Abstract: A method and an apparatus for recognizing a parking area are disclosed. The parking area recognizing apparatus includes: a signal transmitter transmitting a signal using a sensor; an echo signal receiver receiving an echo signal for the signal; a multiple signal generator generating a multiple echo signal using the echo signal based on first and second preset thresholds; and a parking area recognizer recognizing a parking area by calculating a round trip time and a duration time for the multiple echo signal and selecting an available echo signal based on at least one of the round trip time and the duration time. Accordingly, a precision in recognition of a parking area is enhanced by reducing a measurement error by processing an echo signal received after it is reflected on an object with a multiple echo signal in recognition of the parking area using a sensor such as an ultrasonic sensor or a radar sensor.

Abstract: A sensor package, and in one embodiment a sensor package for surface mount applications, that comprises a leadframe with an upper and lower surface for receiving a device thereon. Embodiments of the sensor package comprise a first device secured to the upper surface, and a second device secured to the lower surface so as to place connective pads from each of the first device and the second device proximate to one side of the leadframe. The sensor package further comprises a lead that is positioned in the sensor package in a manner that prevents electrical connection with circuitry that is external of the housing. The lead has an end proximate the side of the lead frame where the connective pads are positioned on the upper and lower surfaces. The end configured to receive connections, e.g., wirebonds, from the connective pads in a manner connecting the first device and the second device independent of any external connections of the sensor package.

Abstract: A sensor package, and in one embodiment a sensor package for surface mount applications, that comprises a leadframe with an upper and lower surface for receiving a device thereon. Embodiments of the sensor package comprise a first device secured to the upper surface, and a second device secured to the lower surface so as to place connective pads from each of the first device and the second device proximate to one side of the leadframe. The sensor package further comprises a lead that is positioned in the sensor package in a manner that prevents electrical connection with circuitry that is external of the housing. The lead has an end proximate the side of the lead frame where the connective pads are positioned on the upper and lower surfaces. The end configured to receive connections, e.g., wirebonds, from the connective pads in a manner connecting the first device and the second device independent of any external connections of the sensor package.

Abstract: An aluminum paste and a solar cell, the aluminum paste including aluminum powder; an organic vehicle; and antimony oxide, the antimony oxide being present in an amount of about 0.001 wt % to less than about 1.0 wt %, based on a total weight of the aluminum paste.

Abstract: A parking space is detected by using a range sensor. Distance data in a predetermined period is collected by using the range sensor according to a user's selection and mapping the collected distance data on a coordinates system based on a parking space searching vehicle. The collected distance data are classified into short distance data and long distance data. Parking-available distance data, is calculated. Whether the parking space exists based on the calculated parking-available distance data is checked. The parking space searching vehicle is stopped by controlling an active braking apparatus or recommending a driver to stop the parking space searching vehicle by means of a voice and alarm sounds when it has been checked that the parking space exists.

Abstract: A method and an apparatus for recognizing a parking area are disclosed. The parking area recognizing apparatus includes: a signal transmitter transmitting a signal using a sensor; an echo signal receiver receiving an echo signal for the signal; a multiple signal generator generating a multiple echo signal using the echo signal based on first and second preset thresholds; and a parking area recognizer recognizing a parking area by calculating a round trip time and a duration time for the multiple echo signal and selecting an available echo signal based on at least one of the round trip time and the duration time. Accordingly, a precision in recognition of a parking area is enhanced by reducing a measurement error by processing an echo signal received after it is reflected on an object with a multiple echo signal in recognition of the parking area using a sensor such as an ultrasonic sensor or a radar sensor.

Abstract: Disclosed is a method for detecting a parking space by using a range sensor, which includes the steps of: (a) collecting, by a parking environment recognition control unit, distance data in a predetermined period by using the range sensor according to a user's selection and mapping the collected distance data on a coordinates system based on a parking space searching vehicle; (b) classifying the collected distance data into short distance data and long distance data; (c) calculating parking-available distance data which is a horizontal movement distance of an interval where the long distance data is collected from when the long distance data starts to be collected; (d) checking if the parking space exists based on the calculated parking-available distance data; (e) stopping the parking space searching vehicle by controlling an active braking apparatus or recommending a driver to stop the parking space searching vehicle by means of a voice and alarm sounds when it has been checked in steps (d) that the parking

Abstract: Disclosed is a method of automatically registering address information of a mobile communication terminal. The method comprises: generating an address information registering message at an originating mobile communication terminal by adding an identifier to transmission information and transmitting the address information registering message from an originating mobile communication terminal; and at a called mobile communication terminal, receiving the address information registering message, checking whether or not an address information registering message service is available, and registering the transmission information with an address book, whereby it is convenient for the user to register the address information, which is allowed to satisfy requests of the user caused by increase of the short message service.

Abstract: A semiconductor package comprises a semiconductor chip and a printed circuit board. The printed circuit board comprises a board body. An upper wiring layer is formed on the upper surface of the board body and includes a chip-mounting portion for mounting the semiconductor chip, board pads formed around the chip-mounting portion and electrically connected to said semiconductor chip, and an upper heat dissipation layer around said chip-mounting portion. Further, a lower wiring layer including a lower heat dissipation layer is formed on the lower surface of the board body. First heat-dissipating via holes are formed through the board body between the chip-mounting portion and the lower heat dissipation layer and are filled with a thermally conductive material for dissipating heat from the chip through the board body to the lower wiring layer.

Abstract: A semiconductor package comprises a semiconductor chip and a printed circuit board. The printed circuit board comprises a board body. An upper wiring layer is formed on the upper surface of the board body and includes a chip-mounting portion for mounting the semiconductor chip, board pads formed around the chip-mounting portion and electrically connected to said semiconductor chip, and an upper heat dissipation layer around said chip-mounting portion. Further, a lower wiring layer including a lower heat dissipation layer is formed on the lower surface of the board body. First heat-dissipating via holes are formed through the board body between the chip-mounting portion and the lower heat dissipation layer and are filled with a thermally conductive material for dissipating heat from the chip through the board body to the lower wiring layer.