Abstract: Techniques disclosed herein relate to using thermally conductive textiles for heat dissipation from wearable electronic devices. An exemplary thermally conductive textile may be constructed from an elasticated band for encircling a body part of a user (e.g., a user's head) and one or more thermally conductive wires that are affixed to the elasticated band in a wave pattern. The thermally conductive wires being arranged in the wave pattern allows for the thermally conductive wires to freely stretch and contract as forces are exerted on the elasticated band. Thus, the thermally conductive textile described herein exhibit elastic properties that are predominantly governed by the elasticated band while also exhibiting thermal properties that are predominantly governed by the thermally conductive wires. The thermally conductive textiles may also include locking fibers to restrict deformation of the wave pattern of the thermally conductive wires.

Abstract: Devices having multiple layers of paint for enhanced thermal performance. Individual paint-layers have specific properties within specific wavelength-ranges. An exemplary device includes an emissive outer layer that has a high emissivity in a first wavelength-range to increase thermal radiation and a high transmittance in a second wavelength-range to reduce solar gain. Underneath the emissive outer layer is a color matching layer that has a high transmittance in the second wavelength-range and absorbs at least some visible light. Underneath the color matching layer is a reflective sublayer that has a high reflectivity in the second wavelength-range. EM radiation within the second wavelength-range passes through the emissive outer layer and color matching layer before being reflected by the reflective sublayer back into the atmosphere. Thus, solar gain is reduced due to the solar energy within the second wavelength range being reflected off of the device—rather than absorbed as thermal energy.

Abstract: Techniques disclosed herein relate to exploiting photovoltaic effects to improve the thermal management capabilities for wearable electronic devices. In an exemplary embodiment, a wearable electronic device includes photovoltaic cells disposed over a housing assembly that encloses heat-emitting electronic components. The photovoltaic cells block solar radiation from reaching an exterior surface of the housing assembly—thereby reducing the solar gain thereof. Electrical energy that is generated by the photovoltaic cells is utilized in some manner that is determined to be currently appropriate based on various current-state factors of the wearable electronic device.

Abstract: A thermal conduit configured to conduct heat from a heat source to a heat sink and method of forming said conduit are disclosed herein. The thermal conduit may comprise a plurality of stacked sheets formed of an anisotropically thermally conductive material, a non-limiting example of which is graphite, each sheet with a respective orientation of thermal conduction. The orientations of thermal conduction of the plurality of sheets may change stepwise in a stacking direction to form a curved thermal flow path.

Abstract: A thermal conduit configured to conduct heat from a heat source to a heat sink and method of forming said conduit are disclosed herein. The thermal conduit may comprise a plurality of stacked sheets formed of an anisotropically thermally conductive material, a non-limiting example of which is graphite, each sheet with a respective orientation of thermal conduction. The orientations of thermal conduction of the plurality of sheets may change stepwise in a stacking direction to form a curved thermal flow path.

Abstract: The described embodiment relates generally to the field of thermal management. More specifically an apparatus for cooling a unibody computing device with obscured inlet and outlet vents is disclosed. Inlet vents are arranged on a bottom surface of the unibody computing device and then exhaust air is vented out from a rear surface of the computing device. The rear vents can be obscured by a stand designed to support the weight of the computing device. By venting exhaust air to either side of the support stand exhaust air can be prevented from being drawn back into the inlet vents, thereby avoiding an overheating condition.

Abstract: Quick release couplings for releasably coupling components to the computer are disclosed. The quick release coupling mechanisms are generally configured to allow tool-less placement of the components relative to the computer. That is, the quick release coupling mechanisms are configured to perform their couplings without using conventional fasteners such as screws, bolts, etc. By eliminating use of fasteners, the components may be inserted and removed from the computer without using tools (e.g., tool-less). Furthermore, the quick release couplings are easy to maneuver thereby enabling quick and straightforward assembly and disassembly of the components to and from the computer (e.g., quick release). For example, the components may be inserted and removed by a simple pushing or pulling motion, and/or by a simple flick of a latch or handle.

Abstract: The described embodiment relates generally to the field of thermal management. More specifically an apparatus for cooling a unibody computing device with obscured inlet and outlet vents is disclosed. Inlet vents are arranged on a bottom surface of the unibody computing device and then exhaust air is vented out from a rear surface of the computing device. The rear vents can be obscured by a stand designed to support the weight of the computing device. By venting exhaust air to either side of the support stand exhaust air can be prevented from being drawn back into the inlet vents, thereby avoiding an overheating condition.

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract: Quick release couplings for releasably coupling components to the computer are disclosed. The quick release coupling mechanisms are generally configured to allow tool-less placement of the components relative to the computer. That is, the quick release coupling mechanisms are configured to perform their couplings without using conventional fasteners such as screws, bolts, etc. By eliminating use of fasteners, the components may be inserted and removed from the computer without using tools (e.g., tool-less). Furthermore, the quick release couplings are easy to maneuver thereby enabling quick and straightforward assembly and disassembly of the components to and from the computer (e.g., quick release). For example, the components may be inserted and removed by a simple pushing or pulling motion, and/or by a simple flick of a latch or handle.

Abstract: Quick release couplings for releasably coupling components of a computer to the computer are disclosed. The quick release coupling mechanisms are generally configured to allow tool-less placement of the components relative to the computer. That is, the quick release coupling mechanisms are configured to perform their couplings without using conventional fasteners such as screws, bolts, etc. By eliminating the use of fasteners, the components may be inserted and removed from the computer without using tools (e.g., tool-less). Furthermore, the quick release couplings are easy to maneuver thereby enabling quick and straightforward assembly and disassembly of the components to and from the computer (e.g., quick release). For example, the components may be inserted and removed by a simple pushing or pulling motion, and/or by a simple flick of a latch or handle.

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.

Abstract: Embodiments of a heat-transfer mechanism are described. This heat-transfer mechanism includes a first heatpipe having a first end and a second end, and a second heatpipe having a third end and a fourth end. Moreover, a heatpipe coupler is thermally coupled to the second end of the first heatpipe and the third end of the second heatpipe. This heatpipe coupler includes a housing surrounding a cavity and a liquid metal contained within the cavity, thereby providing a thermal path from the first end of the first heatpipe, which is configured to couple to a condenser, to the fourth end of the second heatpipe, which is configured to couple to an evaporator.

Abstract: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.

Abstract: Embodiments of a heat-transfer mechanism are described. This heat-transfer mechanism includes a first heatpipe having a first end and a second end, and a second heatpipe having a third end and a fourth end. Moreover, a heatpipe coupler is thermally coupled to the second end of the first heatpipe and the third end of the second heatpipe. This heatpipe coupler includes a housing surrounding a cavity and a liquid metal contained within the cavity, thereby providing a thermal path from the first end of the first heatpipe, which is configured to couple to a condenser, to the fourth end of the second heatpipe, which is configured to couple to an evaporator.

Abstract: A case (12) for a computer monitor (10) having a tub (16) with a case aperture (38) therein adapted for receiving a subpanel (26). The subpanel (26) has a plurality of electrical connectors 28 which are user accessible thereby. A beveled flange (40) on the subpanel (26) is received within a receiving flange (44) on the case aperture (38). A structural grid (32) within the case (12) has a flexible portion (34) which includes an electronics enclosure (33) having a screw receiving aperture (42) therein such that a screw (30) is passed through a subpanel screw aperture (48) in the subpanel (26) and secured within the screw receiving aperture (42), thereby flexing the flexible portion (34) to hold the subpanel (26) firmly within the case aperture (38).