Patents by Inventor Donna Marie Alden

Donna Marie Alden has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of making chemical mechanical polishing layers having improved uniformity
    Patent number: 11524390
    Abstract: The present invention provides methods of manufacturing a chemical mechanical polishing (CMP polishing) layer for polishing substrates, such as semiconductor wafers comprising providing a composition of a plurality of liquid-filled microelements having a polymeric shell; classifying the composition via centrifugal air classification to remove fines and coarse particles and to produce liquid-filled microelements having a density of 800 to 1500 g/liter; and, forming the CMP polishing layer by (i) converting the classified liquid-filled microelements into gas-filled microelements by heating them, then mixing them with a liquid polymer matrix forming material and casting or molding the resulting mixture to form a polymeric pad matrix, or (ii) combining the classified liquid-filled microelements directly with the liquid polymer matrix forming material, and casting or molding.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: December 13, 2022
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Bainian Qian, George C. Jacob, Andrew Wank, David Shidner, Kancharla-Arun K. Reddy, Donna Marie Alden, Marty W. DeGroot
  • METHODS OF MAKING CHEMICAL MECHANICAL POLISHING LAYERS HAVING IMPROVED UNIFORMITY
    Publication number: 20180311792
    Abstract: The present invention provides methods of manufacturing a chemical mechanical polishing (CMP polishing) layer for polishing substrates, such as semiconductor wafers comprising providing a composition of a plurality of liquid-filled microelements having a polymeric shell; classifying the composition via centrifugal air classification to remove fines and coarse particles and to produce liquid-filled microelements having a density of 800 to 1500 g/liter; and, forming the CMP polishing layer by (i) converting the classified liquid-filled microelements into gas-filled microelements by heating them, then mixing them with a liquid polymer matrix forming material and casting or molding the resulting mixture to form a polymeric pad matrix, or (ii) combining the classified liquid-filled microelements directly with the liquid polymer matrix forming material, and casting or molding.
    Type: Application
    Filed: May 1, 2017
    Publication date: November 1, 2018
    Inventors: Bainian Qian, George C. Jacob, Andrew Wank, David Shidner, Kancharla-Arun K. Reddy, Donna Marie Alden, Marty W. DeGroot