Abstract: A printed circuit board according to an embodiment of the present invention includes a core layer and a circuit wiring layer disposed on a top surface of the core layer. The core layer is spaced apart from the circuit wiring layer and includes through-holes formed around the circuit wiring layer. Flexibility of the printed circuit board may be enhanced by the through-hole to obtain bending stability.

Abstract: An antenna device according to embodiments of the present invention includes a dielectric layer, an antenna unit disposed on a top surface of the dielectric layer, the antenna unit including a radiator and a transmission line connected to the radiator, and a reflective pattern electrically and physically separated from the antenna unit and disposed on the top surface of the dielectric layer together with the antenna unit. A frequency or signal transfer between different communication devices can be implemented through the reflective pattern.

Abstract: An antenna structure according to an embodiment of the present disclosure includes an antenna unit array including a plurality of antenna units, and a parasitic element disposed to be adjacent to the antenna units and to be electrically and physically separated from the antenna units. Each of the antenna units includes a radiator, and a transmission line including a first transmission line and a second transmission line connected to the radiator in different directions. The parasitic element includes a first parasitic element disposed between the first transmission line and the second transmission line included in the same antenna unit, and a second parasitic element disposed between the first transmission line and the second transmission line included in different neighboring antenna units. The second parasitic element includes a branched portion including a first branched portion and a second branched portion bent in different directions.

Abstract: An antenna structure according to an embodiment of the present disclosure includes a dielectric layer and a plurality of antenna units arranged on a top surface of the dielectric layer. Each of the plurality of antenna units includes a radiator, a first transmission line and a second transmission line extending in different directions to be connected to the radiator, an upper parasitic element adjacent to an upper portion of the radiator, and a lower parasitic element adjacent to a lower portion of the radiator.

Abstract: A flexible printed circuit board includes a power wiring layer transmitting power and a signal wiring layer insulated and stacked over or under the power wiring layer. The flexible printed circuit board may also include an upper wiring layer and a lower wiring layer insulated and stacked each other, and the power wiring layer and the signal wiring layer are provided between the upper wiring layer and the lower wiring layer.

Abstract: An antenna device according to an embodiment of the present disclosure includes a dielectric layer, a first electrode layer disposed on an upper surface of the dielectric layer, the first electrode layer including a radiator and having a first mesh structure, and a second electrode layer disposed on a lower surface of the dielectric layer, the second electrode layer having a second mesh structure. The first mesh structure and the second mesh structure are aligned to be offset or staggered from each other with respect to the dielectric layer in a planar view.

Abstract: An antenna package according to an embodiment of the present disclosure includes a first antenna device including a first antenna unit, a first circuit board electrically connected to the first antenna unit, a second circuit board electrically connected to the first circuit board, a second antenna unit integrated with the second circuit board, and an antenna driving integrated circuit chip mounted on the second circuit board and electrically connected to the first antenna unit and the second antenna unit. Multi-axial radiation is implemented using the antenna package with high efficiency and reliability.

Abstract: An antenna package according to an exemplary embodiment of the present invention includes a first antenna device which includes a first antenna unit including a first radiator, a second antenna device which includes a second antenna unit including a second radiator whose polarization direction is perpendicular to the first radiator, a first circuit board electrically connected with the first antenna unit, a second circuit board electrically connected with the second antenna unit, and a third circuit board on which at least one antenna driving integrated circuit (IC) chip electrically and independently connected to the first circuit board and the second circuit board is mounted. By supplying power to two antenna devices having different polarization directions, respectively, signal interference and signal loss may be prevented, and dual polarization may be implemented.

Abstract: An antenna structure according to an embodiment of the present disclosure includes a dielectric layer, and an antenna unit disposed on a top surface of the dielectric layer. The antenna unit includes a radiator including convex portions and concave portions, a transmission line including a first transmission line and a second transmission line that extend in different directions to be connected to the radiator, and a parasitic element disposed to be adjacent to the transmission line and electrically and physically separated from the transmission line and the radiator. A length of the parasitic element in an extension direction of the transmission line is from 45% to 70% of a half wavelength (?/2) at a maximum resonance frequency from the antenna unit.

Abstract: An antenna structure according to an embodiment includes a first radiation including a first radiator, a second radiation unit including a second radiator, and a third radiation unit including a third radiator. At least one of the first radiator, the second radiator and the third radiator includes a plurality of radiators coupled to each other in an array form. A first axis extending between a central point of the first radiator and a central point of the second radiator, and a second axis extending between the central point of the second radiator and a central point of the third radiator are perpendicular to each other.

Abstract: An antenna element according to an embodiment of the present invention includes a radiation body including a contact part which is concave toward the transmission line, a transmission line disposed on a different layer from the radiation body and connected to the radiation body through the contact part, and a signal pad connected to an end of the transmission line.

