design a core plug formation using brazing comprising: a first step of designing and planning a formation of a core plug; a second step of cutting a Hastelloy X plate according to the design of the core plug; a third step of fabricating a preform of the core plug; a fourth step of spot-welding a trailing edge; a fifth step of pasting a brazing filler; a sixth step of performing brazing heat treatment; a seventh step of performing grinding a brazed portion; an eighth step of performing a grit blasting. According to the method for manufacturing a core plug of a gas turbine vane using brazing of the present invention above-mentioned, there is a significant effect of reducing manufacturing cost by in which the process is simple, and there is no deformation, shrinkages, cracks, and the like, in contrast with a conventional welding method.

Abstract: An electronic device in a neighbor awareness networking (NAN) cluster is provided. The electronic device includes a wireless fidelity (Wi-Fi) transceiver; and a processor, coupled with the Wi-Fi transceiver, configured to perform a synchronization with at least one device in the NAN cluster, wherein the at least one device comprises an external electronic device, after performing the synchronization, receive, from the external electronic device through the Wi-Fi transceiver, a frame including first data within at least one discovery window (DW) among a plurality of DWs, wherein the first data comprises channel information for second data, and time information for the second data, and based on the channel information and the time information, control the Wi-Fi transceiver to receive the second data at a channel corresponding to the channel information of the received first data during a time duration corresponding to the time information of the received first data.

Abstract: The present invention relates to a fundus imaging device having an automatic focusing function, by which even a user, who is not a skilled expert, may easily photograph a fundus image, and interpret and analyze the photographed image to predict a degree of risk, the fundus imaging device controlling a focusing unit to adjust a focus of a pupil image received from a pupil imaging unit, and controlling a fundus imaging unit to photograph a fundus image when the pupil image is in focus.

Abstract: The present invention relates to a pilot tone generating method and apparatus of an orthogonal frequency division multiple access system and method, and a channel estimation method and apparatus using the same. The channel estimation apparatus includes a pilot tone extracting unit for extracting a pilot tone, which is inserted within a frame with data tone, masked with an orthogonal code; a pilot tone unmasking unit for unmasking of the pilot tone extracted from the pilot tone extracting unit by using an orthogonal code information; and a channel estimation operating unit for estimating a channel by calculating an average of the pilot tones which is unmasked in the unmasking unit.

Abstract: A battery module which uses a flexible printed circuit board (FPCB) to provide a transmission path of information on the voltage or temperature thereof sensed by a bus bar. The battery module may have a smaller size in a height direction compared to a case of using a rigid printed circuit board (RPCB) or a wire instead of the FPCB to provide the transmission path of the information on the voltage or temperature, and may thus have improved energy efficiency per volume.

Abstract: A data transmission system and method in a physical network separation environment is provided, which includes: a drive device controlling connection switching for one storage medium drive writing or reading a data file on or from a predetermined storage medium; a source-side server executing writing the data file on the storage medium loaded in the storage medium drive, after switching to a connection to the storage medium drive; a clean PC conducting hash value verification and a test for infection of malicious code with respect to the data file that has been written on the storage medium, after switching to a connection to the storage medium drive; and a destination-side server executing reading the tested data file from the storage medium, after switching to a connection to the storage medium drive.

Abstract: A battery module includes a cell stack body in which a plurality of battery cells are stacked; and a module case accommodating the cell stack body therein having a first surface and a second surface, opposite to the first surface. The module case includes an upper case disposed on one side of the cell stack body; a lower case disposed on the other side of the cell stack body and coupled to the upper case; and a module fastening portion for coupling the battery module to an external structure, wherein the module fastening portion is disposed closer to the first surface of the module case than to the second surface of the module case, and wherein a case fastening portion coupling the upper case and the lower case together is disposed closer to the second surface of the module case than to the first surface of the module case.

