Patents by Inventor Duk Sang Han

Duk Sang Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9957389
    Abstract: The present disclosure provides: a thermosetting resin composition comprising: (a) bisphenol M-type epoxy resin; (b) bisphenol M-type cyanate ester resin; (c) polyphenylene ether having two or more vinyl groups at both ends of a branched chain, or oligomers thereof; and (d) a cross-linking curing agent, a prepreg comprising the composition, and a printed circuit board. The printed circuit board simultaneously has an excellent low dielectric loss characteristic, a great moisture-absorbing and heat-resistant characteristic, a low thermal expansion characteristic, thermal stability and the like.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: May 1, 2018
    Assignee: DOOSAN CORPORATION
    Inventors: Dong Hee Jung, Duk Sang Han, Jeong Don Kwon, Moo Hyun Kim, Do Woong Hong
  • Publication number: 20160297967
    Abstract: The present disclosure provides: a thermosetting resin composition comprising: (a) bisphenol M-type epoxy resin; (b) bisphenol M-type cyanate ester resin; (c) polyphenylene ether having two or more vinyl groups at both ends of a branched chain, or oligomers thereof; and (d) a cross-linking curing agent, a prepreg comprising the composition, and a printed circuit board. The printed circuit board simultaneously has an excellent low dielectric loss characteristic, a great moisture-absorbing and heat-resistant characteristic, a low thermal expansion characteristic, thermal stability and the like.
    Type: Application
    Filed: November 25, 2014
    Publication date: October 13, 2016
    Applicant: DOOSAN CORPORATION
    Inventors: Dong Hee JUNG, Duk Sang HAN, Jeong Don KWON, Moo Hyun KIM, Do Woong HONG
  • Publication number: 20160150644
    Abstract: The present disclosure relates to a resin composition, which serves as an insulation layer of a laminate for a printed circuit board while exhibiting adhesiveness to a metal base layer, the resin composition including: a rubber-modified epoxy resin; an epoxy resin; an inorganic filler; and a curing agent.
    Type: Application
    Filed: October 2, 2013
    Publication date: May 26, 2016
    Applicant: DOOSAN CORPORATION
    Inventors: Hang Seok LEE, Duk Sang HAN, Yoon Ho JUNG, Dong Bo YANG
  • Publication number: 20090004488
    Abstract: Disclosed is a resin composition for a PCB, the composition including: (a) a polyphenylene ether resin modified via a redistribution reaction of polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene or 9,10-dihydro-9-oxa-10-(dihydroxyaryl)-10-phosphaphenanthrene 10-oxide; (b) a polymer binder; and (c) cyanate ester or a prepolymer of the cyanate ester, wherein, when the polyphenylene ether resin is modified via a redistribution reaction of the polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene, the composition further includes (d) a flame retardant. Also, a composite substrate and a copper laminate using the same are disclosed.
    Type: Application
    Filed: June 26, 2008
    Publication date: January 1, 2009
    Applicant: Doosan Corporation
    Inventors: Kwang Suk PARK, In Wook Kim, Duk Sang Han, Soo Im Jung, Dong Ki Nam
  • Publication number: 20090004484
    Abstract: Disclosed is a resin composition for a PCB, the composition including: (a) a polyphenylene ether resin modified via a redistribution reaction of polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene or 9,10-dihydro-9-oxa-10-(dihydroxyaryl)-10-phosphaphenanthrene 10-oxide; (b) a dicyclopentadiene epoxy resin represented by Formula 1; and (c) an alkylphenol aldehyde novolak curing agent represented by Formula 2, wherein, when the polyphenylene ether resin is modified via a redistribution reaction of the polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene, the composition further includes (d) a brominated epoxy resin. Also, a composite substrate and a copper laminate using the same are disclosed.
    Type: Application
    Filed: June 26, 2008
    Publication date: January 1, 2009
    Applicant: Doosan Corporation
    Inventors: In Wook KIM, Duk Sang Han, Kwang Suk Park, Soo Im Jung, Dong Ki Nam