Abstract: A multi-sensor structure according to an embodiment of the present disclosure includes a base layer, a first touch-fingerprint sensor electrode layer disposed on a top surface of the base layer, a second touch-fingerprint sensor electrode layer disposed at an upper level of the first touch-fingerprint sensor electrode layer, and an antenna electrode layer spaced apart from the first touch-fingerprint sensor electrode layer and the second touch-fingerprint sensor electrode layer in a planar direction. The antenna electrode layer is disposed at the same level as that of the first touch-fingerprint sensor electrode layer or the second touch-fingerprint sensor electrode layer. A sensor in which a touch-fingerprint sensing and an antenna signal sensing are integrated is provided.

Abstract: An antenna structure of an embodiment of the present invention includes a film antenna including a dielectric layer and an antenna electrode layer formed on an upper surface of the dielectric layer, and a flexible circuit board including a power supply wiring electrically connected to the antenna electrode layer. A bonding region is defined by a region in which the antenna electrode layer and the power supply wiring are overlapped with each other in a planar direction, and the bonding region has a length of 1.5 mm or less. Signal efficiency and radiation reliability may be improved by adjusting a length of the bonding region.

Abstract: An antenna structure according to an embodiment of the present disclosure includes a dielectric layer, and an antenna conductive layer disposed on a top surface of the dielectric layer. The antenna conductive layer includes a radiator, first and second transmission lines extending in different directions to be connected to the radiator, an upper parasitic element adjacent to an upper portion of the radiator in a planar view, and a lower parasitic element adjacent to a lower portion of the radiator, the first transmission line and the second transmission line in the planar view.

Abstract: An antenna structure according to an embodiment of the present invention includes a film antenna including a dielectric layer, an upper electrode layer disposed on an upper surface of the dielectric layer and including a radiation pattern, a transmission line, and a ground pad, and a lower ground layer disposed on a lower surface of the dielectric layer, and a flexible circuit board including a core layer, a power supply wiring layer disposed on a lower surface of the core layer and electrically connected to the transmission line, and a ground plate disposed on an upper surface of the core layer and disposed in overlapping with the power supply wiring layer in a planar direction. Thereby, it is possible to reduce a radiation signal generated from the power supply wiring through the ground plate, suppress a noise of the antenna and increase radiation efficiency.

Abstract: A film transmission line according to an embodiment of the present invention includes a dielectric layer, and an electrode line disposed on the dielectric layer. The electrode line has an effective efficiency of 200%/?m or more at a frequency of 5 GHz or more. The film transmission line may be applied to a high frequency thinned antenna and an image display device.

Abstract: An image display device according to an embodiment of the present disclosure includes a display panel, a touch sensor structure and an antenna electrode layer. The display panel includes a panel substrate, and an electrode structure and an insulation structure stacked on the panel substrate. The touch sensor structure is disposed on the display panel. The antenna electrode layer is disposed on the display panel at the same level as that of the touch sensor structure and at least partially overlaps the electrode structure of the display panel in a thickness direction. The antennal electrode layer is disposed in consideration of an electrode construction of the display panel and the touch sensor structure to provide a thin-layered image display device with high reliability.

Abstract: An electrode structure combined with an antenna according to an embodiment of the present disclosure includes a substrate layer, sensing electrodes, a bridge electrode and an antenna unit. The sensing electrodes are arranged on the substrate layer, and include first sensing electrodes arranged along a first direction parallel to a top surface of the substrate layer, and second sensing electrodes arranged along a second direction parallel to the top surface of the substrate layer and intersecting the first direction. The bridge electrode connects the first sensing electrodes neighboring in the first direction. The antenna unit is disposed at the same layer as that of the bridge electrode, and includes a radiator overlapping the sensing electrodes in a planar view.

Abstract: An antenna package includes a first antenna device including a first antenna unit, a second antenna device disposed at a level different from that of the first antenna device, the second antenna device including a second antenna unit that has a radiation direction different from that of the first antenna unit, a first circuit board electrically connected to the first antenna unit, a second circuit board electrically connected to the second antenna unit, and a third circuit board electrically and independently connected to the first circuit board and the second circuit board, the third circuit board having at least one antenna driving integrated circuit (IC) chip mounted thereon.

Abstract: An antenna package according to an embodiment includes an antenna device comprising an antenna unit, and a connector electrically connected to the antenna unit. The connector includes an insulator having a dielectric constant from 2 to 3.5 and a loss tangent from 0.0015 to 0.007 measured by a resonance method at 10 GHz, and a conductive connection structure insulated by the insulator and electrically connected to the antenna unit.