Abstract: An interferometer system includes a rhomboid assembly having a first optical stack and a second optical stack mounted on the first stack. The first stack includes a first prism having an angled face mounted to an angled face of a second prism. The interface between these angled faces includes a first polarizing beam-splitter. The second stack includes a third prism having an angled face mounted to an angled face of the fourth prism. The interface between these angled faces includes a second polarizing beam-splitter. First, second, third, and fourth wave plate elements are located in beam paths between the rhomboid assembly and at least one of a measurement optic and a reference optic. A redirecting optic is located at least adjacent to the vertical faces of the first and the third prisms.

Abstract: A system and method for acquiring position information of a movable apparatus relevant to a specific axis is disclosed. In one embodiment, an interferometer generates first and second beams and various beam-steering members are located to define beam path segments for the two beams, but no beam path segment varies in length in unity with displacements of the movable apparatus along the specific axis. In another or the same embodiment, each beam path segment in which the first beam either impinges or has been reflected from the movable apparatus is symmetrical to a corresponding beam path segment of the second beam. The movable apparatus may be a wafer stage in which the “specific axis” is the exposure axis of a projection lens, but with all optical members which cooperate with the stage being located beyond the ranges of the wafer stage in directions perpendicular to the lithographic exposure axis.

Abstract: A semiconductor package includes two or more conductors. An inner conductor may provide an attachment point for one or more semiconductor devices at an end of the inner conductor and an electrical connection at an opposite end. An outer conductor may be pressed onto the inner conductor and may be separated by an electrical insulator. A semiconductor device, such as a light emitting diode, may be attached to the inner conductor and to the outer conductor. The package may be, for example, cylindrical or a rectangular solid. The package may incorporate additional semiconductor mounting surfaces and more than two conductors.

Abstract: A light emitting diode array in accordance with the present invention includes a metal substrate, a dielectric layer disposed above the metal substrate, and a plurality of electrically conductive traces disposed on the dielectric layer. A plurality of vias pass through the dielectric layer. The light emitting diode array also includes a plurality of light emitting diodes, each of which is disposed above a corresponding one of said vias and each of which includes a first electrical contact and a second electrical contact electrically coupled to separate ones of the electrically conductive traces. Each of the vias contains a thermally conductive material in thermal contact with the metal substrate and in thermal contact with the corresponding light emitting diode.

Abstract: A concentrically leaded power semiconductor package includes two or more generally concentric conductors. An inner conductor may provide an attachment point for one or more semiconductor devices at an end of the inner conductor and an electrical connection at an opposite end. An outer conductor may be pressed onto the inner conductor and may be separated by an electrical insulator. A semiconductor device, such as a light emitting diode (LED), may be attached to the inner conductor by epoxy gluing or by soldering, and may be attached to the outer conductor by a bonding wire. The package may be cylindrical or a rectangular solid. The package may incorporate additional semiconductor mounting surfaces and more than two conductors.

Abstract: A module comprised of a plurality of light emitting diode ("LED") lamps or other light emitting devices and a metal nesting frame with flexible joints between each row of LED bus bars is described. The flexible joint between the rows of LED bus bars allows the module to be assembled flat, which eases its manufacture. After the LED lamps or other light emitting devices have been mounted on the nesting frame, the flexible joints allow the module to be formed to fit within or on a complex three dimensional space. After forming, the metal nesting frame is still rigid enough to support the finished module in the desired shape.