Patents by Inventor Dwight J. Petruchik
Dwight J. Petruchik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8721042Abstract: An inkjet printhead includes a printhead die including: a first nozzle array that is configured to be fed with ink by a first ink feed; and a second nozzle array that is configured to be fed with ink by a second ink feed; and a mounting substrate including: a surface to which the printhead die is attached; a first layer including a first ink channel having an opening disposed at the surface; a second layer including a second ink channel having an opening disposed at the surface; and a third layer disposed between the first layer and the second layer, wherein the printhead die is attached to the first layer, the second layer and the third layer, and wherein the first ink channel opening is fluidically connected to the first ink feed, and the second ink channel opening is fluidically connected to the second ink feed.Type: GrantFiled: July 27, 2011Date of Patent: May 13, 2014Assignee: Eastman Kodak CompanyInventors: Dwight J. Petruchik, Mario J. Ciminelli
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Patent number: 8496317Abstract: A liquid ejector includes an electrically insulating support having a first surface and a second surface. An electrical trace begins on the first surface of the support and ends on the second surface of the support. An ejector die is positioned on the first surface of the support and electrically connected to the portion of the electrical trace located on the first surface of the support. A polymer material is molded on a portion of the ejector die and at least a portion of the first surface of the support. A portion of the electrical trace remains free of the polymer material.Type: GrantFiled: August 11, 2009Date of Patent: July 30, 2013Assignee: Eastman Kodak CompanyInventors: Mario J. Ciminelli, Eric A. Merz, Dwight J. Petruchik
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Publication number: 20130135367Abstract: A method of controlling a maintenance operation in an inkjet printer, the method includes detecting that ink supply connection to a printhead has been interrupted; detecting that ink supply connection to the printhead has been restored; measuring a time interval between the interruption and the restoration of the ink supply connection to the printhead; and selecting a level of the maintenance operation, depending upon a length of the time interval.Type: ApplicationFiled: November 29, 2011Publication date: May 30, 2013Inventors: Dwight J. Petruchik, Charles Francis Scaglione
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Patent number: 8449082Abstract: The present invention relates to a fluid ejection assembly that includes an injection-molded mounting substrate that is formed by a two-shot injection molding process, wherein a housing portion of the mounting substrate is formed by a first shot molding, and a die-attach portion of the mounting substrate is formed within the housing portion by a second shot molding.Type: GrantFiled: August 7, 2012Date of Patent: May 28, 2013Assignee: Eastman Kodak CompanyInventor: Dwight J. Petruchik
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Patent number: 8430474Abstract: A mounting assembly for a microelectronic device, the mounting assembly includes (a) a first member formed of a first material having a first coefficient of thermal expansion, the first member including i) a mounting surface for the microelectronic device; ii) a wall that adjoins the mounting surface and that is recessed from the mounting surface; and iii) an extension of the mounting surface that extends beyond an end of the wall; and (b) a second member formed of a plastic material having a second coefficient of thermal expansion that is larger than the first coefficient of thermal expansion, wherein a first portion of the second member is attached to the extension.Type: GrantFiled: June 10, 2010Date of Patent: April 30, 2013Assignee: Eastman Kodak CompanyInventors: Mario J. Ciminelli, Dwight J. Petruchik
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Publication number: 20130027466Abstract: An inkjet printhead includes a printhead die including: a first nozzle array that is configured to be fed with ink by a first ink feed; and a second nozzle array that is configured to be fed with ink by a second ink feed; and a mounting substrate including: a surface to which the printhead die is attached; a first layer including a first ink channel having an opening disposed at the surface; a second layer including a second ink channel having an opening disposed at the surface; and a third layer disposed between the first layer and the second layer, wherein the printhead die is attached to the first layer, the second layer and the third layer, and wherein the first ink channel opening is fluidically connected to the first ink feed, and the second ink channel opening is fluidically connected to the second ink feed.Type: ApplicationFiled: July 27, 2011Publication date: January 31, 2013Inventors: Dwight J. Petruchik, Mario J. Ciminelli