Abstract: A battery module includes a cell stack including a plurality of battery cells stacked therein, a bus bar assembly coupled to a side of the cell stack, on which an electrode lead of the battery cell is disposed, and a sensing device coupled to the bus bar assembly and measuring a temperature of the battery cell. The bus bar assembly is coupled to the cell stack in a vertical direction, and the sensing device includes a temperature sensor disposed in close contact with the battery cell, and an elastic bracket pressing the temperature sensor toward the battery cell through elastic force.

Abstract: A semiconductor package comprises a package substrate, a semiconductor chip mounted on the package substrate, a transparent substrate disposed on the semiconductor chip, an attachment dam between the semiconductor chip and the transparent substrate, the attachment dam extending along an edge of the semiconductor chip to define a gap between the semiconductor chip and the transparent substrate, a first molding layer on the package substrate, the first molding layer surrounding a side surface of the semiconductor chip and including a first epoxy resin composition, and a second molding layer on the package substrate, the second molding layer filling a space between the semiconductor chip and the first molding layer and including a second epoxy resin composition, wherein the first epoxy resin composition includes a first filler containing at least one of silica or alumina, the second epoxy resin composition includes a second filler containing at least one of silica or alumina, and a content of the second filler w

Abstract: A method of manufacturing a semiconductor package includes forming a first redistribution structure, forming a plurality of conductive pillars on the first redistribution structure, mounting the first semiconductor chip on the first redistribution structure, forming an encapsulant configured to cover an upper surface of the first redistribution structure, the plurality of conductive pillars, and the first semiconductor chip, planarizing the encapsulant, exposing the plurality of conductive pillars by forming an opening in the planarized encapsulant, and forming a second redistribution structure connected to the plurality of conductive pillars on the first semiconductor chip and the encapsulant. Upper surfaces of the plurality of conductive pillars are located at a lower level than the upper surface of the first semiconductor chip, and an upper surface of a connection via included in the second redistribution structure has a width greater than a width of a lower surface of the connection via.

Abstract: A method of manufacturing a semiconductor package includes forming a first redistribution structure, forming a plurality of conductive pillars on the first redistribution structure, mounting the first semiconductor chip on the first redistribution structure, forming an encapsulant configured to cover an upper surface of the first redistribution structure, the plurality of conductive pillars, and the first semiconductor chip, planarizing the encapsulant, exposing the plurality of conductive pillars by forming an opening in the planarized encapsulant, and forming a second redistribution structure connected to the plurality of conductive pillars on the first semiconductor chip and the encapsulant. Upper surfaces of the plurality of conductive pillars are located at a lower level than the upper surface of the first semiconductor chip, and an upper surface of a connection via included in the second redistribution structure has a width greater than a width of a lower surface of the connection via.

Abstract: A semiconductor package includes a semiconductor package substrate. An insulating layer is disposed on the semiconductor package substrate. A semiconductor chip is disposed on the semiconductor package substrate and is covered by the insulating layer. A reflective layer is disposed on the insulating layer and is spaced apart from the semiconductor chip. The reflective layer is configured to selectively transmit radiation through to the insulating layer. A protective layer is disposed on the reflective layer.

Abstract: A semiconductor package includes a package substrate, a first semiconductor device arranged on the package substrate, at least one second semiconductor device on the first semiconductor device to partially cover the first semiconductor device from a top down view, a heat dissipating insulation layer coated on the first semiconductor device and the at least one second semiconductor device, a conductive heat dissipation structure arranged on the heat dissipating insulation layer on a portion of the first semiconductor device not covered by the second semiconductor device, and a molding layer on the package substrate to cover the first semiconductor device and the at least one second semiconductor device. The heat dissipating insulation layer is formed of an electrically insulating and thermally conductive material, and the conductive heat dissipation structure formed of an electrically and thermally conductive material.

Abstract: A semiconductor package can include a substrate and a semiconductor chip on the substrate. A first molding portion can cover the semiconductor chip and can include a first sidewall and a second sidewall opposite each other. A second molding portion can extend on the substrate along the first sidewall and along the second sidewall, where the first molding portion can include a nonconductive material, and the second molding portion can include a conductive material.