Patents by Inventor Duen-Jen Cheng

Duen-Jen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6151771
    Abstract: The present invention discloses a method for manufacturing a surface mount resistance-temperature-detector (RTD) on a substrate.
    Type: Grant
    Filed: March 23, 1999
    Date of Patent: November 28, 2000
    Assignee: Cyntec Company
    Inventors: Jackel Tzeng, Roger Hsieh, Duen-Jen Cheng
  • Patent number: 5981393
    Abstract: A method of forming electrode at the end surface of chip array resistors utilizes the vacuum metallization technology such as sputtering evaporating deposition or ion implanting accompanying a metal mask for forming electrode at the end surfaces of chip array resistors. A blank base can be used instead of a punch-through base which has to be used in conventional technology. The method disclosed in the present invention may greatly increase the productivity of the electrodes, and at the same time, the variation of resistance value of the chip array resistor is minimized and the product quality may be improved.
    Type: Grant
    Filed: September 29, 1997
    Date of Patent: November 9, 1999
    Assignee: Cyntec Co., Ltd.
    Inventors: Shih-Chang Liao, Duen-Jen Cheng
  • Patent number: 5958606
    Abstract: The present invention discloses a substrate structure for supporting a thin film with specific temperature coefficient of resistance (TCR) thereon. The substrate structure includes a substrate composed of a borosilicate glass. The substrate further includes an interface layer of LaSiONx covering a top surface of the substrate. The substrate supports the thin film includes a platinum thin film thereon. The substrate structure further includes an adhesion anchoring seam disposed as a bonding seam interfacing the thin film to the substrate for securely attaching the thin film to the substrate therein. The bonding seam is disposed on a boundary edge of the thin film and includes a nickel-chromium alloy anchor seam disposed on the boding seam. In a preferred embodiment, the substrate structure includes a protective layer covering and protecting the substrate structure thereunder.
    Type: Grant
    Filed: February 5, 1997
    Date of Patent: September 28, 1999
    Assignee: Cyntec Company
    Inventors: Chung-Hsiung Wang, Duen-Jen Cheng
  • Patent number: 5896081
    Abstract: The present invention discloses a surface-mount resistance-temperature-detector (RTD) supported on a substrate. The surface-mount RTD includes a resistive strip disposed on a top surface of the substrate having a substantially linear temperature resistance coefficient (TCR) over a predetermined temperature range for measurement. The surface-mount RTD further includes two top terminals disposed on two opposite end on the top surface of the substrate wherein each of the top terminal connected to one end of the resistive strip. The surface-mount RTD further includes two bottom terminals disposed on a bottom surface of the substrate wherein each of the bottom terminals is disposed below one of the top terminals. The surface-mount RTD further includes two edge conductive plates each disposed on an edge surface of the substrate connected to one of the top terminals to a corresponding bottom terminal below.
    Type: Grant
    Filed: June 10, 1997
    Date of Patent: April 20, 1999
    Assignee: Cyntec Company
    Inventors: Jackel Tzeng, Roger Hsieh, Duen-Jen Cheng
  • Patent number: 5850171
    Abstract: The present invention discloses a resistive circuit. The resistive circuit includes a plurality of resistor networks disposed on a substrate. The resistor networks also includes a plurality of resistive circuit elements. The resistor networks further includes a plurality of termination contacts each connected to one of the resistive circuit elements. Each of the termination contacts is disposed on an edge of the substrate and each of the termination contacts is separated from a next termination contact by an edge trench disposed on the edge of the substrate whereby a distance across the edge trench defining a pitch between the termination contacts.
    Type: Grant
    Filed: August 5, 1996
    Date of Patent: December 15, 1998
    Assignee: CYNTEC Company
    Inventors: Barry Lin, Shih Chang Liao, Duen Jen Cheng
  • Patent number: 4987879
    Abstract: An ignition distributor of an automotive vehicle has a magnetic pick-up device mounted in the housing of the ignition distributor and including a magnetoresistor. The magnetoresistor is electrically connected to a primary ignition circuit in the ignition coil, which produces a high voltage when said magnetic pick-up device produces a voltage pulse output signal. A permanent magnetic plate is attached to the magnetoresistor and provides a magnetic field perpendicular to the direction of the current flow through the magnetoresistor. When each of the teeth of an armature rotated with the distributor shaft mounted in the ignition distributor passes the magnetic pick-up device to change temporarily the magnetic field applied to the magnetoresistor, the resistance of the magnetoresistor is correspondingly varied so that said magnetoresistor can produce a voltage pulse by the magnetoresistance effect, and open and close the primary ignition circuit for firing the spark plugs.
    Type: Grant
    Filed: May 4, 1990
    Date of Patent: January 29, 1991
    Assignee: Industrial Technology Research Institute
    Inventors: Guey-Fa Chi, Duen-Jen Cheng, Ying-Cheun Yeh