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Publication number: 20130025125Abstract: A method of fabricating a mounting substrate for an inkjet printhead, the method includes providing a plurality of layers of unfired ceramic, wherein a first layer and a second layer of the plurality of layers are each patterned to have unfired ceramic in one region and no unfired ceramic in a second region; stacking the plurality of layers in a predetermined order; and firing the stack of layers to make a co-fired ceramic substrate including a first ink channel corresponding to the first layer and a second ink channel corresponding to the second layer.Type: ApplicationFiled: July 27, 2011Publication date: January 31, 2013Inventors: Dwight J. Petruchik, Mario J. Ciminelli
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Publication number: 20120299214Abstract: The present invention relates to a fluid ejection assembly that includes an injection-molded mounting substrate that is formed by a two-shot injection molding process, wherein a housing portion of the mounting substrate is formed by a first shot molding, and a die-attach portion of the mounting substrate is formed within the housing portion by a second shot molding.Type: ApplicationFiled: August 7, 2012Publication date: November 29, 2012Inventor: Dwight J. Petruchik
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Patent number: 8251497Abstract: The present invention relates to a fluid ejection assembly that includes an injection-molded mounting substrate that is formed by a two-shot injection molding process, wherein a housing portion of the mounting substrate is formed by a first shot molding, and a die-attach portion of the mounting substrate is formed within the housing portion by a second shot molding.Type: GrantFiled: December 18, 2008Date of Patent: August 28, 2012Assignee: Eastman Kodak CompanyInventor: Dwight J. Petruchik
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Patent number: 8246141Abstract: A marking assembly includes a substrate and a marking device. The substrate includes a first portion made from a first material including a plurality of alignment features, and a second portion made from a second material affixed to the first portion of the substrate. The marking device is affixed to the second portion of the substrate and aligned to the alignment features of the first portion of the substrate.Type: GrantFiled: December 21, 2006Date of Patent: August 21, 2012Assignee: Eastman Kodak CompanyInventors: Dwight J. Petruchik, Mario J. Ciminelli, James E. Vianco, Eric A. Merz, Steven J. Dietl, Steven L. Moore
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Patent number: 8220903Abstract: An ink tank having a tank housing; an electrical contact on the housing; an ink outlet port disposed on the housing; and at least one projection disposed adjacent the electrical contact on the housing, wherein the projection is configured for engaging a leaf spring of an inkjet printer. The leaf spring exerts an out and away pivoting force on the projection so that an electrical connection destination for the electrical contact is prevented until the ink tank is completely installed.Type: GrantFiled: November 18, 2009Date of Patent: July 17, 2012Assignee: Eastman Kodak CompanyInventors: Dwight J. Petruchik, James J. Haflinger, Arthur K. Wilson
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Patent number: 8220902Abstract: An inkjet printhead that receives one or more detachably mountable ink tanks, the inkjet printhead includes an ink tank holding receptacle that receives the one or more detachably mountable ink tanks between a first and second wall; a spring disposed on the first wall of the printhead to provide a biasing force in a direction that pushes the detachably mountable ink tank away from the first wall of the printhead and which biasing force must be manually overcome in order to properly install the one or more detachably mountable ink tanks in the ink tank holding receptacle of the printhead.Type: GrantFiled: November 18, 2009Date of Patent: July 17, 2012Assignee: Eastman Kodak CompanyInventors: Dwight J. Petruchik, James J. Haflinger, Arthur K. Wilson
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Patent number: 8215751Abstract: An inkjet carriage that receives a print cartridge, the inkjet carriage includes a holding receptacle having a wall, wherein the holding receptacle is configured to receive the print cartridge; and a spring disposed on the wall of the holding receptacle to provide a biasing force in a direction that pushes the print cartridge away from the wall of the inkjet carriage and which biasing force must be manually overcome in order to properly install the print cartridge in the holding receptacle of the inkjet carriage.Type: GrantFiled: November 18, 2009Date of Patent: July 10, 2012Assignee: Eastman Kodak CompanyInventors: Dwight J. Petruchik, James J. Haflinger, Arthur K. Wilson
