Abstract: There are provided an active-energy-ray-curable resin composition of which a cured coating film has a high surface hardness, high transparency, high resistance to curling, and high surface smoothness; a coating material containing such a resin composition; a coating film formed of the coating material; and a film containing a layer of the coating film. In particular, an active-energy-ray-curable resin composition containing fine wet-process silica particles (A) subjected to a hydrophobic treatment and a compound (B) having a (meth)acryloyl group is provided. Also provided are a coating material containing such a resin composition, a coating film formed by curing the coating material, and a laminated film having a layer of the coating film.

Abstract: Provided is a positive photoresist composition excellent in terms of heat resistance. A radically curable compound is represented by a general formula (1) below (where R1, R2, and R3 each independently represent an alkyl group having 1 to 8 carbon atoms; m and n each independently represent an integer of 1 to 4; p represents an integer of 0 to 4; X, Y, and Z each independently represent an acryloyloxy group, a methacryloyloxy group, or a hydroxy group, and at least one of X, Y, and Z represents an acryloyloxy group or a methacryloyloxy group; and t represents 1 or 2).

Abstract: Provided is a positive photoresist composition excellent in terms of heat resistance. A radically curable compound is represented by a general formula (1) below (where R1, R2, and R3 each independently represent an alkyl group having 1 to 8 carbon atoms; m and n each independently represent an integer of 1 to 4; p represents an integer of 0 to 4; X, Y, and Z each independently represent an acryloyloxy group, a methacryloyloxy group, or a hydroxy group, and at least one of X, Y, and Z represents an acryloyloxy group or a methacryloyloxy group; and t represents 1 or 2).

Abstract: The present invention provides a (meth)acryloyl group-containing resin having excellent heat resistance and a phenolic hydroxyl group-containing compound used as a raw material of the resin. A phenolic hydroxyl group-containing compound has a molecular structure represented by general formula (1) below [in the formula, R1, R2, and R3 are each independently an alkyl group having 1 to 8 carbon atoms, m and n are each independently an integer of 1 to 4, p is an integer of 0 to 4, V is a hydrogen atom, a (meth)acryloyloxy group, or a hydroxyl group, and W, X, and Y are each independently a (meth)acryloyloxy group or a hydroxyl group], wherein at least one of V, W, X, and Y is a hydroxyl group, and at least one of V, W, X, and Y is a (meth)acryloyloxy group.

Abstract: Provided is a positive photoresist composition excellent in terms of heat resistance. A radically curable compound is represented by a general formula (1) below (where R1, R2, and R3 each independently represent an alkyl group having 1 to 8 carbon atoms; m and n each independently represent an integer of 1 to 4; p represents an integer of 0 to 4; X, Y, and Z each independently represent an acryloyloxy group, a methacryloyloxy group, or a hydroxy group, and at least one of X, Y, and Z represents an acryloyloxy group or a methacryloyloxy group; and t represents 1 or 2).

Abstract: The present invention provides a (meth)acryloyl group-containing resin having excellent heat resistance and a phenolic hydroxyl group-containing compound used as a raw material of the resin. A phenolic hydroxyl group-containing compound has a molecular structure represented by general formula (1) below [in the formula, R1, R2, and R3 are each independently an alkyl group having 1 to 8 carbon atoms, m and n are each independently an integer of 1 to 4, p is an integer of 0 to 4, V is a hydrogen atom, a (meth)acryloyloxy group, or a hydroxyl group, and W, X, and Y are each independently a (meth)acryloyloxy group or a hydroxyl group], wherein at least one of V, W, X, and Y is a hydroxyl group, and at least one of V, W, X, and Y is a (meth)acryloyloxy group.

Abstract: Provided is a positive photoresist composition excellent in terms of heat resistance. A radically curable compound is represented by a general formula (1) below (where R1, R2, and R3 each independently represent an alkyl group having 1 to 8 carbon atoms; m and n each independently represent an integer of 1 to 4; p represents an integer of 0 to 4; X, Y, and Z each independently represent an acryloyloxy group, a methacryloyloxy group, or a hydroxy group, and at least one of X, Y, and Z represents an acryloyloxy group or a methacryloyloxy group; and t represents 1 or 2).