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Patent number: 8118406Abstract: The present invention relates to a fluid ejection assembly that includes an injection-molded mounting substrate that is formed by a two-shot injection molding process, wherein a housing portion of the mounting substrate is formed by a first shot molding, and a die-attach portion of the mounting substrate is formed within the housing portion by a second shot molding. The die-attach portion is made of a material having a low coefficient of thermal expansion along a direction that is parallel to a fluid passageway in the die attach portion.Type: GrantFiled: October 5, 2009Date of Patent: February 21, 2012Assignee: Eastman Kodak CompanyInventors: Mario J. Ciminelli, James E. Vianco, Sr., Dwight J. Petruchik
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Publication number: 20110304673Abstract: A mounting assembly for a microelectronic device, the mounting assembly includes (a) a first member formed of a first material having a first coefficient of thermal expansion, the first member including i) a mounting surface for the microelectronic device; ii) a wall that adjoins the mounting surface and that is recessed from the mounting surface; and iii) an extension of the mounting surface that extends beyond an end of the wall; and (b) a second member formed of a plastic material having a second coefficient of thermal expansion that is larger than the first coefficient of thermal expansion, wherein a first portion of the second member is attached to the extension.Type: ApplicationFiled: June 10, 2010Publication date: December 15, 2011Inventors: Mario J. Ciminelli, Dwight J. Petruchik
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Patent number: 8052263Abstract: Various embodiments of a printing device fluid reservoir with alignment features and various embodiments of a printing device fluid reservoir chassis with alignment features are disclosed. According to some aspects of these embodiments, the alignment features are grouped together near an ultimate connection point between a fluid reservoir and a chassis to increase design freedom on other regions of the fluid reservoir/chassis. Other aspects of these embodiments include specially designed and located alignment features of a fluid reservoir that engage specially designed and located alignment features of a chassis in sequence throughout the process of inserting the fluid reservoir into the chassis in order to facilitate simple and effective engagement.Type: GrantFiled: June 18, 2010Date of Patent: November 8, 2011Assignee: Eastman Kodak CompanyInventors: R. Winfield Trafton, Steven L. Moore, Dwight J. Petruchik, Diana C. Petranek, Mark D. Perkins
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Publication number: 20110115858Abstract: An inkjet printhead that receives one or more detachably mountable ink tanks, the inkjet printhead includes an ink tank holding receptacle that receives the one or more detachably mountable ink tanks between a first and second wall; a spring disposed on the first wall of the printhead to provide a biasing force in a direction that pushes the detachably mountable ink tank away from the first wall of the printhead and which biasing force must be manually overcome in order to properly install the one or more detachably mountable ink tanks in the ink tank holding receptacle of the printhead.Type: ApplicationFiled: November 18, 2009Publication date: May 19, 2011Inventors: Dwight J. Petruchik, James J. Haflinger, Arthur K. Wilson
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Publication number: 20110115859Abstract: An ink tank having a tank housing; an electrical contact on the housing; an ink outlet port disposed on the housing; and at least one projection disposed adjacent the electrical contact on the housing, wherein the projection is configured for engaging a spring.Type: ApplicationFiled: November 18, 2009Publication date: May 19, 2011Inventors: Dwight J. Petruchik, James J. Haflinger, Arthur K. Wilson
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Publication number: 20110115860Abstract: An inkjet carriage that receives a print cartridge, the inkjet carriage includes a holding receptacle having a wall, wherein the holding receptacle is configured to receive the print cartridge; and a spring disposed on the wall of the holding receptacle to provide a biasing force in a direction that pushes the print cartridge away from the wall of the inkjet carriage and which biasing force must be manually overcome in order to properly install the print cartridge in the holding receptacle of the inkjet carriage.Type: ApplicationFiled: November 18, 2009Publication date: May 19, 2011Inventors: Dwight J. Petruchik, James J. Haflinger, Arthur K. Wilson
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Publication number: 20110080450Abstract: The present invention relates to a fluid ejection assembly that includes an injection-molded mounting substrate that is formed by a two-shot injection molding process, wherein a housing portion of the mounting substrate is formed by a first shot molding, and a die-attach portion of the mounting substrate is formed within the housing portion by a second shot molding. The die-attach portion is made of a material having a low coefficient of thermal expansion along a direction that is parallel to a fluid passageway in the die attach portion.Type: ApplicationFiled: October 5, 2009Publication date: April 7, 2011Inventors: Mario J. Ciminelli, James E. Vianco, SR., Dwight J. Petruchik